Craig B Mitchell

US Patent:

57669872, Jun 16, 1998

Filed:

Sep 22, 1995

Appl. No.:

8/532235

Inventors:

Craig Mitchell - Coral Springs FL
Thomas H. Distefano - Monte Sereno CA

Assignee:

Tessera, Inc. - San Jose CA

International Classification:

H01L 2144

US Classification:

438126

Abstract:

Microelectronic assemblies such as semiconductor chip assemblies are encapsulated. During encapsulation, the terminals carried by a dielectric layer in each assembly, and the bottom surface of the semiconductor chip in each assembly are protected by covering layers. The covering layers confine the liquid encapsulant and prevent contamination of the terminals and chip bottom surfaces. The encapsulation process may be conducted by using a tilting fixture. The liquid encapsulant and the assemblies are placed into the fixture, the fixture is closed and evacuated, and the encapsulant is then poured onto the assemblies while maintaining the fixture under vacuum. The fixture is then pressurized and maintained under pressure during cure of the encapsulant.

US Patent:

59322543, Aug 3, 1999

Filed:

Jan 22, 1998

Appl. No.:

9/012079

Inventors:

Craig Mitchell - Coral Springs FL
Thomas H. Distefano - Monte Sereno CA

Assignee:

Tessera, Inc. - San Jose CA

International Classification:

B29C 4514

US Classification:

425117

Abstract:

A fixture for encapsulating microelectronic devices includes a structure defining a device-receiving pocket and a well communicating with the pocket so that the passage and well define an interior space whereby the pocket is disposed above the well when the structure is in a first orientation and the well is disposed above the pocket when the structure is in a second orientation. The fixture also includes an element for sealing the interior space and a port for connecting the sealed interior space to an evacuation device.