Anthony R Plepys

US Patent:

20010052647, Dec 20, 2001

Filed:

Jul 2, 2001

Appl. No.:

09/897182

Inventors:

Anthony Plepys - Austin TX, US
Paul Harvey - Austin TX, US

Assignee:

3M Innovative Properties Company

International Classification:

H01L023/48
H01L023/52
H01L029/40

US Classification:

257/738000, 257/778000

Abstract:

A low-cost integrated circuit package is provided for packaging integrated circuits. In preferred embodiments, the package comprises a flexible circuit that is laminated to a stiffener using a dielectric adhesive, with the conductive traces on the flexible circuit facing toward the stiffener but separated therefrom by the adhesive. The conductive traces include an array of flip-chip attachment pads. A window is formed in the stiffener over the attachment pad array, such as by etching. The adhesive is then removed over the attachment pads by laser ablation, but left in place between the pads, thus forming a flip-chip attachment site. In preferred embodiments, this invention eliminates the need for high-resolution patterned adhesive, and it also eliminates the need for application of a solder mask at the flip-chip attachment site, because the remaining adhesive performs the solder mask function of preventing bridging between attachment pads. This package provides a die attachment site having a high degree of planarity due to tensile stresses formed in the flexible circuit and adhesive layers during lamination of those layers to the stiffener. Embodiments of this invention may be used with TBGA, frangible lead, and other packaging technologies.

US Patent:

20040146262, Jul 29, 2004

Filed:

Jan 23, 2003

Appl. No.:

10/349843

Inventors:

Chad Byrd - Austin TX, US
William Dower - Austin TX, US
Anthony Plepys - Austin TX, US

Assignee:

3M Innovative Properties Company

International Classification:

G02B006/20
G02B006/22

US Classification:

385/128000

Abstract:

A filament guide comprises a support tube having an internal wall defining an axial channel to receive a length of a filament. The axial channel provides containment for a filament closure, surrounding at least a portion of the filament and in contact with at least a portion of the internal wall. The filament closure includes a portion of frozen fluid, such as water that provides an ice bearing including an orifice to allow movement of the length of the filament through the filament closure. Suitable filaments include non-conducting filaments especially optical fibers.

US Patent:

20130236718, Sep 12, 2013

Filed:

Mar 11, 2011

Appl. No.:

13/882555

Inventors:

Joern Buettner - Neuss, DE
Eumi Pyun - Austin TX, US
Anthony R. Plepys - Austin TX, US
Lisa S. Lim - Sandy UT, US
Francois C. D'Haese - Antwerp, BE
Tobias Pick - Korschenbroich, DE

Assignee:

3M Innovative Properties Company - St. Paul MN

International Classification:

C09J 133/06
B32B 7/12
C09J 7/02

US Classification:

4283173, 524108, 428355 AC, 428354

Abstract:

Pressure sensitive adhesives containing a cyclic phosphonate ester are described. Methods of preparing such adhesives and articles comprising such adhesives are also described.

US Patent:

55501753, Aug 27, 1996

Filed:

May 5, 1995

Appl. No.:

8/435980

Inventors:

Timothy D. Bredahl - Cottage Grove MN
Harold Leverty - Stillwater MN
Robert L. Smith - New Brighton MN
Richard E. Bennett - Hudson WI
David J. Yarusso - Shoreview MN
Daniel C. Munson - St. Paul MN
Anthony R. Plepys - Austin TX

Assignee:

Minnesota Mining and Manufacturing Company - St. Paul MN

International Classification:

C08K 300
C08L 2300
B32B 712
B32B 326

US Classification:

523348

Abstract:

A solvent-free hot melt process, for preparing a non-thermosettable, pressure-sensitive adhesive from a tackified non-thermoplastic hydrocarbon elastomer. The process employs a continuous compounding device that has a sequence of alternating conveying and processing zones. The processing zones masticate and mix materials in them. Non-thermoplastic elastomers having high molecular weight may be readily compounded into adhesives in the process.

US Patent:

55390331, Jul 23, 1996

Filed:

Mar 21, 1994

Appl. No.:

8/215212

Inventors:

Timothy D. Bredahl - Cottage Grove MN
Harold W. Leverty - Stillwater MN
Robert L. Smith - New Brighton MN
Richard E. Bennett - Hudson WI
David J. Yarusso - Shoreview MN
Daniel C. Munson - St. Paul MN
Anthony R. Plepys - Austin TX

Assignee:

Minnesota Mining and Manufacturing Company - St. Paul MN

International Classification:

C08L 2300
C08J 320

US Classification:

525270

Abstract:

A solvent-free hot melt process, for preparing a non-thermosettable, pressure-sensitive adhesive from a tackified non-thermoplastic hydrocarbon elastomer. The process employs a continuous compounding device that has a sequence of alternating conveying and processing zones. The processing zones masticate and mix materials in them. Non-thermoplastic elastomers having high molecular weight may be readily compounded into adhesives in the process.

US Patent:

58441689, Dec 1, 1998

Filed:

Dec 2, 1996

Appl. No.:

8/760531

Inventors:

Randolph Dennis Schueller - Austin TX
John David Geissinger - Austin TX
Anthony Raymond Plepys - Austin TX
Howard Edwin Evans - Austin TX

Assignee:

Minnesota Mining and Manufacturing Company - St. Paul MN

International Classification:

H01L 2302

US Classification:

174 524

Abstract:

A ball grid array (BGA) package is provided in which the stiffener of the BGA may also be utilized as a conductive layer. A TAB tape is adhered to the stiffener by an adhesive and both the TAB tape and the adhesive may have vias which open to the stiffener. Conductive plugs which may be formed of solder paste, conductive adhesives, or the like may then be filled in the vias to provide electrical connection from the TAB tape to the stiffener. The vias may be located adjacent to solder ball locations. The TAB tape may include multiple conductor layers or multiple layers of single conductive layer TAB tape may be stacked upon each other to provide additional circuit routing. Further, the TAB tape layers may also be combined with the use of metal foil layers.

US Patent:

61407070, Oct 31, 2000

Filed:

May 7, 1998

Appl. No.:

9/074126

Inventors:

Anthony R. Plepys - Austin TX
Paul M. Harvey - Austin TX

Assignee:

3M Innovative Properties Co. - St. Paul MN

International Classification:

H01L 2940

US Classification:

257778

Abstract:

A low-cost integrated circuit package is provided for packaging integrated circuits. In preferred embodiments, the package comprises a flexible circuit that is laminated to a stiffener using a dielectric adhesive, with the conductive traces on the flexible circuit facing toward the stiffener but separated therefrom by the adhesive. The conductive traces include an array of flip-chip attachment pads. A window is formed in the stiffener over the attachment pad array, such as by etching. The adhesive is then removed over the attachment pads by laser ablation, but left in place between the pads, thus forming a flip-chip attachment site. In preferred embodiments, this invention eliminates the need for high-resolution patterned adhesive, and it also eliminates the need for application of a solder mask at the flip-chip attachment site, because the remaining adhesive performs the solder mask function of preventing bridging between attachment pads. This package provides a die attachment site having a high degree of planarity due to tensile stresses formed in the flexible circuit and adhesive layers during lamination of those layers to the stiffener. Embodiments of this invention may be used with TBGA, frangible lead, and other packaging technologies.

US Patent:

56635303, Sep 2, 1997

Filed:

Aug 1, 1995

Appl. No.:

8/509779

Inventors:

Randolph D. Schueller - Austin TX
Anthony R. Plepys - Austin TX
Howard E. Evans - Austin TX

Assignee:

Minnesota Mining and Manufacturing Company - St. Paul MN

International Classification:

H05K 102

US Classification:

174260

Abstract:

A tape ball grid array package reverses the usual attachment of flexible circuitry to a stiffener so that the circuit traces face the stiffener rather than away from the stiffener as is conventional. This construction allows the elimination of a previously necessary solder mask and so reduces the cost to produce the package.