Martin W Cain

US Patent:

6887138, May 3, 2005

Filed:

Jun 20, 2003

Appl. No.:

10/601248

Inventors:

Brian E. Bottema - Austin TX, US
Larry J. Bustos - Kyle TX, US
Martin W. Cain - Maxwell TX, US
Nathan R. Brown - Cedar Park TX, US

Assignee:

Freescale Semiconductor, Inc. - Austin TX

International Classification:

B24B033/00

US Classification:

451 72, 451443, 451444

Abstract:

A chemical mechanical polishing (CMP) tool holds a conditioning disk that is used to remove impurities from a polishing disk used to planarize surfaces, such as a semiconductor surface. The tool uses an elastic disk that is positioned between a clamp and a gimbal hub that pivotally overlies a gimbal plate. The elastic disk is a polymer material, such as for example polytetrafluoroethylene (PTFE). The elastic disk has a central opening and is radially solid around the central opening. Alignment holes and drive mechanism holes pierce the elastic disk which functions to rotate the tool with minimal friction and provides a liquid seal from CMP fluids. Access holes in the gimbal plate permit easy installation and removal of the individual components. The PTFE disk is strong and durable enough to withstand high torque and provide lengthy operation without maintenance.