Bao Gia Le

Address:

407 Lisabeth Cmn, Santa Ana, CA 92703

VIN:

1N4BA41E48C809282

Make:

NISSAN

Model:

MAXIMA

Year:

2008

US Patent:

6351373, Feb 26, 2002

Filed:

May 2, 2000

Appl. No.:

09/563249

Inventors:

Bao G. Le - Orange CA
Derek T. Nguyen - Foothill Ranch CA

Assignee:

Gateway, Inc. - North Sioux City SD

International Classification:

G06F 116

US Classification:

361683, 361681, 361682, 361686, 16334, 16335, 16340, 16341, 16342, 16325, 16327, 248183, 248917, 248923, 403119, 403120, 403121, 403146

Abstract:

A hinge engages a cam such that the hinge first rotates relative to the cam, then linearly engages the cam. Preferably, the hinge includes a guiding post that rides along a raised arched surface on the cam during the rotary motion of the hinge. Linear motion between the hinge and the cam preferably begins when the guiding post rides off the end of the arched surface. The rotary motion of the hinge is constrained by one or more engagement assemblies. In a preferred embodiment, one or more cams are mounted on a receiving structure and one or more hinges are mounted in corresponding locations on a detaching structure, where said detaching structure is physically separable from the receiving structure. Engagement between the one or more cams and the one or more corresponding hinges allows the detaching structure to first rotate relative to, then linearly engage, the receiving structure, providing for reliable blind mating between connectors on the detaching structure and connectors on the receiving structure.

US Patent:

6449840, Sep 17, 2002

Filed:

Sep 29, 1998

Appl. No.:

09/163137

Inventors:

Bao Le - Santa Ana CA
Chris M. Schreiber - Lake Elsinore CA

Assignee:

Delphi Technologies, Inc. - Troy MI

International Classification:

H01R 4300

US Classification:

29852, 29825, 29829, 29830, 29840, 29846, 29847, 228165

Abstract:

A method for providing C4-type bumps which are higher than conventional C4 bumps. A dielectric substrate is copper cladded on both sides. At each prospective bump location, a via is laser ablated through the cladded substrate. A copper core is deposited within the vias to thereby connect the two claddings. A photoresist is applied to both claddings, a photomask having a predetermined exposure pattern is placed over the claddings, the photoresist is exposed to ultraviolet (UV) light to thereby polymerize in the exposed areas thereof, and the resulting photoresist image is developed by use of a developer solution to wash away of the unpolymerized areas of the photoresist. Now, the photoresist image provides a retainer wall spaced from, and circumferentially around, the vias. Next, a lead-tin solder alloy is electroplated, such as by a lead-tin fluoroborate bath, at the vias into the volumes defined by the retainer wall at each end of the vias. Now, the photoresist is stripped, such as by an alkali stripper, from the cladding, leaving behind a pair of solder deposits at each via.

US Patent:

6467858, Oct 22, 2002

Filed:

Dec 23, 1999

Appl. No.:

09/471737

Inventors:

Bao G. Le - Orange CA
Derek T. Nguyen - Foothill Ranch CA
Lisa Luong - Trabuco Canyon CA

Assignee:

Gateway, Inc. - N. Sioux City SD

International Classification:

A47B 8100

US Classification:

3122232, 312333

Abstract:

A spring-loaded disk drive retention tray comprises a first and a second plate moveably engaged to each other. The plates are kept in a closed position relative to each other via tension from a spring. A hard disk drive housing can be inserted into a first edge of the tray, and pressure to insert a second edge results in the opening of the first and second plate relative to each other such that the disk drive housing can be fully inserted into the retention tray. Once fully inserted, the two plates return to their closed position, and posts integral to the retention tray mechanically lock the hard disk drive housing to the retention tray via insertion of the posts into screw holes located on the hard disk drive housing. The disk drive assembly comprising the disk drive housing and the retention tray can then be inserted into receiving rails in a computer system chassis, and locked into place via mechanical abutments. The disk drive assembly can be removed from the computer system chassis be manually overriding the mechanical abutments, and the disk drive housing can be removed from the retention tray by manually separating the two plates into the open position.

US Patent:

6617510, Sep 9, 2003

Filed:

Sep 18, 2001

Appl. No.:

09/955215

Inventors:

Chris M. Schreiber - Lake Elsinore CA
Bao Le - Santa Ana CA
Eric Dean Jensen - Irvine CA

Assignee:

Delphi Technologies, Inc. - Troy MI

International Classification:

H05K 506

US Classification:

174 522, 174251, 174254, 174260, 174261, 361773, 361776, 257669, 257674

Abstract:

A metallic or an electrical trace having a terminus and a stress relief bend formed in the trace adjacent the terminus. The electrical trace may have a portion carried by a flexible substrate to form a flexible circuit. The stress relief bend may be free floating and extend from the flexible substrate or may be encapsulated by the flexible substrate. The electrical circuit and the flexible circuit each have a generally planar portion extending in the X and Y axis, with the stress relief bend projecting into the Z axis. This allows electrical traces to be spaced with a very narrow pitch because the stress relief bend does not consume any valuable real estate on the flexible circuit or the substrate to which the electrical trace is applied.

US Patent:

6671180, Dec 30, 2003

Filed:

Oct 22, 2001

Appl. No.:

10/028229

Inventors:

Bao Gia Le - Orange CA
Derek Nguyen - San Clemente CA
David R. Davis - Jefferson SD
Allan L. Klink - Sioux City IA

Assignee:

Gateway, Inc. - Poway CA

International Classification:

H05K 716

US Classification:

361726

Abstract:

The present invention is directed to a device retention apparatus. A method of retaining an electronic device in a housing may include engaging a first device side of an information handling system device against a first housing side of a housing suitable for retaining an information handling system device. The housing includes the first housing side, a second housing side, and a third housing side, wherein the second housing side is oriented generally opposing the first housing side, and the third housing side oriented is generally perpendicular to the first housing side and the second housing side. The information handling system device includes a first device side, a second device side, and a third device side. The information handling system device is rotated about the engaged portion of the information handling system device with the housing, so that the information handling system device is secured to the first housing side, second housing side and third housing side.

US Patent:

6728115, Apr 27, 2004

Filed:

Apr 19, 2002

Appl. No.:

10/126115

Inventors:

Bao G. Le - Orange CA
Derek T. Nguyen - San Clemente CA

Assignee:

Gateway, Inc. - Poway CA

International Classification:

H05K 700

US Classification:

361816, 361818, 361800, 174 51, 174 35 R

Abstract:

A string with conductive filaments is placed across an opening of an electronic cage at a point between two devices to be installed in the electronic cage. A cage for a personal computer is positioned within the personal computer and the string is positioned at a point to fill a gap between two drives when installed in the cage. The string comprises a twisted metal wire with multiple conductive filaments woven into the wire. The filaments are of sufficient length to contact both drives.

US Patent:

6813161, Nov 2, 2004

Filed:

May 9, 2002

Appl. No.:

10/142040

Inventors:

Bao G. Le - Orange CA
Derek T. Nguyen - San Clemente CA
David R. Davis - Jefferson SD
Allan L. Klink - Sioux City IA

Assignee:

Gateway, Inc. - Poway CA

International Classification:

A05K 500

US Classification:

361758, 361801, 174138 G

Abstract:

An apparatus and method for supporting a circuit board within a computer chassis is disclosed. The apparatus comprises a standoff support mounted in a channel so that the standoff can be positioned along the length of the channel by moving or sliding the standoff within the channel. This movable standoff facilitates the mounting of a variety of circuit boards within the same computer chassis.

US Patent:

7151677, Dec 19, 2006

Filed:

Apr 20, 2004

Appl. No.:

10/828038

Inventors:

Bao G. Le - Orange CA, US
Derek T. Nguyen - San Clemente CA, US
David R. Davis - Jefferson SD, US
Allan L. Klink - Sioux City IA, US

Assignee:

Gateway Inc. - Irvine CA

International Classification:

H05K 7/02
H05K 7/04

US Classification:

361807, 361810, 361760, 174138 D, 174138 G

Abstract:

An apparatus and method for supporting a circuit board within a computer chassis is disclosed. The apparatus comprises a standoff support mounted in a channel so that the standoff can be positioned along the length of the channel by moving or sliding the standoff within the channel. This movable standoff facilitates the mounting of a variety of circuit boards within the same computer chassis.