Jennifer L Schuler

US Patent:

20220304175, Sep 22, 2022

Filed:

Jun 6, 2022

Appl. No.:

17/805641

Inventors:

- Cupertino CA, US
Abhijeet Misra - Sunnyvale CA, US
Anthony D. Prescenzi - Half Moon Bay CA, US
Brian M. Gable - Los Gatos CA, US
Christopher D. Prest - San Francisco CA, US
Hoishun Li - San Jose CA, US
James A. Yurko - Saratoga CA, US
Lee E. Hooton - Massapequa NY, US
Michael B. Wittenberg - San Francisco CA, US
Richard H. Dinh - Saratoga CA, US
Jennifer D. Schuler - Mountain View CA, US

International Classification:

H05K 5/04
H05K 5/00
H05K 5/02

Abstract:

A component for an electronic device can include a pre-formed substrate comprising a first metal and an additively manufactured portion bonded to the pre-formed substrate. The additively manufactured portion can include a first portion comprising a second metal and defining a volume, the first portion having a first value of a material property, and a second portion disposed in the volume, the second portion having a second value of the material property that is different from the first value.