Michael O Liu

US Patent:

20180340832, Nov 29, 2018

Filed:

Jul 28, 2017

Appl. No.:

15/663037

Inventors:

- Santa Clara CA, US
Samuel C. HOWELLS - Portland OR, US
Wolfgang R. ADERHOLD - Cupertino CA, US
Leonid M. TERTITSKI - Los Gatos CA, US
Michael LIU - Saratoga CA, US
Dongming IU - Union City CA, US
Norman L. TAM - Cupertino CA, US
Ji-Dih HU - San Jose CA, US

International Classification:

G01J 5/00
H01L 21/324
G05D 23/19
H01L 21/66
H05B 1/02

Abstract:

Examples described herein generally relate to apparatus and methods for rapid thermal processing (RTP) of a substrate. In one example, a process chamber includes chamber body, a window disposed on a first portion of the chamber body, a chamber bottom, and a shield disposed on a second portion of the chamber body. The shield has a flat surface facing the window to reduce reflected radiant energy to a back side of a substrate disposed in the process chamber during operation. The process chamber further includes an edge support for supporting the substrate and a cooling member disposed on the chamber bottom. The cooling member is disposed in proximity of the edge support to cool the edge support during low temperature operation in order to improve the temperature uniformity of the substrate.