Brian K Hunt

US Patent:

7247315, Jul 24, 2007

Filed:

Aug 15, 2002

Appl. No.:

10/222007

Inventors:

Teletha A. Brown - Piscataway NJ, US
James Osborne - Princeton Junction NJ, US
Michael Rudella - Cedar Knolls NJ, US
Brian Hunt - Harriman NY, US
Vinod Malik - Toms River NJ, US

Assignee:

Lavipharm Laboratories Inc. - East Windsor NJ

International Classification:

A61F 13/02
A61L 15/16
A61K 9/14

US Classification:

424448, 424449, 424484

Abstract:

The invention relates to transdermal delivery patches comprising a drug-containing drug reservoir wherein the drug reservoir comprises a plasticizer composition selected to adjust the rate of drug flux out of the transdermal delivery patch device. The invention also specifically relates to methods of producing the transdermal delivery patches of the invention, the methods comprising the use of an alcohol drug dispersing agent. The invention further specifically relates to methods of treating acute and chronic pain and methods of inducing and maintaining analgesia with the transdermal delivery patches of the invention.

US Patent:

57930562, Aug 11, 1998

Filed:

Feb 21, 1997

Appl. No.:

8/802982

Inventors:

Martin G. Forrester - Pittsburgh PA
Brian D. Hunt - Murrysville PA

Assignee:

Northrop Grumman Corporation - Los Angeles CA

International Classification:

H01L 2906

US Classification:

257 31

Abstract:

A technique for defining the active area of a high-T. sub. c superconductor Josephson junction uses an epitaxial slotted insulator patterned over the edge of the superconductor thin film-insulator bilayer. The superconductor/normal-metal/superconductor edge junction formed between the slotted insulator has a small active area. The counter electrode provided as an interconnect of the junction can therefore be wider than the active area of the edge junction since it can overlap onto the patterned slotted insulator. The use of the slotted insulator enables fabrication of junctions having resistances and critical currents in the desired range for high-T. sub. c superconductor circuits while enabling the use of wide, low inductance interconnects.