Rohinni
Principal Engineer - New Process and Technologies
Rohinni
Manufacturing Engineer
Triumph Group May 2013 - Apr 2016
Research and Development Engineer Iii
Triumph Group Oct 2011 - May 2013
Process Engineer Ii
Triumph Group Triumph Composite Systems 2008 - 2011
Tool Designer Ii
Education:
Western Washington University 1999 - 2004
Skills:
Composites Manufacturing Pro Engineer Mechanical Engineering Design For Manufacturing Engineering Product Development Aerospace Machining Catia Cad Lean Manufacturing Process Engineering Injection Molding Catia V4/V5 Machining of Composites Tooling Design Thermoplastic Composites Ms Office Suite Proengineer Electronics Packaging Product Design Design of Experiments Design Engineering Tool Design Ms Project Plastics Automation Gd 5S Solid Modeling
Interests:
Thermoplasic Composite Processing Tool Design Cad Modeling Proengineer Machining of Composites Automation Ultrasonic Non Destructive Testing
- Coeur d' Alene ID, US Andy Huska - Liberty Lake WA, US Sean Kupcow - Greenacres WA, US Nicholas Steven Busch - Spokane WA, US Cody Peterson - Hayden ID, US
A waterproof sealed circuit apparatus includes a circuit substrate having a first side opposite a second side. The first side includes a circuit trace. A semiconductor device die is electrically coupled to the circuit trace on the first side of the circuit substrate. A polymer sealing layer is adhered to the first side of the circuit substrate and covers the semiconductor device die. Polymer chains of the sealing layer are crosslinked.
Automated Press Cell System And Methods Of Using The Same For Forming Composite Materials