Masaru Terada

US Patent:

20210368625, Nov 25, 2021

Filed:

Aug 3, 2021

Appl. No.:

17/392817

Inventors:

- Tokyo, JP
Hiroyuki MATSUDA - Kanagawa, JP
Hiroshi AOKI - Hiroshima, JP
Masaru TERADA - Cary NC, US
Ovel EMERSON - Dunn NC, US
Paul A. LOWE - Hillsborough NC, US

International Classification:

H05K 1/18
H05K 5/02
H05K 5/00

Abstract:

Disclosed herein are devices, methods, and methods of making devices for facilitating condition monitoring of machinery allowing improve efficiencies and increased lifetime of the machinery while also reducing maintenance. In one embodiment, a device includes an enclosure assembly and a printed circuit board (PCB) assembly. The enclosure assembly includes a cap, a base mechanically coupled with the cap, and a support bracket mechanically coupled with the base. The PCB assembly includes a processor, a memory coupled with the processor, a first sensor electrically coupled with the processor, a second sensor electrically coupled with the processor, and a communication interface electrically coupled with the processor. The device, when installed, may generally form a shape of a tapered cylinder having a maximum height of 2.1 inches and a maximum diameter of 1.2 inches.