Peter Gruber

US Patent:

7980446, Jul 19, 2011

Filed:

Mar 6, 2009

Appl. No.:

12/399244

Inventors:

Stephen L. Buchwalter - Anthem AZ, US
Peter A. Gruber - Mohegan Lake NY, US
Paul A. Lauro - Brewster NY, US
Jae-Woong Nah - Closter NJ, US

Assignee:

International Businss Machines Corporation - Armonk NY

International Classification:

B23K 5/00
B23K 20/08
B22D 41/00

US Classification:

228 33, 228256, 22818021, 22818022, 222251, 222288, 222564, 222591

Abstract:

A portion of compliant material includes four walls defining a slot. The slot has a relatively large cross-section end in fluid communication with a solder reservoir, and also has a relatively small cross-section end opposed to the relatively large cross-section end. The slot has a generally elongate rectangular shape when viewed in plan, with a length perpendicular to a scan direction, a width, parallel to the scan direction, associated with the relatively large cross section end, and a width, parallel to the scan direction, associated with the relatively small cross section end. The slot is configured in the portion of compliant material such that the relatively small cross-section end of the slot normally remains substantially closed, but locally opens sufficiently to dispense solder from the reservoir when under fluid pressure and locally unsupported by a workpiece. Methods of operation and fabrication are also disclosed.

US Patent:

8136714, Mar 20, 2012

Filed:

Apr 18, 2011

Appl. No.:

13/088727

Inventors:

Stephen L. Buchwalter - Anthem AZ, US
Peter A. Gruber - Mohegan Lake NY, US
Paul A. Lauro - Brewster NY, US
Jae-Woong Nah - Closter NJ, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B23K 5/00
B23K 20/08
B22D 41/00

US Classification:

228 33, 228256, 22818021, 22818022, 222251, 222288, 222564, 222591

Abstract:

A portion of compliant material includes four walls defining a slot. The slot has a relatively large cross-section end in fluid communication with a solder reservoir, and also has a relatively small cross-section end opposed to the relatively large cross-section end. The slot has a generally elongate rectangular shape when viewed in plan, with a length perpendicular to a scan direction, a width, parallel to the scan direction, associated with the relatively large cross section end, and a width, parallel to the scan direction, associated with the relatively small cross section end. The slot is configured in the portion of compliant material such that the relatively small cross-section end of the slot normally remains substantially closed, but locally opens sufficiently to dispense solder from the reservoir when under fluid pressure and locally unsupported by a workpiece. Methods of operation and fabrication are also disclosed.

US Patent:

8162200, Apr 24, 2012

Filed:

Jun 9, 2011

Appl. No.:

13/156736

Inventors:

Stephen L. Buchwalter - Anthem AZ, US
Peter A. Gruber - Mohegan Lake NY, US
Paul A. Lauro - Brewster NY, US
Jae-Woong Nah - Closter NJ, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B23K 31/02
B26D 3/00
B29C 65/64

US Classification:

228 33, 22818022, 228256, 156256, 264145, 264152, 29428

Abstract:

A portion of compliant material includes four walls defining a slot. The slot has a relatively large cross-section end in fluid communication with a solder reservoir, and also has a relatively small cross-section end opposed to the relatively large cross-section end. The slot has a generally elongate rectangular shape when viewed in plan, with a length perpendicular to a scan direction, a width, parallel to the scan direction, associated with the relatively large cross section end, and a width, parallel to the scan direction, associated with the relatively small cross section end. The slot is configured in the portion of compliant material such that the relatively small cross-section end of the slot normally remains substantially closed, but locally opens sufficiently to dispense solder from the reservoir when under fluid pressure and locally unsupported by a workpiece. Methods of operation and fabrication are also disclosed.

US Patent:

8376207, Feb 19, 2013

Filed:

Feb 7, 2012

Appl. No.:

13/367466

Inventors:

Stephen L. Buchwalter - Anthem AZ, US
Peter A. Gruber - Mohegan Lake NY, US
Paul A. Lauro - Brewster NY, US
Jae-Woong Nah - Closter NJ, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B23K 5/00
B23K 20/08
B22D 41/00

US Classification:

228 33, 228256, 22818021, 22818022, 222251, 222288, 222564, 222591

Abstract:

A portion of compliant material includes four walls defining a slot. The slot has a relatively large cross-section end in fluid communication with a solder reservoir, and also has a relatively small cross-section end opposed to the relatively large cross-section end. The slot has a generally elongate rectangular shape when viewed in plan, with a length perpendicular to a scan direction, a width, parallel to the scan direction, associated with the relatively large cross section end, and a width, parallel to the scan direction, associated with the relatively small cross section end. The slot is configured in the portion of compliant material such that the relatively small cross-section end of the slot normally remains substantially closed, but locally opens sufficiently to dispense solder from the reservoir when under fluid pressure and locally unsupported by a workpiece. Methods of operation and fabrication are also disclosed.

US Patent:

20210151402, May 20, 2021

Filed:

Nov 18, 2019

Appl. No.:

16/686815

Inventors:

- Armonk NY, US
Stephen L. Buchwalter - Anthem AZ, US
Peter A. Gruber - Mohegan Lake NY, US
Paul Alfred Lauro - Brewster NY, US
Da-Yuan Shih - Poughkeepsie NY, US

International Classification:

H01L 23/00

Abstract:

Protruding solder structures are created for electrical attachment of semiconductor devices. A rigid mold having one or more mold openings is attached to and used in combination with a decal structure that has one or more decal holes. The decal structure is disposed on the rigid mold so that the decal openings are aligned over the mold openings. Each of the decal hole and mold opening in contact form a single combined volume. The single combined volumes are filled with solder to form protruding solder structures. Various structures and methods of making and using the structures are disclosed.

US Patent:

20200316702, Oct 8, 2020

Filed:

Apr 8, 2019

Appl. No.:

16/378547

Inventors:

- ARMONK NY, US
Stephen L. Buchwalter - Anthem AZ, US
Peter A. Gruber - Mohegan Lake NY, US
Da-Yuan Shih - Poughkeepsie NY, US
Paul Alfred Lauro - Brewster NY, US

International Classification:

B23K 3/06
B23K 3/08
H01L 23/00

Abstract:

In an Injection Molded Soldering system, a single, one-layer decal has one or more through hole patterns where each through hole pattern has a plurality of through holes through the decal. A drum with a drum circumference turns while the decal is forced to be adjacent to the drum circumference. The decal passes by a tangent point on the drum circumference where one or more solder-filled through hole patterns align with recessed openings on a substrate at the tangent point of the drum circumference. Applied heat causes the solder structures to melt and flow into the recessed openings.

US Patent:

20200020738, Jan 16, 2020

Filed:

Sep 23, 2019

Appl. No.:

16/578827

Inventors:

- Armonk NY, US
Stephen Buchwalter - Anthem AZ, US
Casimer DeCusatis - Poughkeepsie NY, US
Peter A. Gruber - Mohegan Lake NY, US
Da-Yuan Shih - Poughkeepsie NY, US

International Classification:

H01L 27/146
B29D 11/00
B82Y 30/00
G02B 3/00
H01L 31/0232
H01L 33/58
G02F 1/137
G02F 1/29

Abstract:

A wafer-scale apparatus and method is described for the automation of forming, aligning and attaching two-dimensional arrays of microoptic elements on semiconductor and other image display devices, backplanes, optoelectronic boards, and integrated optical systems. In an ordered fabrication sequence, a mold plate comprised of optically designed cavities is formed by reactive ion etching or alternative processes, optionally coated with a release material layer and filled with optically specified materials by an automated fluid-injection and defect-inspection subsystem. Optical alignment fiducials guide the disclosed transfer and attachment processes to achieve specified tolerances between the microoptic elements and corresponding optoelectronic devices and circuits. The present invention applies to spectral filters, waveguides, fiber-optic mode-transformers, diffraction gratings, refractive lenses, diffractive lens/Fresnel zone plates, reflectors, and to combinations of elements and devices, including microelectromechanical systems and liquid crystal device matrices for adaptive, tunable elements. Preparation of interfacial layer properties and attachment process embodiments are taught.