Mark A Brooks

US Patent:

6414250, Jul 2, 2002

Filed:

Dec 30, 2000

Appl. No.:

09/752999

Inventors:

Hiroo Inoue - North Mankato MN
Michael Howieson - Good Thunder MN
Mark Brooks - North Mankato MN

Assignee:

Thin Film Technology Corp. - North Mankato MN

International Classification:

H01R 1204

US Classification:

174261, 174255, 257701, 257700, 333246

Abstract:

Thin film, multi-layered components wherein the layers are hermetically sealed with a re-flowed conductive sealant (e. g. Pb/Sn solder). The sealant is applied to an endless ground conductor at the peripheral edge of at least one of each pair of opposed substrate layers prior to registering the conductors and re-flowing the sealant. The microstrip conductors comprise thin film adhesion and seed layers and a covering metalization. The signal and ground conductors are terminated with solder balls and the signal and ground conductors are connected with micro vias that extend through the substrates.

US Patent:

6596566, Jul 22, 2003

Filed:

Oct 12, 2001

Appl. No.:

09/977735

Inventors:

Mark Brooks - Mankato MN 56001
Gary Seibel - North Mankato MN 56003

International Classification:

H01L 2144

US Classification:

438125, 438126, 438127, 438106, 257787, 257790

Abstract:

Conformal-coated devices packaged to be compatible with automated handling equipment. In one arrangement, open-sided, injection-molded shells are mounted around conformal-coated devices to provide dimensionally stable packaging that is compatible with device carriers and automated packaging tool heads that are indexed to select and place the devices. In another arrangement, the coating is heated and additional material is added and re-flowed to define unique surface regions compatible with automated handling equipment.

US Patent:

6828876, Dec 7, 2004

Filed:

Nov 2, 2001

Appl. No.:

10/005794

Inventors:

Mark Brooks - North Mankato MN
Hiroo Inoue - North Mankato MN

Assignee:

Thin Film Technology Corp. - North Mankato MN

International Classification:

H01P 308

US Classification:

333161, 333156, 333140

Abstract:

Thin film devices having conductors of non-uniform line width and line spacing between adjacent conductors at uncoupled regions of symmetrical conductive pathways. Several coil-shaped delay line circuits are disclosed wherein the innermost and outermost conductors exhibit different line width and spacing between adjoining conductors. The devices are constructed on rigid and flexible, folding substrates and necessary terminations are connected with solder filled vias and/or edge connections.

US Patent:

7200010, Apr 3, 2007

Filed:

Sep 24, 2003

Appl. No.:

10/669386

Inventors:

Mark Hamilton Broman - Mankato MN, US
Mike Howieson - Good Thunder MN, US
Tsuguhiko Takamura - North Mankato MN, US
Mark Brooks - Mankato MN, US
Yasutsugu Okamoto - North Mankato MN, US
Brent Huibregtse - Mankato MN, US

Assignee:

Thin Film Technology Corp. - North Mankato MN

International Classification:

H05K 7/02
H05K 7/06
H05K 7/08
H05K 7/10

US Classification:

361760, 361765, 361766

Abstract:

A thin film circuit module constructed for serial coupling to circuit conductors at printed and transmission line circuits. In one form of equalizer construction, thin film circuit elements are deposited on a supporting substrate and wherein a capacitor plate is defined a circuit resistor. Two connector applications serially couple the equalizer modules to trace conductors of a motherboard connector block and to cylindrical core conductors of a coaxial connector. Other hybrid equalizer constructions provide modules constructed of thin film resistors and pick-and-placed capacitors mounted piggyback to an equalizer module substrate.

US Patent:

50309315, Jul 9, 1991

Filed:

May 16, 1989

Appl. No.:

7/352354

Inventors:

Mark Brooks - North Mankato MN
J. Paul Ozawa - North Mankato MN
Gary L. Seibel - North Mankato MN

Assignee:

Thin Film Technology Corporation - North Mankato MN

International Classification:

H01P 900
H03H 730

US Classification:

333161

Abstract:

A flexible laminated delay line assembly formed to include a plurality of patterned regions which may be folded into sandwiched relation to one another without affecting electrical continuity. The transmission line layer is laminated between successively adjacent dielectric and ground plane layers. Windows cut into the ground plane and dielectric layers facilitate folding and decoupling of a support spine, folding of the conductor sections and sizing of the assembly. In one construction, the dielectric layers comprise a flexible insulative substrate laminated between upper and lower thermoset layers. In another construction the dielectric layers comprise a polyetherimide that is melt flowed about the pathways of the transmission line.

US Patent:

58150501, Sep 29, 1998

Filed:

Dec 27, 1996

Appl. No.:

8/773434

Inventors:

Mark Brooks - North Mankato MN
Mark Hamilton Broman - Mankato MN
Michael Howieson - Good Thunder MN

Assignee:

Thin Film Technology Corp. - North Mankato MN

International Classification:

H01P 118
H01P 900

US Classification:

333161

Abstract:

A thin film differential delay line configured in a strip line assembly on ceramic substrates for PECL logic applications. A number of alternative layered constructions are disclosed. Each assembly provides complementary serpentine conductors constructed in symmetrical arrangements, i. e. side-by-side, over-under and mirrored. Bordering ground conductors at the signal layer and adjacent ground planes layers shield the delay line conductors. Termination pads having plated through vias facilitate electrical couplings between the layers.

US Patent:

49423738, Jul 17, 1990

Filed:

Apr 11, 1988

Appl. No.:

7/180353

Inventors:

Paul Ozawa - North Mankato MN
Mark Brooks - North Mankato MN

Assignee:

Thin Film Technology Corporation - North Mankato MN

International Classification:

H01P 900

US Classification:

333161

Abstract:

Multi-layered, thick/thin film, nanosecond delay lines, the inductive/capacitive characteristics of which are tailored to provide line impedances yielding unit delays of 1 to 10 nanoseconds. The delay lines are constructed on a supporting ceramic, resin/fiber or plastic substrate. In alternative embodiments, a serpentine conductive layer of tailored line widths and conductor spacings is sandwiched relative to overlying dielectric layers of 25 to 200 microns thickness and associated ground plane layers. In another embodiment, multiple conductor layers are sandwiched relative to intervening dielectric and ground plane layers. Lateral contact pads/pins, vertical vias and jumper conductors permit circuit connection and interconnection of the layers.

US Patent:

61279064, Oct 3, 2000

Filed:

Feb 25, 1999

Appl. No.:

9/257451

Inventors:

Mark Brooks - North Mankato MN
Mark Hamilton Broman - Mankato MN

Assignee:

Thin Film Technology Corp. - North Mankato MN

International Classification:

H01P 120
H03H 700

US Classification:

333204

Abstract:

A modular thin film, distributed, lumped element band-pass filter. The filter circuitry is configured on a number of ceramic substrates. The component defining depositions are arranged to overlap and couple to one another with connecting vias. Alternative 800 MHz and 1. 9 GHz band-pass filter circuits are disclosed. Bordering ground conductors and covering ground planes shield lumped impedance resonator and overlapping capacitor elements. The layers are configured to accommodate a range of frequencies and permit pre-fabrication with subsequent laser trimming, assembly and packaging.