Gang Liu - Framingham MA, US Aaron Wallack - Natick MA, US David Michael - Wayland MA, US
Assignee:
Cognex Technology and Investment Corporation - Mt. View CA
International Classification:
G06K 9/00
US Classification:
382145, 382151, 382168
Abstract:
An image of a semiconductor interconnection pad is analyzed to determine a geometric description of the zone regions of a multiple zone semiconductor interconnection pad. Edge detection machine vision tools are used to extract features in the image. The extracted features are analyzed to derive geometric descriptions of the zone regions of the pad, that are applied in semiconductor device inspection, fabrication, and assembly operations.
Michael D. Shultz - Stow MA, US Christine Hiu-Tung Chen - Waltham MA, US Young Shin Cho - Cambridge MA, US Lei Jiang - Waltham MA, US Jianmei Fan - Newton MA, US Gang Liu - Waltham MA, US Dyuti Majumdar - Cambridge MA, US Jianke Li - Cambridge MA, US
Assignee:
Novartis AG - Basel
International Classification:
A61K 31/4162 A61K 31/4155 C07D 487/04 C07D 231/10
US Classification:
514403, 514406, 5483601, 5483641
Abstract:
The present teachings relate to compounds of Formula I:The present teachings also provide methods of preparing compounds of Formula I and methods of using compounds of Formula I in treating, inhibiting, or preventing pathologic conditions or disorders mediated wholly or in part by deacetylases.
Machine Vision Technique For Manufacturing Semiconductor Wafers
John W. Schwab - Framingham MA, US Gang Liu - Natick MA, US David J. Michael - Wayland MA, US
Assignee:
Cognex Corporation - Natick MA
International Classification:
G01B 11/14
US Classification:
356614
Abstract:
A vision system is provided to determine a positional relationship between a photovoltaic device wafer on a platen and a printing element, such as a printing screen, on a remote side of the photovoltaic device wafer from the platen. A source emits ultraviolet light along a path that is transverse to a longitudinal axis of an aperture through the platen, and a diffuser panel is located along that path. A reflector directs the light from the diffuser panel toward the aperture. A video camera is located along the longitudinal axis of the aperture and produces an image using light received from the platen aperture, wherein some of that received light was reflected by the wafer. A band-pass filter is placed in front of the camera to block ambient light. The use of diffused ultraviolet light enhances contrast in the image between the wafer and the printing element.
Method And Apparatus For Semiconductor Wafer Alignment
David J. Michael - Wayland MA, US James Clark - La Honda CA, US Gang Liu - Natick MA, US
Assignee:
Cognex Corporation - Natick MA
International Classification:
G06K 9/00 H01L 21/677
US Classification:
414217
Abstract:
The invention provides, in some aspects, a wafer alignment system comprising an image acquisition device, an illumination source, a rotatable wafer platform, and an image processor that includes functionality for mapping coordinates in an image of an article (such as a wafer) on the platform to a “world” frame of reference at each of a plurality of angles of rotation of the platform.
Direct Illumination Machine Vision Technique For Processing Semiconductor Wafers
John W. Schwab - Framingham MA, US Gang Liu - Natick MA, US David J. Michael - Wayland MA, US Lei Wang - Shrewsbury MA, US
Assignee:
Cognex Corporation - Natick MA
International Classification:
G01B 11/00
US Classification:
356399, 356401, 3562372, 3562375
Abstract:
A vision system is provided to determine a positional relationship between a semiconductor wafer on a platen and an element on a processing machine, such as a printing screen, on a remote side of the semiconductor wafer from the platen. A source directs ultraviolet light through an aperture in the platen to illuminate the semiconductor wafer and cast a shadow onto the element adjacent an edge of the semiconductor wafer. A video camera produces an image using light received from the platen aperture, wherein some of that received light was reflected by the wafer. The edge of the semiconductor wafer in the image is well defined by a dark/light transition.
Michael D. Shultz - Cambridge MA, US Christine Hiu-Tung Chen - Cambridge MA, US Young Shin Cho - Cambridge MA, US Lei Jiang - Cambridge MA, US Jianmei Fan - Cambridge MA, US Gang Liu - Cambridge MA, US Dyuti Majumdar - Cambridge MA, US Jianke Li - Cambridge MA, US
Assignee:
Novartis AG - Basel
International Classification:
A61K 31/4162 A61K 31/4155
US Classification:
514403, 514406
Abstract:
The present teachings relate to compounds of Formula I:The present teachings also provide methods of preparing compounds of Formula I and methods of using compounds of Formula I in treating, inhibiting, or preventing pathologic conditions or disorders mediated wholly or in part by deacetylases.
Infrared Direct Illumination Machine Vision Technique For Semiconductor Processing Equipment
Gang Liu - Natick MA, US Lei Wang - Wayland MA, US
Assignee:
Cognex Corporation - Natick MA
International Classification:
G01B 11/00
US Classification:
356399, 356401, 3562372, 3562375
Abstract:
A vision system is provided to determine a positional relationship between a semiconductor wafer on a platen and an element on a processing machine, such as a printing screen, on a remote side of the semiconductor wafer from the platen. A source directs infrared light through an aperture in the platen to illuminate the semiconductor wafer and cast a shadow onto the element adjacent an edge of the semiconductor wafer. A video camera produces an image using light received from the platen aperture, wherein some of that received light was reflected by the wafer. The edge of the semiconductor wafer in the image is well defined by a dark/light transition.
Method And Apparatus For Automatic Measurement Of Pad Geometry And Inspection Thereof
Gang Liu - Framingham MA, US Aaron S. Wallack - Natick MA, US David J. Michael - Wayland MA, US
Assignee:
Cognex Corporation - Natick MA
International Classification:
G06K 9/00 G06K 9/48 H04N 7/18
US Classification:
382147, 382149, 382199, 382151, 348125
Abstract:
An image of a semiconductor interconnection pad is analyzed to determine a geometric description of the zone regions of a multiple zone semiconductor interconnection pad. Edge detection machine vision tools are used to extract features in the image. The extracted features are analyzed to derive geometric descriptions of the zone regions of the pad, that are applied in semiconductor device inspection, fabrication, and assembly operations.
Name / Title
Company / Classification
Phones & Addresses
Gang Liu
Amazing International Travel Co Travel Agencies
6462 Victoria Dr, Vancouver, BC V5P3X7 6043239128
Gang Liu
Amazing International Travel Co Travel Agencies
6043239128
Gang Xiao Liu CEO
DOWELL INDUSTRIAL CORPORATION
1522 Penny Ln SE, Marietta, GA 1960 Spectrum Cir #530, Marietta, GA