John E Mcmillan

US Patent:

6337228, Jan 8, 2002

Filed:

May 12, 1999

Appl. No.:

09/310660

Inventors:

Frank J. Juskey - Phoenix AZ
John R. McMillan - Chandler AZ
Ronald P. Huemoeller - Chandler AZ

Assignee:

Amkor Technology, Inc. - Chandler AZ

International Classification:

H01L 2144

US Classification:

438122, 438121, 257706

Abstract:

A low-cost printed circuit board for a semiconductor package having the footprint of a ball grid array package has an integral heat sink, or âslug,â for the mounting of one or more semiconductor chips, capable of efficiently conducting away at least five watts from the package in typical applications. It is made by forming an opening through a sheet, or substrate, of B-stage epoxy/fiberglass composite, or âpre-preg,â then inserting a slug of a thermally conductive material having the same size and shape as the opening into the opening. The slug-containing composite is sandwiched between two thin layers of a conductive metal, preferably copper, and the resulting sandwich is simultaneously pressed and heated between the platen of a heated press. The heat and pressure forces the resin to the surface of the composite and into the space between the slug and the walls of the composite, where it solidifies, bonding the edges of the slug to the substrate within the opening and adhering the conductive layers to the upper and lower surfaces of the substrate. The resulting laminate can thereafter be processed as a convention printed circuit board to incorporate conventional circuit board features, e. g.

US Patent:

6507102, Jan 14, 2003

Filed:

Dec 5, 2001

Appl. No.:

10/006642

Inventors:

Frank J. Juskey - Phoenix AZ
John R. McMillan - Chandler AZ
Ronald P. Huemoeller - Chandler AZ

Assignee:

Amkor Technology, Inc. - Chandler AZ

International Classification:

H01L 2310

US Classification:

257706, 438121, 438122

Abstract:

A low-cost printed circuit board for a semiconductor package having the footprint of a ball grid array package has an integral heat sink, or âslug,â for the mounting of one or more semiconductor chips, capable of efficiently conducting away at least five watts from the package in typical applications. It is made by forming an opening through a sheet, or substrate, of B-stage epoxy/fiberglass composite, or âpre-preg,â then inserting a slug of a thermally conductive material having the same size and shape as the opening into the opening. The slug-containing composite is sandwiched between two thin layers of a conductive metal, preferably copper, and the resulting sandwich is simultaneously pressed and heated between the platen of a heated press. The heat and pressure forces the resin to the surface of the composite and into the space between the slug and the walls of the composite, where it solidifies, bonding the edges of the slug to the substrate within the opening and adhering the conductive layers to the upper and lower surfaces of the substrate. The resulting laminate can thereafter be processed as a convention printed circuit board to incorporate conventional circuit board features, e. g.

US Patent:

54358175, Jul 25, 1995

Filed:

May 20, 1994

Appl. No.:

8/246383

Inventors:

George B. Davis - Frederick MD
Joseph J. Kopp - Decatur GA
John A. McMillan - Atlanta GA

Assignee:

Honeywell Inc. - Minneapolis MN

International Classification:

B01D 4602

US Classification:

55337

Abstract:

A portable and compact room air purifier having an internal filter element through which air is drawn by a centrifugal fan and wherein the air is discharged generally uniformly and radially by passing between at least one generally arcuate scroll and a surrounding deflector. The purifier is automatically deactivated in the event of destruction or removal of the filter housing.