David F Jacks

US Patent:

58576096, Jan 12, 1999

Filed:

Aug 12, 1996

Appl. No.:

8/694446

Inventors:

David Carl Jacks - Pomona CA

Assignee:

Cooper Industries, Inc. - Houston TX

International Classification:

B23K 303

US Classification:

228 205

Abstract:

The present invention is directed to a self-contained desoldering gun having a built-in vacuum pump. The vacuum pump is operated by a low voltage electric motor which is electrically connected in at least partial series with a heating tip. The heating tip reduces the voltage in the circuit and reduces the size of the motor required to operate the pump. In exemplary embodiments, a portion of the heating tip which is not in partial series with the motor is electrically connected in parallel with the motor. In alternate embodiments, the heating tip can include separately formed first and second heating elements, the first heating element being connected in parallel with the motor and the second heating element being connected in series with the motor. Such a configuration allows the second heating element to be energized only when the motor of the vacuum pump is energized. In yet other embodiments, a multi-position switch is used in conjunction with any of the above-described embodiments, and/or is used in still further embodiments to place the vacuum pump in series with a single heating element during operation of the vacuum pump.

US Patent:

59834773, Nov 16, 1999

Filed:

Oct 11, 1996

Appl. No.:

8/730488

Inventors:

David C. Jacks - Pomona CA
Randall R. Walston - Torrance CA

International Classification:

B23Q 1700

US Classification:

294071

Abstract:

A template for aligning a rework tool head and a substrate (such as a printed circuit board) for the accurate placement of a ball grid array package on the substrate with the head, prior to soldering the package to the substrate. The template has a top formed to attach the template to the head in a reproducible position and an indicator rigidly connected to the top to align the template to a feature on the substrate. In one embodiment, the template has a top side formed to mimic the top of the ball grid array package and a bottom side rigidly connected to the top side and formed to show the placement of the balls on the bottom of the ball grid array package in reference to the top of the ball grid array package. Used for the accurate placement of a ball grid array package on a substrate with a head, this embodiment of the template is attached to the head in the place of the package, the head and/or substrate are moved to align bottom of the template with the part of the substrate to which the package is to be attached, and removing the template from the head without changing the alignment.

US Patent:

D4347366, Dec 5, 2000

Filed:

Jul 21, 1998

Appl. No.:

D/091014

Inventors:

David Jacks - Pomona CA
Randall Walston - Torrance CA

International Classification:

1302

US Classification:

D13184

US Patent:

D3264637, May 26, 1992

Filed:

Apr 12, 1989

Appl. No.:

7/337115

Inventors:

David Jacks - Pomona CA

Assignee:

Eldon Industries, Inc. - Inglewood CA

US Classification:

D15125

US Patent:

58267794, Oct 27, 1998

Filed:

Jun 13, 1997

Appl. No.:

8/874836

Inventors:

David C. Jacks - Pomona CA
Randall R. Walston - Torrance CA

International Classification:

B23K 3047

US Classification:

228 42

Abstract:

In one aspect, a device for attaching a component to a circuit board is provided, comprising a circuit board held in a holder and a contact heater that heats the component on the circuit board by contact and by conducting heat through the component. In a further aspect, the contact heater is in a wand which is manually moved onto the component. In another aspect, the invention provides a method for attaching a component to a circuit board, comprising the steps of gripping the component with a contact heater; placing the component on the circuit board; and heating the component on the circuit board by contact, wherein heat conducted through the component melts solder under the component and attaches the component to the circuit board.

US Patent:

55448038, Aug 13, 1996

Filed:

Aug 8, 1994

Appl. No.:

8/287547

Inventors:

David C. Jacks - Pomona CA

Assignee:

Cooper Industries, Inc. - Houston TX

International Classification:

B23K 303

US Classification:

228 205

Abstract:

A self contained desoldering gun (10) with a built in vacuum pump (40). Vacuum pump (40) is operated by a low voltage DC electric motor (50) which is connected electrically in series with heating tip (20). Heating tip (20) reduces the voltage in the circuit and reduces the size of the motor required to operate pump (40). A second heating element may be used when motor (50) is energized.

US Patent:

50318209, Jul 16, 1991

Filed:

Feb 1, 1990

Appl. No.:

7/475138

Inventors:

David C. Jacks - Pomona CA
Randall R. Walston - Torrance CA
Silvestre Lopez - Los Angeles CA

Assignee:

Eldon Industries, Inc. - Inglewood CA

International Classification:

B23K 3704

US Classification:

228 62

Abstract:

A rework station for soldering/desoldering of integrated circuits on a printed circuit board (PCB) wherein a gantry mounted on a base positions hot gas delivery and vacuum application apparatus over a PCB carried between carrier arms mounted on a horizontal arm slidably mounted in a pinion block for movement in the X direction with respect to the base. The pinion block is slidably mounted in the base for movement in the Y direction. A combination of sprockets and idlers transmits X and Y drives for driving the horizontal arm and pinion block from control dials mounted at the front edge of the base.

US Patent:

56390114, Jun 17, 1997

Filed:

Feb 17, 1995

Appl. No.:

8/390755

Inventors:

David C. Jacks - Pomona CA
Randall R. Walston - Torrance CA

International Classification:

B23K 1018
B23K 304
H01L 2158

US Classification:

22818021

Abstract:

In one aspect, a device for attaching a component to a circuit board is provided, comprising a circuit board held in a holder and a contact heater that heats the component on the circuit board by contact and by conducting heat through the component. In a further aspect, the contact heater is in a wand which is manually moved onto the component. In another aspect, the invention provides a method for attaching a component to a circuit board, comprising the steps of gripping the component with a contact heater; placing the component on the circuit board; and heating the component on the circuit board by contact, wherein heat conducted through the component melts solder under the component and attaches the component to the circuit board.