Lian Ping L Yao

US Patent:

20080032429, Feb 7, 2008

Filed:

Nov 9, 2005

Appl. No.:

11/270771

Inventors:

Da Chen - San Jose CA, US
Christophe Fouquet - Sunnyvale CA, US
Saibal Banerjee - Fremont CA, US
Santosh Bhattacharyya - San Jose CA, US
Joe Wang - Sunnyvale CA, US
Lian Yao - Woodridge IL, US
Mike van Riet - Morgan Hill CA, US
Igor Germanenko - San Jose CA, US

International Classification:

H01L 21/66

US Classification:

438 14

Abstract:

Methods, defect review tools, and systems for locating a defect in a defect review process are provided. One method includes acquiring one or more images and data from an inspection tool. The one or more images illustrate an area on a specimen in which a defect to be reviewed is located. The data indicates a position and features of the defect within the area. The method also includes acquiring one or more additional images of the specimen proximate the position of the defect indicated in the data using an imaging subsystem of a defect review tool. In addition, the method includes identifying a portion of the one or more additional images that corresponds to the one or more images. The method further includes determining a position of the defect within the portion of the one or more additional images using the data.