Fred E Klimpl

age ~90

from New Hyde Park, NY

Also known as:
  • Fred Klimp
  • Fred L

Fred Klimpl Phones & Addresses

  • New Hyde Park, NY
  • 25 Hawthorne Ln, Great Neck, NY 11023 • 5164876808
  • Hauppauge, NY
  • North Hills, NY
  • 25 Hawthorne Ln, Great Neck, NY 11023 • 5163843655

Work

  • Position:
    Financial Professional

Education

  • Degree:
    Associate degree or higher

Emails

Name / Title
Company / Classification
Phones & Addresses
Fred Klimpl
Owner, Principal
SILVERCO, INC
Business Services · Ret Misc Homefurnishings
33 Great Nck Rd STE 11, Great Neck, NY 11021
5164661946

Us Patents

  • Antimicrobial Paper

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  • US Patent:
    6939442, Sep 6, 2005
  • Filed:
    Jun 27, 2003
  • Appl. No.:
    10/610505
  • Inventors:
    Fred Klimpl - Great Neck NY, US
    Ken Sonenberg - Great Neck NY, US
  • Assignee:
    SilverCo LLC - Great Neck NY
  • International Classification:
    D21H021/36
  • US Classification:
    162161, 162158
  • Abstract:
    A conventional paper product used for printing or for fabrication into envelopes, file folders, forms and the like, is prepared by having antimicrobial agents added into the sizing during the manufacturing process. The antimicrobial agent provides protection to the paper from fungi, mildew and bacteria that could otherwise destroy the paper or be harmful to the user thereof.
  • Antimicrobial Paper

    view source
  • US Patent:
    20050199360, Sep 15, 2005
  • Filed:
    May 3, 2005
  • Appl. No.:
    11/120477
  • Inventors:
    Fred Klimpl - Great Neck NY, US
    Ken Sonenberg - Great Neck NY, US
  • International Classification:
    A61K009/70
  • US Classification:
    162158000, 424443000
  • Abstract:
    A conventional paper product used for printing or for fabrication into envelopes, file folders, forms and the like, is prepared by having antimicrobial agents added into the sizing during the manufacturing process. The antimicrobial agent provides protection to the paper from fungi, mildew and bacteria that could otherwise destroy the paper or be harmful to the user thereof.
  • Reinforced Plastic Laminates For Use In The Production Of Printed Circuit Boards And Process For Making Such Laminates And Resulting Products

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  • US Patent:
    50376918, Aug 6, 1991
  • Filed:
    Aug 23, 1989
  • Appl. No.:
    7/398128
  • Inventors:
    Jonas Medney - Rockville Center NY
    Fred E. Klimpl - Great Neck NY
  • Assignee:
    Compositech, Ltd. - Hauppauge NY
  • International Classification:
    B32B 307
  • US Classification:
    428137
  • Abstract:
    A warp-free laminate is produced by winding a first set of strands or filaments about a flat mandrel with a second set of strands being wound transverse to the first set. The two sets may be perpendicular to each other. The filaments are maintained under a controlled tension while being impregnated with a resin and during subsequent cure of the resin. In order to permit the formation of a warp-free product, the winding pattern is such that it forms a mirror image about a neutral axis or plane of symmetry. The winding pattern may be chosen to provide interstices in a predetermined pattern permitting punching out or high speed drilling of hole openings for subsequent printed circuit applications.
  • Method For Making Composite Structures By Filament Winding

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  • US Patent:
    54784212, Dec 26, 1995
  • Filed:
    Sep 28, 1993
  • Appl. No.:
    8/129553
  • Inventors:
    Jonas Medney - Rockville Center NY
    Fred E. Klimpl - Great Neck NY
  • Assignee:
    Compositech Ltd. - Hauppauge NY
  • International Classification:
    B65H 8100
    H05K 103
  • US Classification:
    156174
  • Abstract:
    A warp-free laminate is produced by winding a first set of strands or filaments about a flat mandrel with a second set of strands being wound transverse to the first set. The two sets may be perpendicular to each other. The filaments are maintained under a controlled tension while being impregnated with a resin and during subsequent cure of the resin. In order to permit the formation of a warp-free product, the winding pattern is such that it forms a mirror image about a neutral axis or plane of symmetry. The winding pattern may be chosen to provide interstices in a predetermined pattern determining punching out or high speed drilling of hole openings for subsequent printed circuit applications.
  • Method Of Winding Tile-Lined Piped With Subdivided Tiles Therein

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  • US Patent:
    44849699, Nov 27, 1984
  • Filed:
    Sep 29, 1982
  • Appl. No.:
    6/428176
  • Inventors:
    Fred E. Klimpl - Great Neck NY
  • Assignee:
    Koch Engineering Co., Inc. - Wichita KS
  • International Classification:
    B65H 8100
  • US Classification:
    156171
  • Abstract:
    A tile-lined pipe and its method of manufacture comprising a tubular pipe member having a layer of tile elements on the inner surface to form a lining therefor. The tile elements extend one after another along helical lines and are formed by subdividing larger tiles transversely along score lines so that the adjoining faces of the subdivided tiles will be in closely conforming adjoining relation.
  • Tile-Lined Pipe With Subdivided Tiles Therein And Methods Of Production Thereof

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  • US Patent:
    45262080, Jul 2, 1985
  • Filed:
    Sep 1, 1983
  • Appl. No.:
    6/528612
  • Inventors:
    Fred E. Klimpl - Great Neck NY
  • Assignee:
    Koch Engineering Co., Inc. - Wichita KS
  • International Classification:
    F16L 910
    F16L 916
  • US Classification:
    138144
  • Abstract:
    A tile-lined pipe and its method of manufacture comprising a tubular pipe member having a layer of tile elements on the inner surface to form a lining therefor. The tile elements extend one after another along helical lines and are formed by subdividing larger tiles transversely along score lines so that the adjoining faces of the subdivided tiles will be in closely conforming adjoining relation. Within the tile elements is an erodible layer. The structure is encompassed by resin saturated fiberglass. The resin serves to absorb energy from impacting particles.
  • Methods For Making Circuit Boards By Vacuum Impregnation

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  • US Patent:
    55122248, Apr 30, 1996
  • Filed:
    Nov 1, 1990
  • Appl. No.:
    7/608070
  • Inventors:
    Jonas Medney - Rockville Center NY
    Fred E. Klimpl - Great Neck NY
  • Assignee:
    Compositech Ltd. - Hauppauge NY
  • International Classification:
    B29C 3912
    B29C 3942
    B29C 5360
  • US Classification:
    264102
  • Abstract:
    A warp-free laminate is produced by winding a first set of strands or filaments about a flat mandrel with a second set of strands being wound transverse to the first set. The two sets may be perpendicular to each other. The filaments are maintained under a controlled tension while being impregnated with a resin and during subsequent cure of the resin. In order to permit the formation of a warp-free product, the winding pattern is such that it forms a mirror image about a neutral axis or plane of symmetry. The winding pattern may be chosen to provide interstices in a predetermined pattern determining punching out or high speed drilling of hole openings for subsequent printed circuit applications.
  • Method For Making Reinforced Plastic Laminates For Use In The Production Of Circuit Boards

    view source
  • US Patent:
    49433342, Jul 24, 1990
  • Filed:
    Sep 15, 1986
  • Appl. No.:
    6/907863
  • Inventors:
    Jonas Medney - Rockville Center NY
    Fred E. Klimpl - Great Neck NY
  • Assignee:
    Compositech Ltd. - Hauppauge NY
  • International Classification:
    B65H 8100
    H05K 103
  • US Classification:
    156174
  • Abstract:
    A warp-free laminate is produced by winding a first set of strands or filaments about a flat mandrel with a second set of strands being wound transverse to the first set. The two sets may be perpendicular to each other. The filaments are maintained under a controlled tension while being impregnated with a resin and during subsequent cure of the resin. In order to permit the formation of a warp-free product, the winding pattern is such that it forms a mirror image about a neutral axis or plane of symmetry. The winding pattern may be chosen to provide interstices in a predetermined pattern permitting punching out or high speed drilling of hole openings for subsequent printed circuit applications.

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