Gary Bultman

US Patent:

6694284, Feb 17, 2004

Filed:

Sep 20, 2001

Appl. No.:

09/956839

Inventors:

Mehrdad Nikoonahad - Menlo Park CA
Ady Levy - Sunnyvale CA
Kyle A. Brown - Irvine CA
Gary Bultman - Los Altos CA
Dan Wack - Los Altos CA
John Fielden - Los Altos CA

Assignee:

KLA-Tencor Technologies Corp. - Milpitas CA

International Classification:

G01B 1500

US Classification:

702155, 702 35

Abstract:

Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, at least four properties of a specimen such as critical dimension, overlay, a presence of macro defects, and thin film characteristics. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

US Patent:

6812045, Nov 2, 2004

Filed:

Sep 20, 2001

Appl. No.:

09/956842

Inventors:

Mehrdad Nikoonahad - Menlo Park CA
Ady Levy - Sunnyvale CA
Kyle A. Brown - Irvine CA
Gary Bultman - Los Altos CA
Dan Wack - Los Altos CA
John Fielden - Los Altos CA

Assignee:

KLA-Tencor, Inc. - San Jose CA

International Classification:

H01L 2166

US Classification:

438 14, 438 15

Abstract:

Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, a characteristic of a specimen prior to, during, or subsequent to ion implantation. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

US Patent:

6891610, May 10, 2005

Filed:

Sep 20, 2001

Appl. No.:

09/956836

Inventors:

Mehrdad Nikoonahad - Menlo Park CA, US
Ady Levy - Sunnyvale CA, US
Kyle A. Brown - Irvine CA, US
Gary Bultman - Los Altos CA, US
Dan Wack - Los Altos CA, US
John Fielden - Los Altos CA, US

Assignee:

KLA-Tencor Technologies Corp. - Milpitas CA

International Classification:

G01N021/00
G01B011/00
G01B011/14

US Classification:

3562372, 3562373, 3562375, 3562374, 356 73, 356625

Abstract:

Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, an implant characteristic and a presence of defects. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

US Patent:

6919957, Jul 19, 2005

Filed:

Sep 20, 2001

Appl. No.:

09/957468

Inventors:

Mehrdad Nikoonahad - Menlo Park CA, US
Ady Levy - Sunnyvale CA, US
Kyle A. Brown - Irvine CA, US
Gary Bultman - Los Altos CA, US
Dan Wack - Los Altos CA, US
John Fielden - Los Altos CA, US

Assignee:

KLA-Tencor Technologies Corp. - Milpitas CA

International Classification:

G01N021/00

US Classification:

3562372, 3562374, 356625, 25055942

Abstract:

Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, critical dimension, a presence of defects, and a thin film characteristic. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

US Patent:

20020107660, Aug 8, 2002

Filed:

Sep 20, 2001

Appl. No.:

09/956852

Inventors:

Mehrdad Nikoonahad - Menlo Park CA, US
Ady Levy - Sunnyvale CA, US
Kyle Brown - Irvine CA, US
Gary Bultman - Los Altos CA, US
Dan Wack - Los Altos CA, US
John Fielden - Los Altos CA, US

International Classification:

G01B015/00
G06F015/00

US Classification:

702/155000

Abstract:

Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, critical dimension and a thin film characteristic. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

US Patent:

20040073398, Apr 15, 2004

Filed:

Sep 24, 2003

Appl. No.:

10/670183

Inventors:

Mehrdad Nikoonahad - Menlo Park CA, US
Ady Levy - Sunnyvale CA, US
Kyle Brown - Irvine CA, US
Gary Bultman - Los Altos CA, US
Dan Wack - Los Altos CA, US
John Fielden - Los Altos CA, US

Assignee:

KLA-Tencor, Inc.

International Classification:

G06F015/00

US Classification:

702/155000

Abstract:

Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, critical dimension and a thin film characteristic. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

US Patent:

20160111309, Apr 21, 2016

Filed:

Oct 17, 2014

Appl. No.:

14/517623

Inventors:

- Fremont CA, US
Vahid Vahedi - Oakland CA, US
Candi Kristoffersen - San Jose CA, US
Meihua Shen - Fremont CA, US
Rangesh Raghavan - Fremont CA, US
Gary Bultman - Los Altos CA, US

International Classification:

H01L 21/677
H01L 21/68
H01L 21/683
H01L 21/673

Abstract:

An EFEM useful for transferring wafers to and from wafer processing modules comprises an enclosure having a controlled environment therein bounded by a front wall, a back wall, first and second side walls, a top wall, and a bottom wall. The first side wall and the second side wall include two or more wafer load ports wherein each wafer load port is adapted to receive a FOUP. The front wall includes wafer ports configured to attach to respective load locks operable to allow a wafer to be transferred to a front wall cluster processing tool. The back wall includes a wafer port adapted to be in operational relationship with a back wall cluster processing tool. A robot in the EFEM enclosure is operable to transfer wafers through the wafer load ports, the first front wall wafer port, the second front wall wafer port, and the back wall wafer port.