Austin P Andrews

US Patent:

45757623, Mar 11, 1986

Filed:

Sep 12, 1983

Appl. No.:

6/531107

Inventors:

Austin M. Andrews - Brea CA
Edwin E. Barrowcliff - El Toro CA

Assignee:

Rockwell International Corporation - El Segundo CA

International Classification:

H04N 530
H01L 3100

US Classification:

358209

Abstract:

Disclosed is an integrated processor assembly and a method for making that assembly, including the steps of providing a semiconducting substrate, fabricating integrated processing circuitry in the substrate, depositing a plurality of input strip lines from a first edge of the substrate to the circuitry, depositing a plurality of output leads from the circuitry to a second edge of the substrate, repeating these steps for a plurality of substrates, and bonding the substrates together so that the terminated input strip lines define a two dimensional array of contact points.