Anthony R Plepys

age ~60

from Concord, MA

Also known as:
  • Anthony Raymond Plepys

Anthony Plepys Phones & Addresses

  • Concord, MA
  • Chelmsford, MA
  • Saint Paul, MN
  • 6313 Maury Holw, Austin, TX 78750 • 5126199883
  • Amherst, MA
  • Travis, TX
  • Reading, PA
  • 6313 Maury Holw, Austin, TX 78750

Work

  • Position:
    Professional/Technical

Education

  • Degree:
    Associate degree or higher

Emails

Us Patents

  • Laminated Integrated Circuit Package

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  • US Patent:
    20010052647, Dec 20, 2001
  • Filed:
    Jul 2, 2001
  • Appl. No.:
    09/897182
  • Inventors:
    Anthony Plepys - Austin TX, US
    Paul Harvey - Austin TX, US
  • Assignee:
    3M Innovative Properties Company
  • International Classification:
    H01L023/48
    H01L023/52
    H01L029/40
  • US Classification:
    257/738000, 257/778000
  • Abstract:
    A low-cost integrated circuit package is provided for packaging integrated circuits. In preferred embodiments, the package comprises a flexible circuit that is laminated to a stiffener using a dielectric adhesive, with the conductive traces on the flexible circuit facing toward the stiffener but separated therefrom by the adhesive. The conductive traces include an array of flip-chip attachment pads. A window is formed in the stiffener over the attachment pad array, such as by etching. The adhesive is then removed over the attachment pads by laser ablation, but left in place between the pads, thus forming a flip-chip attachment site. In preferred embodiments, this invention eliminates the need for high-resolution patterned adhesive, and it also eliminates the need for application of a solder mask at the flip-chip attachment site, because the remaining adhesive performs the solder mask function of preventing bridging between attachment pads. This package provides a die attachment site having a high degree of planarity due to tensile stresses formed in the flexible circuit and adhesive layers during lamination of those layers to the stiffener. Embodiments of this invention may be used with TBGA, frangible lead, and other packaging technologies.
  • Frozen-Fluid Fiber Guide

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  • US Patent:
    20040146262, Jul 29, 2004
  • Filed:
    Jan 23, 2003
  • Appl. No.:
    10/349843
  • Inventors:
    Chad Byrd - Austin TX, US
    William Dower - Austin TX, US
    Anthony Plepys - Austin TX, US
  • Assignee:
    3M Innovative Properties Company
  • International Classification:
    G02B006/20
    G02B006/22
  • US Classification:
    385/128000
  • Abstract:
    A filament guide comprises a support tube having an internal wall defining an axial channel to receive a length of a filament. The axial channel provides containment for a filament closure, surrounding at least a portion of the filament and in contact with at least a portion of the internal wall. The filament closure includes a portion of frozen fluid, such as water that provides an ice bearing including an orifice to allow movement of the length of the filament through the filament closure. Suitable filaments include non-conducting filaments especially optical fibers.
  • Pressure Sensitive Adhesives Containing A Cyclic Phosphonate Ester Flame Retardant

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  • US Patent:
    20130236718, Sep 12, 2013
  • Filed:
    Mar 11, 2011
  • Appl. No.:
    13/882555
  • Inventors:
    Joern Buettner - Neuss, DE
    Eumi Pyun - Austin TX, US
    Anthony R. Plepys - Austin TX, US
    Lisa S. Lim - Sandy UT, US
    Francois C. D'Haese - Antwerp, BE
    Tobias Pick - Korschenbroich, DE
  • Assignee:
    3M Innovative Properties Company - St. Paul MN
  • International Classification:
    C09J 133/06
    B32B 7/12
    C09J 7/02
  • US Classification:
    4283173, 524108, 428355 AC, 428354
  • Abstract:
    Pressure sensitive adhesives containing a cyclic phosphonate ester are described. Methods of preparing such adhesives and articles comprising such adhesives are also described.
  • Solventless Compounding And Coating Of Non-Thermoplastic Hydrocarbon Elastomers

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  • US Patent:
    55501753, Aug 27, 1996
  • Filed:
    May 5, 1995
  • Appl. No.:
    8/435980
  • Inventors:
    Timothy D. Bredahl - Cottage Grove MN
    Harold Leverty - Stillwater MN
    Robert L. Smith - New Brighton MN
    Richard E. Bennett - Hudson WI
    David J. Yarusso - Shoreview MN
    Daniel C. Munson - St. Paul MN
    Anthony R. Plepys - Austin TX
  • Assignee:
    Minnesota Mining and Manufacturing Company - St. Paul MN
  • International Classification:
    C08K 300
    C08L 2300
    B32B 712
    B32B 326
  • US Classification:
    523348
  • Abstract:
    A solvent-free hot melt process, for preparing a non-thermosettable, pressure-sensitive adhesive from a tackified non-thermoplastic hydrocarbon elastomer. The process employs a continuous compounding device that has a sequence of alternating conveying and processing zones. The processing zones masticate and mix materials in them. Non-thermoplastic elastomers having high molecular weight may be readily compounded into adhesives in the process.
  • Solventless Compounding And Coating Of Non-Thermoplastic Hydrocarbon Elastomers

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  • US Patent:
    55390331, Jul 23, 1996
  • Filed:
    Mar 21, 1994
  • Appl. No.:
    8/215212
  • Inventors:
    Timothy D. Bredahl - Cottage Grove MN
    Harold W. Leverty - Stillwater MN
    Robert L. Smith - New Brighton MN
    Richard E. Bennett - Hudson WI
    David J. Yarusso - Shoreview MN
    Daniel C. Munson - St. Paul MN
    Anthony R. Plepys - Austin TX
  • Assignee:
    Minnesota Mining and Manufacturing Company - St. Paul MN
  • International Classification:
    C08L 2300
    C08J 320
  • US Classification:
    525270
  • Abstract:
    A solvent-free hot melt process, for preparing a non-thermosettable, pressure-sensitive adhesive from a tackified non-thermoplastic hydrocarbon elastomer. The process employs a continuous compounding device that has a sequence of alternating conveying and processing zones. The processing zones masticate and mix materials in them. Non-thermoplastic elastomers having high molecular weight may be readily compounded into adhesives in the process.
  • Multi-Layer Interconnect Sutructure For Ball Grid Arrays

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  • US Patent:
    58441689, Dec 1, 1998
  • Filed:
    Dec 2, 1996
  • Appl. No.:
    8/760531
  • Inventors:
    Randolph Dennis Schueller - Austin TX
    John David Geissinger - Austin TX
    Anthony Raymond Plepys - Austin TX
    Howard Edwin Evans - Austin TX
  • Assignee:
    Minnesota Mining and Manufacturing Company - St. Paul MN
  • International Classification:
    H01L 2302
  • US Classification:
    174 524
  • Abstract:
    A ball grid array (BGA) package is provided in which the stiffener of the BGA may also be utilized as a conductive layer. A TAB tape is adhered to the stiffener by an adhesive and both the TAB tape and the adhesive may have vias which open to the stiffener. Conductive plugs which may be formed of solder paste, conductive adhesives, or the like may then be filled in the vias to provide electrical connection from the TAB tape to the stiffener. The vias may be located adjacent to solder ball locations. The TAB tape may include multiple conductor layers or multiple layers of single conductive layer TAB tape may be stacked upon each other to provide additional circuit routing. Further, the TAB tape layers may also be combined with the use of metal foil layers.
  • Laminated Integrated Circuit Package

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  • US Patent:
    61407070, Oct 31, 2000
  • Filed:
    May 7, 1998
  • Appl. No.:
    9/074126
  • Inventors:
    Anthony R. Plepys - Austin TX
    Paul M. Harvey - Austin TX
  • Assignee:
    3M Innovative Properties Co. - St. Paul MN
  • International Classification:
    H01L 2940
  • US Classification:
    257778
  • Abstract:
    A low-cost integrated circuit package is provided for packaging integrated circuits. In preferred embodiments, the package comprises a flexible circuit that is laminated to a stiffener using a dielectric adhesive, with the conductive traces on the flexible circuit facing toward the stiffener but separated therefrom by the adhesive. The conductive traces include an array of flip-chip attachment pads. A window is formed in the stiffener over the attachment pad array, such as by etching. The adhesive is then removed over the attachment pads by laser ablation, but left in place between the pads, thus forming a flip-chip attachment site. In preferred embodiments, this invention eliminates the need for high-resolution patterned adhesive, and it also eliminates the need for application of a solder mask at the flip-chip attachment site, because the remaining adhesive performs the solder mask function of preventing bridging between attachment pads. This package provides a die attachment site having a high degree of planarity due to tensile stresses formed in the flexible circuit and adhesive layers during lamination of those layers to the stiffener. Embodiments of this invention may be used with TBGA, frangible lead, and other packaging technologies.
  • Wire Bond Tape Ball Grid Array Package

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  • US Patent:
    56635303, Sep 2, 1997
  • Filed:
    Aug 1, 1995
  • Appl. No.:
    8/509779
  • Inventors:
    Randolph D. Schueller - Austin TX
    Anthony R. Plepys - Austin TX
    Howard E. Evans - Austin TX
  • Assignee:
    Minnesota Mining and Manufacturing Company - St. Paul MN
  • International Classification:
    H05K 102
  • US Classification:
    174260
  • Abstract:
    A tape ball grid array package reverses the usual attachment of flexible circuitry to a stiffener so that the circuit traces face the stiffener rather than away from the stiffener as is conventional. This construction allows the elimination of a previously necessary solder mask and so reduces the cost to produce the package.

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Mylife

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Dalia Plepys Newark DE

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