Andy Son Le

US Patent:

7167373, Jan 23, 2007

Filed:

Mar 8, 2004

Appl. No.:

10/796540

Inventors:

Phan Hoang - Mission Viejo CA, US
Chinh Nguyen - Irvine CA, US
Frank Hoang - Foothill Ranch CA, US
Andy Le - Garden Grove CA, US

Assignee:

Virtium Technology, Inc. - Rancho Santa Margarita CA

International Classification:

H05K 7/06

US Classification:

361749, 361803, 174254, 257686, 29840, 438109

Abstract:

One embodiment of the invention includes a flexible circuit and a stiffener. The flexible circuit has first, second, and third portions. The first portion is folded on an upper surface of the third portion and has first contact elements attached to a first device. The second portion is folded on the first device and has second contact elements attached to a second device. The stiffener is attached to the upper surface of the third portion and located between the upper surface of the third portion and the first portion.

US Patent:

20030079909, May 1, 2003

Filed:

Nov 1, 2001

Appl. No.:

10/032908

Inventors:

Chinh Nguyen - Irvine CA, US
Phu Hoang - Foothill Ranch CA, US
Phan Hoang - Mission Viejo CA, US
Andy Le - Garden Grove CA, US

International Classification:

H01L023/488

US Classification:

174/260000, 257/737000, 257/779000, 029/840000, 228/180210

Abstract:

In one embodiment of the invention, a stacking element includes a printed circuit board (PCB) and a plurality of solder bumps. The PCB has a top side and a bottom side. The top side is attached to first pins of a first device. The plurality of solder bumps are on the bottom side and attached to upper areas of second pins of a second device to provide electrical connections between the first pins and the second pins.

US Patent:

20030164247, Sep 4, 2003

Filed:

Apr 1, 2003

Appl. No.:

10/404266

Inventors:

Chinh Nguyen - Irvine CA, US
Phu Hoang - Foothill Ranch CA, US
Phan Hoang - Mission Viejo CA, US
Andy Le - Garden Grove CA, US

International Classification:

H05K001/16

US Classification:

174/260000

Abstract:

In one embodiment of the invention, a stacking element includes a printed circuit board (PCB) and a plurality of solder bumps. The PCB has a top side and a bottom side. The top side is attached to first pins of a first device. The plurality of solder bumps are on the bottom side and attached to upper areas of second pins of a second device to provide electrical connections between the first pins and the second pins.

US Patent:

20200079663, Mar 12, 2020

Filed:

Nov 16, 2019

Appl. No.:

16/686133

Inventors:

- Cerritos CA, US
Andy Le - Cerritos CA, US

International Classification:

C02F 1/32
B23P 19/04

Abstract:

A method for utilizing an attachment assembly for supporting a quartz sleeve to prevent vibration, comprising at least one vibration resistant member, a collar attachment member and a support plate. The vibration resistant member is adaptable to hold and support the quartz sleeve positioned inside an ultraviolet (UV) cylinder. The collar attachment member is configured to enclose the vibration resistant member. The support plate is configured to attach the collar attachment member containing the vibration resistant member with the UV cylinder. The attachment assembly can be attached to the UV cylinder wall directly or can be attached to a mounting device inside the UV cylinder wall.

US Patent:

20190276335, Sep 12, 2019

Filed:

Mar 6, 2018

Appl. No.:

15/913814

Inventors:

- Cerritos CA, US
Andy Le - Cerritos CA, US

International Classification:

C02F 1/32
B23P 19/04

Abstract:

A method and an attachment assembly for supporting a quartz sleeve, comprises at least one vibration resistant member, a collar attachment member and a support plate. The at least one vibration resistant member is adaptable to hold and support the quartz sleeve positioned inside an ultraviolet (UV) cylinder and thereby to prevent its vibration. The collar attachment member is configured to enclose the at least one vibration resistant member. The at least one vibration resistant member is positioned inside the collar attachment member. The support plate is configured to attach the collar attachment member containing the at least one vibration resistant member with the UV cylinder. The attachment assembly can be attached to the UV cylinder wall directly or can be attached to a mounting device inside the UV cylinder wall.

US Patent:

20170098565, Apr 6, 2017

Filed:

Oct 5, 2015

Appl. No.:

14/875673

Inventors:

- Santa Clara CA, US
Lin ZHANG - San Jose CA, US
Andy LE - San Jose CA, US

International Classification:

H01L 21/67
H01J 37/32
G05B 19/418
C23C 16/52

Abstract:

Embodiments of the present disclosure provide methodology to match and calibrate processing chamber performance in a processing chamber. In one embodiment, a method for calibrating a processing chamber for semiconductor manufacturing process includes performing a first predetermined process in a processing chamber, collecting a first set of signals transmitted from a first group of sensors disposed in the processing chamber to a controller while performing the predetermined process, analyzing the collected first set of signals, comparing the collected first set of signals with database stored in the controller to check sensor responses from the first group of sensors, calibrating sensors based on the collected first set of signals when a mismatch sensor response is found, subsequently performing a first series of processes in the processing chamber, and collecting a second set of signals transmitted from the sensors to the controller while performing the series of processes.