Gursharan G Singh
age ~47
from Manteca, CA
- Also known as:
-
- Gurshran S Singh
- Gusharan Singh
- Singh Singh
- Gursharan Singu
- Singh Gursharan
- R Singh
Gursharan Singh Phones & Addresses
- Manteca, CA
- Hayward, CA
- Bay Point, CA
- 5120 Canada Hills Dr, Antioch, CA 94531 • 9256288734
- Sonora, CA
- Concord, CA
- Tracy, CA
- 28354 Capitola St, Hayward, CA 94545
Us Patents
-
Predictive Modeling For E-Commerce Advertising Systems And Methods
view source -
US Patent:20130138507, May 30, 2013
-
Filed:Nov 30, 2011
-
Appl. No.:13/308527
-
Inventors:Amit Kumar - San Jose CA, US
Gursharan Singh - Mountain View CA, US
Andrew Pariser - Palo Alto CA, US
Santiago Akle - Woodside CA, US
Ilana Segall - San Francisco CA, US -
International Classification:G06Q 30/02
-
US Classification:705 1454
-
Abstract:Systems and methods for facilitating a predictive advertising campaign are disclosed herein, in one embodiment an advertising analytics server is programmed with a predictive advertising engine and an advertisement personalization engine. The advertising analytics server is communicatively coupled to one or more e-commerce sites, search engines, Web browsers or other Web sites. The advertising analytics server and its constituent components are capable of implementing predictive advertising models and rules that automatically generate advertisements on behalf of e-commerce sites by analyzing data (analytics) from the e-commerce sites or individual consumers. Advertisements are optimally generated for e-commerce businesses based on statistical models that predict consumer behavior, preferences, and likelihood of purchases. Using these models, e-commerce businesses are able to advertise their products and services, bid on key words and target a variety of consumers in a personalized, targeted and cost effective manner, resulting in increased revenue and efficient allocation of marketing resources.
-
Distributed Tag-Based Correlation Engine
view source -
US Patent:20110270841, Nov 3, 2011
-
Filed:Apr 28, 2010
-
Appl. No.:12/769217
-
Inventors:Manish Bhardwaj - San Jose CA, US
Jining Tian - Cupertino CA, US
Gursharan Singh - San Jose CA, US -
Assignee:Cisco Technology, Inc. - San Jose CA
-
International Classification:G06F 17/30
-
US Classification:707741, 707E17002
-
Abstract:Systems may use explicit ratings from users to construct user to user correlations. This technique may reduce the user-content correlation to a single dimension, i.e., the content that a plurality of users may rate similarly. Embodiments of the present invention may use DHT as an underlying distributed signaling mechanism, but may also make the rating implicit. Furthermore, embodiments of the present invention may construct the user to content correlation based on multi-dimensional metadata related to the content.
-
Semiconductor Package And Method Of Fabricating Semiconductor Package
view source -
US Patent:20180114773, Apr 26, 2018
-
Filed:Sep 14, 2017
-
Appl. No.:15/704984
-
Inventors:- Shanghai, CN
Tiger Tai - Shanghai, CN
Ken Qian - Shanghai, CN
CC Liao - Changhua, TW
Hem Takiar - Fremont CA, US
Gursharan Singh - Fremont CA, US -
Assignee:SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD . - Shanghai
-
International Classification:H01L 25/065
H01L 25/00 -
Abstract:The present technology relates to a semiconductor package. The semiconductor package comprises: a first component comprising a plurality of first dies stacked on top of each other, each of first dies comprising at least one side surface and an electrical contact exposed on the side surface, and the plurality of first dies aligned so that the corresponding side surfaces of all first dies substantially coplanar with respect to each other to form a common sidewall; a first conductive pattern formed over the sidewall and at least partially spaced away from the sidewall, the first conductive pattern electrically interconnecting the electrical contacts of the plurality of first dies; at least one second component; and a second conductive pattern formed on a surface of the second component, the second conductive pattern affixed and electrically connected to the first conductive pattern formed over the sidewall of the first component.
-
Semiconductor Device
view source -
US Patent:20180114777, Apr 26, 2018
-
Filed:Sep 14, 2017
-
Appl. No.:15/704996
-
Inventors:- Shanghai, CN
Hem Takiar - Fremont CA, US
Gursharan Singh - Fremont CA, US
Fisher Yu - Shanghai, CN
CC Liao - Changhua, TW -
Assignee:SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD. - Shanghai
-
International Classification:H01L 25/065
H01L 23/31 -
Abstract:The present technology relates to a semiconductor device. The semiconductor device comprises: a plurality of dies stacked on top of each other, each of the dies comprising a first major surface, an IO conductive pattern on the first major surface and extended to a minor surface substantially perpendicular to the major surfaces to form at least one IO electrical contact on the minor surface, and the plurality of dies aligned so that the corresponding minor surfaces of all dies substantially coplanar with respect to each other to form a common flat sidewall, and a plurality of IO routing traces formed over the sidewall and at least partially spaced away from the sidewall. The plurality of IO routing traces are spaced apart from each other in a first direction on the sidewall, and each of IO routing traces is electrically connected to a respective IO electrical contact and extended across the sidewall in a second direction substantially perpendicular to the first direction on the sidewall.
-
High Yield Semiconductor Device
view source -
US Patent:20150061157, Mar 5, 2015
-
Filed:Aug 1, 2014
-
Appl. No.:14/450005
-
Inventors:- Shanghai, CN
Zhong Lu - Shanghai, CN
Gursharan Singh - Fremont CA, US
Wei Gu - Shanghai, CN -
International Classification:H01L 25/065
H01L 21/56
H01L 21/66
H01L 23/31 -
US Classification:257777, 438 15
-
Abstract:A semiconductor device including two or more die stacks mounted to a substrate. The first die stack is mounted, at least partially encapsulated, and then tested. If the first die stack functions within predefined parameters, a second die stack is mounted on the first die stack, and then the device may undergo a second encapsulation process. Testing the first die stack before mounting the second improves yield by identifying faulty semiconductor die before all die are mounted within the semiconductor device.
Amazon
Climate Change, Sustainable Development and India: Need for New Economic Thought
view sourceClimate change is no longer a distant concern, but a serious threat to development and poverty eradication. The Third Assessment Report of the Intergovernmental Panel on Climate Change draws attention to the fact that the impacts of climate change will fall disproportionately upon developing countri...
Author
Gursharan Singh Kainth
Binding
Paperback
Pages
140
Publisher
LAP LAMBERT Academic Publishing
ISBN #
3847317369
EAN Code
9783847317364
ISBN #
10
Sustainable Development of Forest: Some Issues
view sourceThe present study presents an overview of the changing state of the forests and explores hypotheses regarding the causes of change in the forest cover and its quality. It also gives a brief overview of the economic importance of the forests and the legal and institutional framework for the forest...
Author
Dr Gursharan Singh Kainth
Binding
Paperback
Pages
180
Publisher
LAP LAMBERT Academic Publishing
ISBN #
384651439X
EAN Code
9783846514399
ISBN #
9
Next Generation Biofuels: The Key to India's Sustainable Energy Needs
view sourceBiofuels hold out the promise of a win-win-win solution. The race is on for a new form of fuel. With gasoline skyrocketing, dependence on imported oil and depleting resources worldwide, finding alternatives to petroleum-based fuel and fuel-related products is urgent. 1G biofuels increase greenhous...
Author
Dr. Gursharan Singh Kainth
Binding
Paperback
Pages
144
Publisher
LAP LAMBERT Academic Publishing
ISBN #
3845470062
EAN Code
9783845470061
ISBN #
8
Mobile Banking: A Boon for Unbanked
view sourceE-Governance has come a long way in providing services to people which has improved the efficiency. Many of the departments and organizations have done great job but the progress has not been as quick as it should have been. Of course this is a journey which cannot be done in a day's time. That's...
Author
Damanpreet Kaur, Dr Gursharan Singh Kainth
Binding
Paperback
Pages
64
Publisher
LAP LAMBERT Academic Publishing
ISBN #
3845436239
EAN Code
9783845436234
ISBN #
7
Aadhaar India: Brand for a Billion: The Beginning of the Journey
view sourceThe capability and freedom enhancing social policies generates stable civil societies. Indian Government have implemented new social programs and safety nets to tackle poverty, health and education challenges. The ambitions of these programs have been marred by challenges. The significant one has be...
Author
Gursharan Singh Kainth
Binding
Paperback
Pages
84
Publisher
LAP LAMBERT Academic Publishing
ISBN #
3845428031
EAN Code
9783845428031
ISBN #
6
Adoption of Technology in Teaching of Language:: A Critical Assessment of Punjabi (Mother Tongue)
view sourceMother-tongue plays a paramount role in child’s development. It is the heart and soul of child's education. It is the foundation on which the personality of the child is built. The study of mother-tongue is of dire necessity on psychological, intellectual, emotional and cultural grounds. It is our d...
Author
Gursharan Singh Kainth, Mandeep Kaur
Binding
Paperback
Pages
60
Publisher
LAP LAMBERT Academic Publishing
ISBN #
3845420146
EAN Code
9783845420141
ISBN #
5
Job Satisfaction of College Teachers
view sourceUndoubtedly, teacher occupies an important place in the development of the nation. The social well-being and growth of pupils depends to a great extent on the enthusiasm, efficiency and professional skills of the teachers. The future of education, its quality and ideals depend upon how and by whom y...
Author
Gurinder Kaur, Gursharan Singh Kainth
Binding
Paperback
Pages
388
Publisher
LAP LAMBERT Academic Publishing
ISBN #
3659326836
EAN Code
9783659326837
ISBN #
4
Disclosure Practices in Indian Banking Sector: A Comparative Study
view sourceGovernance is a reform package to strengthen the corporate for making them more accountable,open, transparent,democratic and participatory. Governance in banks is a more complex issue than in other sectors because bank activities are less transparent and thus it is more difficult for shareholders a...
Author
Jyoti Soi, Gursharan Singh Kainth
Binding
Paperback
Pages
236
Publisher
LAP LAMBERT Academic Publishing
ISBN #
3659219932
EAN Code
9783659219931
ISBN #
3
Owner
Liquor Store
4082586254
Retail Grocery
Drywall · Insulation · Plastering
5104600022
Medicine Doctors
Gursharan Singh
view source323 E Ctr St, Mahanoy City, PA 17948
5707732301 (phone), 5707731105 (fax)
Gov't Med Coll, Guru Nanak Dev Univ, Amritsar, Punjab, India
Graduated: 1973
Acute Pharyngitis
Acute Sinusitis
Acute Upper Respiratory Tract Infections
Allergic Rhinitis
Gursharan Singh
view sourceGeneral Practice
Internal Medicine
Pediatrics
Allergy
Resumes
Gursharan Singh
view source
Gursharan Singh
view source
Gursharan Singh
view source
Gursharan Singh
view source
Gursharan Preet Singh
view source
Gursharan Singh
view source
Vp Fulfillment Operation At Sandisk Corporation
view sourceVP Fulfillment Operation
Gursharan Singh
view sourceIsbn (Books And Publications)
History of Pepsu: Patiala and East Punjab States Union, 1948-1956
view sourceAuthor
Gursharan Singh
ISBN #
8122002447
Classmates
Gursharan Singh
view source
Gursharan Singh
view source
Gursharan Singh | Gillies...
view source
International School, Ams...
view sourceGursharan Singh (1990-1993),
Gursharan Singh (1989-1993),
Adrian Streat (1987-1989),
Dorothea van Oort (1954-1958)
Gursharan Singh Singh
view source
Gursharan Jeet Singh
view source
Gursharan Garry Singh
view source
Gursharan Singh Gursharan...
view source
Gursharan Preet Singh
view source
Gursharan Deol Singh
view source
Gursharan Deep Singh
view source
Gursharan Singh Singh
view sourceMyspace
Youtube
Flickr
Googleplus
Gursharan Singh
Gursharan Singh
Banwait Enterprises
Gursharan Singh
PUNCOM - Engg. R&D (2008-2010)
Gursharan Singh
Gurshsharan Singh - Teacher (12-9)
Gursharan Singh
Gursharan Singh
Gursharan Singh
Gursharan Singh
News
Canadian man pleads guilty in NY drug smuggling case
view source- Gursharan Singh, of Brampton, Ontario, pleaded guilty Thursday in federal court in Buffalo to conspiracy to possess with intent to distribute five or more kilograms of cocaine. He faces a mandatory minimum sentence of 10 years in prison and a $10 million fine at sentencing in November.
- Date: Jul 29, 2016
- Source: Google
Plaxo
gursharan singh
view source
Gursharan Singh Sahni
view source
gursharan singh
view sourceGet Report for Gursharan G Singh from Manteca, CA, age ~47