Anthony Plepys - Austin TX, US Paul Harvey - Austin TX, US
Assignee:
3M Innovative Properties Company
International Classification:
H01L023/48 H01L023/52 H01L029/40
US Classification:
257/738000, 257/778000
Abstract:
A low-cost integrated circuit package is provided for packaging integrated circuits. In preferred embodiments, the package comprises a flexible circuit that is laminated to a stiffener using a dielectric adhesive, with the conductive traces on the flexible circuit facing toward the stiffener but separated therefrom by the adhesive. The conductive traces include an array of flip-chip attachment pads. A window is formed in the stiffener over the attachment pad array, such as by etching. The adhesive is then removed over the attachment pads by laser ablation, but left in place between the pads, thus forming a flip-chip attachment site. In preferred embodiments, this invention eliminates the need for high-resolution patterned adhesive, and it also eliminates the need for application of a solder mask at the flip-chip attachment site, because the remaining adhesive performs the solder mask function of preventing bridging between attachment pads. This package provides a die attachment site having a high degree of planarity due to tensile stresses formed in the flexible circuit and adhesive layers during lamination of those layers to the stiffener. Embodiments of this invention may be used with TBGA, frangible lead, and other packaging technologies.
Chad Byrd - Austin TX, US William Dower - Austin TX, US Anthony Plepys - Austin TX, US
Assignee:
3M Innovative Properties Company
International Classification:
G02B006/20 G02B006/22
US Classification:
385/128000
Abstract:
A filament guide comprises a support tube having an internal wall defining an axial channel to receive a length of a filament. The axial channel provides containment for a filament closure, surrounding at least a portion of the filament and in contact with at least a portion of the internal wall. The filament closure includes a portion of frozen fluid, such as water that provides an ice bearing including an orifice to allow movement of the length of the filament through the filament closure. Suitable filaments include non-conducting filaments especially optical fibers.
Pressure Sensitive Adhesives Containing A Cyclic Phosphonate Ester Flame Retardant
Joern Buettner - Neuss, DE Eumi Pyun - Austin TX, US Anthony R. Plepys - Austin TX, US Lisa S. Lim - Sandy UT, US Francois C. D'Haese - Antwerp, BE Tobias Pick - Korschenbroich, DE
Assignee:
3M Innovative Properties Company - St. Paul MN
International Classification:
C09J 133/06 B32B 7/12 C09J 7/02
US Classification:
4283173, 524108, 428355 AC, 428354
Abstract:
Pressure sensitive adhesives containing a cyclic phosphonate ester are described. Methods of preparing such adhesives and articles comprising such adhesives are also described.
Solventless Compounding And Coating Of Non-Thermoplastic Hydrocarbon Elastomers
Timothy D. Bredahl - Cottage Grove MN Harold Leverty - Stillwater MN Robert L. Smith - New Brighton MN Richard E. Bennett - Hudson WI David J. Yarusso - Shoreview MN Daniel C. Munson - St. Paul MN Anthony R. Plepys - Austin TX
Assignee:
Minnesota Mining and Manufacturing Company - St. Paul MN
International Classification:
C08K 300 C08L 2300 B32B 712 B32B 326
US Classification:
523348
Abstract:
A solvent-free hot melt process, for preparing a non-thermosettable, pressure-sensitive adhesive from a tackified non-thermoplastic hydrocarbon elastomer. The process employs a continuous compounding device that has a sequence of alternating conveying and processing zones. The processing zones masticate and mix materials in them. Non-thermoplastic elastomers having high molecular weight may be readily compounded into adhesives in the process.
Solventless Compounding And Coating Of Non-Thermoplastic Hydrocarbon Elastomers
Timothy D. Bredahl - Cottage Grove MN Harold W. Leverty - Stillwater MN Robert L. Smith - New Brighton MN Richard E. Bennett - Hudson WI David J. Yarusso - Shoreview MN Daniel C. Munson - St. Paul MN Anthony R. Plepys - Austin TX
Assignee:
Minnesota Mining and Manufacturing Company - St. Paul MN
International Classification:
C08L 2300 C08J 320
US Classification:
525270
Abstract:
A solvent-free hot melt process, for preparing a non-thermosettable, pressure-sensitive adhesive from a tackified non-thermoplastic hydrocarbon elastomer. The process employs a continuous compounding device that has a sequence of alternating conveying and processing zones. The processing zones masticate and mix materials in them. Non-thermoplastic elastomers having high molecular weight may be readily compounded into adhesives in the process.
Multi-Layer Interconnect Sutructure For Ball Grid Arrays
Randolph Dennis Schueller - Austin TX John David Geissinger - Austin TX Anthony Raymond Plepys - Austin TX Howard Edwin Evans - Austin TX
Assignee:
Minnesota Mining and Manufacturing Company - St. Paul MN
International Classification:
H01L 2302
US Classification:
174 524
Abstract:
A ball grid array (BGA) package is provided in which the stiffener of the BGA may also be utilized as a conductive layer. A TAB tape is adhered to the stiffener by an adhesive and both the TAB tape and the adhesive may have vias which open to the stiffener. Conductive plugs which may be formed of solder paste, conductive adhesives, or the like may then be filled in the vias to provide electrical connection from the TAB tape to the stiffener. The vias may be located adjacent to solder ball locations. The TAB tape may include multiple conductor layers or multiple layers of single conductive layer TAB tape may be stacked upon each other to provide additional circuit routing. Further, the TAB tape layers may also be combined with the use of metal foil layers.
Anthony R. Plepys - Austin TX Paul M. Harvey - Austin TX
Assignee:
3M Innovative Properties Co. - St. Paul MN
International Classification:
H01L 2940
US Classification:
257778
Abstract:
A low-cost integrated circuit package is provided for packaging integrated circuits. In preferred embodiments, the package comprises a flexible circuit that is laminated to a stiffener using a dielectric adhesive, with the conductive traces on the flexible circuit facing toward the stiffener but separated therefrom by the adhesive. The conductive traces include an array of flip-chip attachment pads. A window is formed in the stiffener over the attachment pad array, such as by etching. The adhesive is then removed over the attachment pads by laser ablation, but left in place between the pads, thus forming a flip-chip attachment site. In preferred embodiments, this invention eliminates the need for high-resolution patterned adhesive, and it also eliminates the need for application of a solder mask at the flip-chip attachment site, because the remaining adhesive performs the solder mask function of preventing bridging between attachment pads. This package provides a die attachment site having a high degree of planarity due to tensile stresses formed in the flexible circuit and adhesive layers during lamination of those layers to the stiffener. Embodiments of this invention may be used with TBGA, frangible lead, and other packaging technologies.
Randolph D. Schueller - Austin TX Anthony R. Plepys - Austin TX Howard E. Evans - Austin TX
Assignee:
Minnesota Mining and Manufacturing Company - St. Paul MN
International Classification:
H05K 102
US Classification:
174260
Abstract:
A tape ball grid array package reverses the usual attachment of flexible circuitry to a stiffener so that the circuit traces face the stiffener rather than away from the stiffener as is conventional. This construction allows the elimination of a previously necessary solder mask and so reduces the cost to produce the package.
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