Daniel R Andrews

US Patent:

7413688, Aug 19, 2008

Filed:

Sep 17, 2001

Appl. No.:

09/954717

Inventors:

Kenneth Noddings - Austin TX, US
Daniel Marshall Andrews - Austin TX, US
Michael Anthony Olla - Austin TX, US
Thomas Alan Bishop - Austin TX, US

International Classification:

B29D 11/00
G02B 6/26
G02B 6/42

US Classification:

264 125, 264 126, 264261

Abstract:

A method of forming a waveguide or an optical assembly includes molding a waveguide material, optionally in alignment with one or more optical components. The one or more optical components are aligned in a precision mold that is also used to form the waveguide. A cladding and encapsulation material can also be molded. The molded materials can be used to hold the components together in alignment in a single assembly. A connector structure can be molded as part of the assembly or can be prefabricated and incorporated into the molded assembly to facilitate connecting the assembly to other components without requiring active alignment or polishing of optical fiber ends.

US Patent:

8060418, Nov 15, 2011

Filed:

Mar 3, 2009

Appl. No.:

12/397214

Inventors:

Robert W. Honts - Austin TX, US
Robert E. Wollan - St. Paul MN, US
Allen J. Delattre - Wilton CT, US
Daniel G. Andrews - Irving TX, US
Stephanie D. Sadowski - Charlotte NC, US
Charles J. Forsythe - Florham Park NJ, US

Assignee:

Accenture Global Services Limited - Dublin

International Classification:

G07B 17/00

US Classification:

705 30, 709200, 709201, 709202, 709219, 709221, 709223, 709225, 709227, 705 14, 705 35, 705 51, 705 56, 719310, 719315, 719320, 717106, 717121, 717143, 717176

Abstract:

A digital footprint driven multi-channel integrated support system assists a user in managing electronic components based on his or her digital footprint. The digital footprint driven multi-channel integrated support system delivers a dramatically improved ‘digital home support’ experience across multiple support channels (e. g. , ‘on-the-box’, web, IVR, agent voice, agent chat, agent email, and more). The digital footprint driven multi-channel integrated support system generates, displays, and uses a ‘digital footprint’ of the components within the home, such as computer hardware/software, computer peripherals, audio/visual equipment, gaming hardware/software, home security hardware/software, or other electronic components.

US Patent:

47765097, Oct 11, 1988

Filed:

May 19, 1987

Appl. No.:

7/052652

Inventors:

Gregory E. Pitts - Austin TX
David E. Boone - Austin TX
Daniel M. Andrews - Austin TX

Assignee:

Microelectronics and Computer Technology Corporation - Austin TX

International Classification:

B23K 3102

US Classification:

228179

Abstract:

A single point bonding apparatus and method for bonding one electrical conductor to a second electrical conductor by a thermosonic process using force, time, temperature and ultrasonic energy as the key parameters in forming the bonds. A bonding tool has a tip with a multiple of nonparallel surfaces extending from the end of the tip for maximizing the amount of ultrasonic energy coupled to the electrical conductors. The surfaces may be recessed into the end of the tip or protrude outwardly from the end of the tip for coupling ultrasonic energy in directions both parallel and perpendicular to the conductors.

US Patent:

51712903, Dec 15, 1992

Filed:

Sep 3, 1991

Appl. No.:

7/754472

Inventors:

Michael A. Olla - Austin TX
Howard A. Moore - Austin TX
Daniel M. Andrews - Austin TX

Assignee:

Microelectronics And Computer Technology Corporation - Austin TX

International Classification:

H01R 909

US Classification:

439 71

Abstract:

A testing and burn in socket compatible with the high density test pads located at small pitches devices on a TAB tape. A TAB tape carrier for supporting the TAB tape and a test circuit board having contact pads for electrical communication with the test pads. An alignment fixture positioned between the tape carrier and circuit board and including an opening in alignment between the test pads and the contact pads. A metal in elastomer matrix is positioned in the opening for providing electrical communication between the test pads and the contact pads. A block may be positoned in the openings and contain a plurality of straight parallel electrically conductive pins aligned with the matrix for high frequency tests.

US Patent:

50728741, Dec 17, 1991

Filed:

Jan 31, 1991

Appl. No.:

7/648266

Inventors:

Michael J. Bertram - Austin TX
Daniel M. Andrews - Austin TX
Thomas A. Bishop - Austin TX

Assignee:

Microelectronics and Computer Technology Corporation - Austin TX

International Classification:

B23K 300

US Classification:

228264

Abstract:

A desoldering material with an opening or window shaped so that the base of an electronic component can fit inside the opening while the desoldering material simultaneously contacts all solder joints which bond the component's outer leads to pads on a surface. A first adhesive secures the base to the surface, a second adhesive secures a retraction device to the base, the first adhesive is heated and softened without softening the second adhesive, and the retraction device removes the desoldered component from the surface. The invention is well suited to removing tape-automated-bonded integrated circuits adhesively attached to high density multichip module substrates.

US Patent:

48522503, Aug 1, 1989

Filed:

Jan 19, 1988

Appl. No.:

7/145356

Inventors:

Daniel M. Andrews - Austin TX

Assignee:

Microelectronics and Computer Technology Corporation - Austin TX

International Classification:

H01L 2188

US Classification:

29827

Abstract:

Forming a body of insulating material with a shelf and an opening therethrough with a plurality of electrical conductors extending from the shelf to the exterior of the body. A plurality of tape automated bounding leads are placed in the opening in which the inner ends of the leads are connected together. The outer ends of the leads are aligned with the electrical conductors and bonded thereto and the inner ends of the leads are disconnected from each other. An electronic component is bonded to a bottom cover, aligned in the opening, and the inner ends of the leads are bonded to the electrical component. The bottom and a top cover are sealably connected to the body enclosing the opening and the electronic component.

US Patent:

48453358, Jul 4, 1989

Filed:

Jan 28, 1988

Appl. No.:

7/149449

Inventors:

Daniel M. Andrews - Austin TX
Philip J. Spletter - Cedar Park TX
Richard L. Simmons - Jonestown TX

Assignee:

Microelectronics and Computer Technology Corporation - Austin TX

International Classification:

B23K 2600

US Classification:

21912163

Abstract:

A method and apparatus of bonding two electrical members together uses a pulsed YAG laser. Various apparatus and methods may be used to hold the electrical members in contact under pressure to insure uniform bonding. Automation production equipment provides for the automatic bonding of the flat electrical leads of a TAB tape to the flat electrical bumps on a plurality of integrated circuit dies.

US Patent:

49345826, Jun 19, 1990

Filed:

Sep 20, 1989

Appl. No.:

7/410171

Inventors:

Michael J. Bertram - Austin TX
Daniel M. Andrews - Austin TX

Assignee:

Microelectronics and Computer Technology Corporation - Austin TX

International Classification:

B23K 1018

US Classification:

228191

Abstract:

A method and apparatus are described for the removal of solder mounted surface mount electronic components which includes the removal of old solder, broken leads, and the electronic component without damaging other devices on the substrate. A desoldering braid is shaped to cover each of the electronic component's outer lead bonds without contacting the component's base. The desoldering braid is heated and brought in contact with the bonds until the solder flows into the desoldering braid and any broken outer leads attach to the desoldering braid. Upon removal of the desoldering braid the electronic component can be lifted off the surface. The desoldered solder joints will contain a thin uniform coating of solder less than approximately 50 micro inches thick. This allows for removal and replacement of solder mounted electronic components with leads on center lines spaced less than 0. 020 inches.