Giorgio C Giaretta

US Patent:

6510265, Jan 21, 2003

Filed:

Apr 20, 2000

Appl. No.:

09/552773

Inventors:

Giorgio Giaretta - Westfield NJ
Steven Eugene Golowich - New Providence NJ
Paul Francis Kolesar - Middletown NJ
Martin C Nuss - Holmdel NJ
Albert John Ritger - Lawrenceville GA
Ian A White - Dunwoody GA

Assignee:

Lucent Technologies Inc. - Murray Hill NJ

International Classification:

G02B 642

US Classification:

385 38, 385 33

Abstract:

A method and apparatus for overcoming modal noise penalties associated with multi-mode fiber optic links operating at high data rates on the order of 10 Gb/s. The method involves restricting the center launch condition of optical signals into the multi-mode fiber while permitting loose tolerances between source and fiber.

US Patent:

6542723, Apr 1, 2003

Filed:

Feb 11, 2000

Appl. No.:

09/503036

Inventors:

Tak Kit Dennis Tong - Middletown NJ
Giorgio Giaretta - Westfield NJ

Assignee:

Lucent Technologies Inc. - Murray Hill NJ

International Classification:

H04B 106

US Classification:

455260, 455118, 455259, 455264, 455265, 375373, 375376, 331 17, 331 18, 332127, 332138

Abstract:

An optoelectronic phase locked loop for clock recovery in high-speed optical time division multiplexed systems. The optoelectronic phase locked loop includes a balanced photodetector through which the polarity ambiguity in error signal is resolved and the cancellation of laser noise enabling clock recovery with low timing jitter. The optoelectronic phase locked loop also includes an electroabsorption modulator as a phase detector, a lowpass filter, a variable controlled oscillator, a power divider and an amplifer.

US Patent:

6586678, Jul 1, 2003

Filed:

Feb 14, 2002

Appl. No.:

10/077067

Inventors:

Paul K. Rosenberg - Sunnyvale CA
Giorgio Giaretta - Mountain View CA
Stefano Schiaffino - Menlo Park CA
Rudolf J. Hofmeister - Sunnyvale CA

Assignee:

Finisar Corporation - Sunnyvale CA

International Classification:

H01L 2302

US Classification:

174 525, 174 521

Abstract:

An improved transistor header assembly incorporating a rectangular platform perpendicularly bisecting the base of the transistor header. The ceramic platform provides the ability to house multiple electrical components and/or devices on either side of the base. The platform has a higher thermal conductivity than the base of a standard header. In addition, the platform increases the electrical input/output density of the header by increasing the number of potential electrical connections between the two sides of the base.

US Patent:

6690682, Feb 10, 2004

Filed:

Nov 22, 1999

Appl. No.:

09/444780

Inventors:

Giorgio Giaretta - Westfield NJ
Ashok V. Krishnamoorthy - Middletown NJ
Anthony Lodovico Lentine - Holmdel NJ
Martin C. Nuss - Fair Haven NJ
Ted Kirk Woodward - Holmdel NJ

Assignee:

Lucent Technologies Inc. - Murray Hill NJ

International Classification:

H04J 304

US Classification:

370535, 370389, 370476, 359133, 341141

Abstract:

A system for data transmission and communication receives a plurality of Gigabit Ethernet data packets from multiple Gigabit Ethernet links. The system bit multiplexes the data packets, on a bit by bit basis, together onto a fiber optic link. At the output of the fiber optic link, the bits are demultiplexed into data packets and transmitted onto multiple Gigabit Ethernet links. The high speed fiber optic link transmits the data at higher speed than is possible over each individual Gigabit Ethernet link.

US Patent:

6703561, Mar 9, 2004

Filed:

Aug 29, 2002

Appl. No.:

10/231395

Inventors:

Paul K. Rosenberg - Sunnyvale CA
Giorgio Giaretta - Mountain View CA
Stefano Schiaffino - Menlo Park CA
James Stewart - San Jose CA
Rudolf J. Hofmeister - Sunnyvale CA

Assignee:

Finisar Corporation - Sunnyvale CA

International Classification:

H01L 2302

US Classification:

174 525, 174 521, 361714, 361717

Abstract:

A header assembly including a base and a platform extending through the base and substantially perpendicular thereto. The platform includes conductive pathways that connect electrical components on either side of the base, and the conductive pathways cooperate to form a connector at the first end of the platform. A laser is mounted on top of a thermoelectric cooler that is directly joined to the second end of the platform. The laser and thermoelectric cooler are enclosed in a hermetic chamber cooperatively defined by the base, the platform, and a cap that is joined to the base. A photodiode optically coupled with the laser and a thermistor thermally coupled with the laser cooperate with the thermoelectric cooler and a control circuit to facilitate control of the performance of the laser.

US Patent:

6704343, Mar 9, 2004

Filed:

Jul 18, 2002

Appl. No.:

10/198229

Inventors:

Hongyu Deng - Arcadia CA
Thomas Lenosky - Mountain View CA
Giorgio Giaretta - Mountain View CA
Jan Lipson - Cupertino CA

Assignee:

Finisar Corporation - Sunnyvale CA

International Classification:

H01S 3082

US Classification:

372 97, 372 46

Abstract:

A single mode high power vertical cavity surface emitting laser (VCSEL) using photonic crystals. A photonic crystal is included in at least one mirror layer of a VCSEL. The reflectivity of the photonic crystal is dependent on the wavelength and incident angle of the photons. The photonic crystal can be formed such that the VCSEL lases at a single mode. Because a single mode is generated, the aperture of the VCSEL can be enlarged to increase the power that is generated by the VCSEL for that mode. The photonic crystal can be used with/without DBR layers. The photonic crystal, in one example, forms an external cavity.

US Patent:

6841733, Jan 11, 2005

Filed:

Sep 4, 2003

Appl. No.:

10/654692

Inventors:

Stefano Schiaffino - Pleasanton CA, US
Giorgio Giaretta - Mountain View CA, US
Patrick Unold - Wolfratshausen, DE
Mina Farr - Palo Alto CA, US

Assignee:

Finisar Corporation - Sunnyvale CA

International Classification:

H01L 2302

US Classification:

174 525, 174 521, 361714, 361717

Abstract:

An improved monitoring and control system for a laser in a header assembly of a transmitter optical subassembly (“TOSA”) is disclosed. The monitoring and control system, includes one or more monitor photodiodes (“MPDs”), is positioned together with the laser on a component submount. The submount in turn is mated with a multi-layer platform (“MLP”) that forms part of the header assembly. The MLP hermetically extends through the header assembly to provide a plurality of electrical interconnects for the laser, MPD(s), and other submount components. In one embodiment, a single MPD is located proximate the laser to receive back facet laser light emission. Measurement of the back facet emission enables the MPD to determine laser intensity. In another embodiment, two MPDs are joined together to receive the back facet laser light emission. Comparison of each MPD's measurement enables the laser's wavelength to be determined and adjusted to optimize its performance.

US Patent:

6852928, Feb 8, 2005

Filed:

Jul 28, 2003

Appl. No.:

10/629724

Inventors:

Giorgio Giaretta - Mountain View CA, US
Stefano Schiaffino - Menlo Park CA, US
Dev E. Kumar - San Jose CA, US

Assignee:

Finisar Corporation - Sunnyvale CA

International Classification:

H01L023/02

US Classification:

174 525, 361714, 361719, 385 92, 174 521

Abstract:

A transistor header assembly for use in transmitter optical subassemblies of optical transceivers. The header assembly has a base with a platform extending through. The platform has a conductive trace extending through the platform for making connections on both sides of the base. A thermoelectric cooler (TEC) is used to dissipate heat from a laser within the header assembly. The TEC dissipates heat sufficiently to allow an externally modulated laser (EML) to be used in the header assembly. In this manner, EMLs can be used in relatively small optical devices, including small form factor transceivers that comply with the XFP standard. The XFP modules with EMLs can be used for longer links than XFPs without EMLs. In addition, EMLs can be stabilized using TECs so that XFP modules can be used for DWDM-type applications.