Daniel Z Xu

US Patent:

6437383, Aug 20, 2002

Filed:

Dec 21, 2000

Appl. No.:

09/745322

Inventors:

Daniel Xu - Mountain View CA

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01L 2972

US Classification:

257300, 257 2, 257110, 257121, 257124, 257192, 257246, 257295, 257296, 257350

Abstract:

The invention relates to a phase-change memory device. The device includes a double-trench isolation structure around the diode stack that communicates to the lower electrode. The present invention also relates to a method of making a phase-change memory device. The method includes forming two orthogonal and intersecting isolation trenches around a memory cell structure diode stack.

US Patent:

6462984, Oct 8, 2002

Filed:

Jun 29, 2001

Appl. No.:

09/895599

Inventors:

Daniel Xu - Mountain View CA
Tyler A. Lowrey - San Jose CA
David L. Kencke - Portland OR

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

G11C 1136

US Classification:

365175, 365174, 365163, 365148, 365203, 3652257, 365 51

Abstract:

An integrated circuit (IC) has a number of memory cells, each of which has a diode structure coupled between a bitline and a wordline that are selected when programming that cell. A target memory cell of the IC is programmed while simultaneously floating a number of unselected bitlines and wordlines in the IC.

US Patent:

6566700, May 20, 2003

Filed:

Oct 11, 2001

Appl. No.:

09/975272

Inventors:

Daniel Xu - Mountain View CA

Assignee:

Ovonyx, Inc. - Boise ID

International Classification:

H01L 27108

US Classification:

257296, 257 4, 257 77, 257614, 257734

Abstract:

A phase-change memory cell may be formed with a carbon-containing interfacial layer that heats a phase-change material. By forming the phase-change material in contact, in one embodiment, with the carbon containing interfacial layer, the amount of heat that may be applied to the phase-change material, at a given current and temperature, may be increased. In some embodiments, the performance of the interfacial layer at high temperatures may be improved by using a wide band gap semiconductor material such as silicon carbide.

US Patent:

6514805, Feb 4, 2003

Filed:

Jun 30, 2001

Appl. No.:

09/896532

Inventors:

Daniel Xu - Mountain View CA
Erman Bengu - San Jose CA
Ming Jin - San Jose CA

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01L 2100

US Classification:

438164, 438405, 438427, 438703

Abstract:

A method comprising forming a first trench in a substrate, and forming a second trench in the substrate, the second trench intersecting the first trench and having a retrograde sidewall profile relative to a direction from a top of the trench to a bottom of the trench. An apparatus comprising a matrix of cells in a substrate formed by a plurality of first trenches and a plurality of second trenches, the plurality of second trenches intersecting the plurality of first trenches and having a retrograde sidewall profile relative to a direction from a top to a bottom of the respective trench; and an electrically accessible storage device coupled to respective ones of the matrix of cells.

US Patent:

6642102, Nov 4, 2003

Filed:

Jun 30, 2001

Appl. No.:

09/896530

Inventors:

Daniel Xu - Mountain View CA

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01L 21336

US Classification:

438257, 438396, 438 95, 438470, 438128, 257 3, 257530, 257621

Abstract:

A method comprising forming as stacked materials on a substrate, a volume of programmable material and a signal line, conformably forming a first dielectric material on the stacked materials, forming a second dielectric material on the first material, etching an opening in the second dielectric material with an etchant that, between the first dielectric material and the second dielectric material, favors removal of the second dielectric material, and forming a contact in the opening to the stacked materials. An apparatus comprising a contact point formed on a substrate, a volume of programmable material formed on the contact point, a signal line formed on the volume of programmable material, a first dielectric material conformally formed on the signal line, a different second dielectric material formed on the first dielectric material, and a contact formed through the first dielectric material and the second dielectric material to the signal line.

US Patent:

6800563, Oct 5, 2004

Filed:

Oct 11, 2001

Appl. No.:

09/975163

Inventors:

Daniel Xu - Mountain View CA

Assignee:

Ovonyx, Inc. - Boise ID

International Classification:

H01L 21302

US Classification:

438718, 438719

Abstract:

A phase-change memory may have a tapered lower electrode coated with an insulator. The coated, tapered electrode acts as a mask for a self-aligned trench etch to electrically separate adjacent wordlines. In some embodiments, the tapered lower electrode may be formed over a plurality of doped regions, and isotropic etching may be used to taper the electrode as well as part of the underlying doped regions.

US Patent:

6869841, Mar 22, 2005

Filed:

Mar 11, 2003

Appl. No.:

10/384667

Inventors:

Daniel Xu - Mountain View CA, US

Assignee:

Ovonyx, Inc. - Boise ID

International Classification:

H01L021/8242
H01L021/00

US Classification:

438239, 438210, 438382, 438 95, 438105

Abstract:

A phase-change memory cell may be formed with a carbon-containing interfacial layer that heats a phase-change material. By forming the phase-change material in contact, in one embodiment, with the carbon containing interfacial layer, the amount of heat that may be applied to the phase-change material, at a given current and temperature, may be increased. In some embodiments, the performance of the interfacial layer at high temperatures may be improved by using a wide band gap semiconductor material such as silicon carbide.

US Patent:

6933516, Aug 23, 2005

Filed:

May 5, 2004

Appl. No.:

10/839499

Inventors:

Daniel Xu - Mountain View CA, US

Assignee:

Ovonyx, Inc. - Boise ID

International Classification:

H01L047/00

US Classification:

257 4

Abstract:

A phase-change memory may have a tapered lower electrode coated with an insulator. The coated, tapered electrode acts as a mask for a self-aligned trench etch to electrically separate adjacent wordlines. In some embodiments, the tapered lower electrode may be formed over a plurality of doped regions, and isotropic etching may be used to taper the electrode as well as part of the underlying doped regions.