Mark T North

US Patent:

6405792, Jun 18, 2002

Filed:

Jul 24, 2001

Appl. No.:

09/911762

Inventors:

John H. Rosenfeld - Lancaster PA
Mark T. North - Lancaster PA

Assignee:

Thermal Corp. - Wilmington DE

International Classification:

F28D 2100

US Classification:

165164, 165907

Abstract:

The disclosure is for an easily assembled heat exchanger using an internal porous metal pad. The heat exchanger is constructed of two halves attached at their heat transfer surfaces. Each half includes a pan shaped casing, a pad of sintered porous metal, a manifold block with channels, and a lid. The porous pad is mounted between the heat transfer surface of the casing and the manifold. The lid includes input and output fluid holes which are connected to sets of alternating channels in the manifold block, so that adjacent channels are isolated from each other and are connected to only either the input or the output holes so that the fluid must flow through the pad. An alternative embodiment has the casings of the two halves formed as a single part.

US Patent:

6637502, Oct 28, 2003

Filed:

Apr 16, 2002

Appl. No.:

10/123843

Inventors:

Mark T. North - Lancaster PA
Steven E. Koffs - King of Prussia PA

Assignee:

Thermal Corp. - Stanton DE

International Classification:

H05K 720

US Classification:

165 803, 165185, 165121, 361697, 361704

Abstract:

A cooling system has a heat sink having a plurality of fins. A fan is positioned near the heat sink to blow air between the fins. A flow converging device is positioned between the fins and the fan, to cause air from the fan to converge on a predetermined region of the heat sink. The flow converging device may be, for example, a plurality of wedges or a body having a frustum shaped opening through the body.

US Patent:

7044199, May 16, 2006

Filed:

Oct 20, 2004

Appl. No.:

10/970404

Inventors:

John G. Thayer - Lancaster PA, US
Kevin L. Wert - Halifax PA, US
Mark T. North - Lancaster PA, US
C. Scott Schaeffer - Ephrata PA, US

Assignee:

Thermal Corp. - Wilmington DE

International Classification:

H05K 7/20

US Classification:

165 804, 16510428, 16510433, 165170, 165907, 361699, 361711

Abstract:

A heat exchanger for cooling a heat generating device including a base having a recess with a base coolant inlet opening and a base coolant outlet opening. A porous core is positioned within the recess of the base, and has a core coolant inlet opening and a core coolant outlet opening that are arranged in corresponding relation with base coolant inlet opening and a base coolant outlet opening so as to be in fluid communication. A porous gasket is pinched between the porous core and the base.

US Patent:

7690419, Apr 6, 2010

Filed:

May 3, 2006

Appl. No.:

11/381439

Inventors:

John G. Thayer - Lancaster PA, US
Kevin L. Wert - Halifax PA, US
Mark T. North - Lancaster PA, US
C. Scott Schaeffer - Ephrata PA, US

Assignee:

Thermal Corp. - Stanton DE

International Classification:

H05K 7/20

US Classification:

165 804, 165170, 165907, 361699

Abstract:

A heat exchanger for cooling a heat generating device including a base having a recess with a base coolant inlet opening and a base coolant outlet opening. A porous core is positioned within the recess of the base, and has a core coolant inlet opening and a core coolant outlet opening that are arranged in corresponding relation with base coolant inlet opening and a base coolant outlet opening so as to be in fluid communication. A porous gasket is pinched between the porous core and the base.

US Patent:

7914529, Mar 29, 2011

Filed:

Aug 2, 2005

Appl. No.:

11/195454

Inventors:

W. John Bilski - Mohnton PA, US
Mark T. North - Lancaster PA, US
David Joseph Mucko - Lancaster PA, US

Assignee:

Thermal Corp. - Wilmington DE

International Classification:

A61B 18/14

US Classification:

606 51

Abstract:

A cooling member for a cautery surgical instrument such as a surgical forceps including a pair of elongate arms joined at an end so as to provide for resilient compressible movement of the arms between a normally open position and a squeezed closed position. The cooling member provides for conduction of heat away from an electrode tip and includes a first portion having a first diameter, and a second portion spaced away from the first portion that transitions from the first diameter to at least one smaller diameter section. A socket is disposed within each arm of the forceps. The socket includes a longitudinal blind hole that is sized so as to releasably receive the smaller diameter section of the second portion, and a catch for engaging a portion of the arm.

US Patent:

8397796, Mar 19, 2013

Filed:

Apr 1, 2010

Appl. No.:

12/752910

Inventors:

John G. Thayer - Lancaster PA, US
Kevin L. Wert - Halifax PA, US
Mark T. North - Lancaster PA, US
C. Scott Schaeffer - Ephrata PA, US

Assignee:

Thermal Corp. - Wilmington DE

International Classification:

H05K 7/20

US Classification:

165 804, 165907, 361699

Abstract:

A heat exchanger for cooling a heat generating device including a base having a recess with a base coolant inlet opening and a base coolant outlet opening. A porous core is positioned within the recess of the base, and has a core coolant inlet opening and a core coolant outlet opening that are arranged in corresponding relation with base coolant inlet opening and a base coolant outlet opening so as to be in fluid communication. A porous gasket is pinched between the porous core and the base.

US Patent:

20020185726, Dec 12, 2002

Filed:

Jun 6, 2001

Appl. No.:

09/875231

Inventors:

Mark North - Lancaster PA, US
Nelson Gernert - Elizabethtown PA, US
Donald Ernst - Lancaster PA, US

International Classification:

H01L023/10

US Classification:

257/707000, 257/712000, 257/719000

Abstract:

An improved electronic chip package is disclosed, which may include an electrical insulator, top and bottom metallization layers associated with said insulator, an integrated circuit (IC) device, and a heat pipe placed between the electrical insulator and the IC device, and soldered to the IC device, wherein the wall of the heat pipe may be constructed so that thermal stresses in the IC device are reduced.

US Patent:

20040159934, Aug 19, 2004

Filed:

Feb 17, 2004

Appl. No.:

10/780322

Inventors:

Mark North - Lancaster PA, US
Nelson Gernert - Elizabethtown PA, US
Donald Ernst - Lancaster PA, US

International Classification:

H01L023/10

US Classification:

257/707000

Abstract:

An improved electronic chip package is disclosed, which may include an electrical insulator, top and bottom metallization layers associated with said insulator, an integrated circuit (IC) device, and a heat pipe placed between the electrical insulator and the IC device, and soldered to the IC device, wherein the wall of the heat pipe may be constructed so that thermal stresses in the IC device are reduced.