David P Gruber

US Patent:

6434007, Aug 13, 2002

Filed:

Jul 20, 2000

Appl. No.:

09/620335

Inventors:

Richard B. Salmonson - Chippewa Falls WI
David Paul Gruber - Mondovi WI

Assignee:

Silicon Graphics, Inc. - Mountain View CA

International Classification:

H05K 720

US Classification:

361709, 361704, 361707, 257706, 174 163, 165 803

Abstract:

A heat sink assembly for securing a heat sink to a chip on a circuit board using a clip to secure the heat sink to the chip. The assembly includes a pair of support beams, a clip attached to the pair of support beams, and a heat sink. Optionally, the assembly also includes a plurality of bias members biased between the heat sink and the circuit board and a pair of positioning pins positioned between the heat sink and the circuit board. The clip is biased between the heat sink and the pair of support beams. The clip has a plate having a first end and a second end with the first end having an aperture for fastening the first end to a first support beam and the second end having a hook for fastening the second end to a second support beam. Optionally, the clip is made of spring steel and provides a downward biasing force of between about 3 psi and about 25 psi and preferably about 10 psi.

US Patent:

6483699, Nov 19, 2002

Filed:

Jul 20, 2000

Appl. No.:

09/619818

Inventors:

Richard B. Salmonson - Chippewa Falls WI
David Paul Gruber - Mondovi WI
Stephen A. Bowen - Chippewa Falls WI

Assignee:

Silicon Graphics, Inc. - Mountain View CA

International Classification:

H05K 720

US Classification:

361687, 361695, 361690, 361719, 165 803, 174260, 174 151

Abstract:

An air cooled computer assembly including a printed circuit board assembly or a U sized enclosure. The computer assembly also includes three 120 mm fans positioned at one end of the PCB assembly providing air flow across the PCB assembly. The printed circuit board assembly has a top side and a bottom side, including heat producing components on the top side and bottom side. A portion of the heat producing components are DIMM memory positioned perpendicular to the direction of air flow. The computer assembly also includes an air baffling system positioned proximate to the PCB assembly. The air baffling system divides and balances the air flow between the heat producing components so that each of the components are adequately cooled. The air baffling system includes a flat baffle and pair of curved baffles. The flat baffle is positioned perpendicular to the direction of the air flow and is positioned between and in front of two 40 watt memory.

US Patent:

6487082, Nov 26, 2002

Filed:

Jul 20, 2000

Appl. No.:

09/620059

Inventors:

Thomas Alex Crapisi - Jim Falls WI
Jeffrey S. Conger - Eau Claire WI
Stephen Cermak, III - Elk Mound WI
Stephen A. Bowen - Chippewa Falls WI
Rodney Ruesch - Eau Claire WI
David Paul Gruber - Mondovi WI
Bonnie Kay Dobbs - Bloomer WI

Assignee:

Silicon Graphics, Inc. - Mountain View CA

International Classification:

H05K 710

US Classification:

361760, 361761, 361764, 361784, 174260, 174261

Abstract:

A printed circuit board apparatus, configurations and methods are presented which provide for close spacing between the HUB and multiple processors as well as a common configuration for two or four processor boards. A printed circuit board is provided with conductive apertures and portions corresponding to an efficient Packaging allowing for the attachment of the processor-chip on one side of the printed circuit board, and the HUB and other supporting electronic components on the other side of the printed circuit board. This configuration allows for the close spacing of the electrical conductors of the HUB and the processors without the limitations imposed by the physical dimensions of the respective hardware. Additionally, a symmetric packaging of the conductive apertures and portions about a centerline of the printed circuit board allows for a simple design modification to allow for a two two-processor board to be manufactured from a similarly configured four-processor board.

US Patent:

6512676, Jan 28, 2003

Filed:

Jul 20, 2000

Appl. No.:

09/619725

Inventors:

Thomas Alex Crapisi - Jim Falls WI
Jeffrey Scott Cogner - Eau Claire WI
Stephen Cermak, III - Elk Mound WI
Stephen A. Bowen - Chippewa Falls WI
Rodney Ruesch - Eau Claire WI
David Paul Gruber - Mondovi WI
Bonnie Kay Dobbs - Bloomer WI

Assignee:

Silicon Graphics, Inc. - Mountain View CA

International Classification:

H05K 500

US Classification:

361752, 361753, 361825

Abstract:

Apparatus and methods for reducing circuit board flexing is presented. The apparatus is fastened to a printed circuit board to provide rigid support for reducing bending and flexing. In one embodiment, a rigid frame is provided that is adapted to be fastened to one or more components and to be fastened to a printed circuit board. The frame is adapted to elevate the attached component from the PCB surface allowing components to be mounted on the PCB therewith. The frame is adapted to occupy minimal printed circuit board surface area so as not to displace electronic components. In another embodiment, an elongated truss-like stiffener is provided that is adapted to be fastened to one side of the printed circuit board and adapted to span the printed circuit board. The elongated stiffener is adapted to have an open structure to minimize cooling flow disturbance and weight. The elongated stiffener includes a plurality of legs forming a truss-like structure.

US Patent:

6726505, Apr 27, 2004

Filed:

Aug 29, 2002

Appl. No.:

10/231511

Inventors:

Stephen Cermak, III - Elk Mound WI
Jeffrey S. Conger - Eau Claire WI
David Paul Gruber - Mondovi WI
Thomas Alex Crapisi - Jim Falls WI
Stephen A. Bowen - Chippewa Falls WI
Steven Shafer - Eau Claire WI
Mark Ronald Sikkink - Chippewa Falls WI

Assignee:

Silicon Graphics, Inc. - Mountain View CA

International Classification:

H01R 1360

US Classification:

439567, 174138 D

Abstract:

New methods and configurations are provided that allow for a large memory capacity, as well as minimized interconnect distances between the memory chips and one or more processors, and the HUB chip-set. The apparatus, configurations and methods include providing a printed circuit board having one or more processor conductive portions and one or more z-axis connector conductive portions in close proximity with each other, and connecting the one or more processors on one side of a printed circuit board, and connecting the one or more z-axis connectors for the memory daughter cards on the opposite side of the processor board. Standoffs are used to support and secure the horizontally disposed z-axis memory daughter cards and to ensure proper spacing between the z-axis daughter cards and the processor board Standoffs include an alignment pin portion and a spacer portion. The alignment pin portion includes an alignment portion, foot, and urging portion. The spacer portion includes pin coupler, relief portion, and aperture.

US Patent:

6771517, Aug 3, 2004

Filed:

Jul 26, 2002

Appl. No.:

10/202377

Inventors:

Thomas Alex Crapisi - Jim Falls WI
Jeffrey Scott Cogner - Eau Claire WI
Stephen Cermak, III - Elk Mound WI
Stephen A. Bowen - Chippewa Falls WI
Rodney Ruesch - Eau Claire WI
David Paul Gruber - Mondovi WI
Bonnie Kay Dobbs - Bloomer WI

Assignee:

Silicon Graphics, Inc. - Mountain View CA

International Classification:

H02B 101

US Classification:

361829, 361742, 361758, 361770, 361804, 361807, 361810, 361812

Abstract:

Apparatus and methods for reducing circuit board flexing is presented. The apparatus is fastened to a printed circuit board to provide rigid support for reducing bending and flexing. In one embodiment, a rigid frame is provided that is adapted to be fastened to one or more components and to be fastened to a printed circuit board. The frame is adapted to elevate the attached component from the PCB surface allowing components to be mounted on the PCB therewith. The frame is adapted to occupy minimal printed circuit board surface area so as not to displace electronic components. In another embodiment, an elongated truss-like stiffener is provided that is adapted to be fastened to one side of the printed circuit board and adapted to span the printed circuit board. The elongated stiffener is adapted to have an open structure to minimize cooling flow disturbance and weight. The elongated stiffener includes a plurality of legs forming a truss-like structure.