Peter J Gruber

US Patent:

6341418, Jan 29, 2002

Filed:

Apr 29, 1999

Appl. No.:

09/301890

Inventors:

Guy P. Brouillette - Canton Shefford, CA
David H. Danovitch - Granby, CA
Peter A. Gruber - Mohegan Lake NY
Michael Liehr - Essex Junction VT
Carlos J. Sambucetti - Croton Hudson NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05K 334

US Classification:

29840, 29832, 29833, 12818022

Abstract:

A method for direct chip attach of a semiconductor chip to a circuit board by using solder bumps and an underfill layer is disclosed. In the method, a layer of in-situ polymeric mold material is first screen printed on the top surface of the semiconductor chip exposing a multiplicity of bond pads. The in-situ polymeric mold layer is formed with a multiplicity of apertures which are then filled with solder material in a molten solder screening process to form solder bumps. A thin flux-containing underfill material layer is then placed on top of a circuit board over a plurality of conductive pads which are arranged in a mirror image to the bond pads on the semiconductor chip. The semiconductor chip and the circuit board are then pressed together with the underfill layer inbetween and heated to a reflow temperature of higher than the melting temperature of the solder material until electrical communication is established between the bond pads and the conductive pads. In the bonded assembly, the in-situ polymeric mold layer and the underfill material layer forms a composite underfill to replace a conventional underfill material that must be injected between bonded chip and substrate by a capillary action in a time consuming process.

US Patent:

6362557, Mar 26, 2002

Filed:

Aug 28, 2000

Appl. No.:

09/649486

Inventors:

Peter A. Gruber - Mohegan Lake NY
Frederic Maurer - Valhalla NY
George F. Walker - New York NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 4108

US Classification:

31032302, 31032316

Abstract:

An actuator scaled to macroscopic or microscopic sizes, uses ultrasonic energy to induce motion of an object in a desired direction. The actuator includes one or more pair of piezoelectric transducers connected with a transducer tip. Supplying the piezoelectric transducers with alternating current electrical power causes the tip to vibrate at ultrasonic frequencies. Urging the vibrating tip into contact with a surface on the object at a selected angle of inclination induces the object to move in the desired direction at a rate determined by the inclination angle. Multiple actuators can be used to induce a fall range of movements of variously shaped objects. In microscopic form, the actuator can be used to create a MEMS device. The optional application of a compliant material either on the transducer tip or on the objects surface enhances the movement induced by the actuator.

US Patent:

6390439, May 21, 2002

Filed:

Apr 7, 1999

Appl. No.:

09/287370

Inventors:

Steven A. Cordes - Cortlandt Manor NY
David Hirsch Danovitch - Quebec, CA
Peter Alfred Gruber - Mohegan Lake NY
James Louis Speidell - Poughquaq NY
Joseph Peter Zinter - Brewster NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B29C 3300

US Classification:

249119, 249134, 249139, 156 60, 264219, 216 79, 216 99

Abstract:

Hybrid molds for molding a multiplicity of solder balls for use in a molten solder screening process and methods for preparing such molds are disclosed. A method for forming the multiplicity of cavities in a pyramidal shape by anisotropically etching a crystalline silicon substrate along a specific crystallographic plane is utilized to form a crystalline silicon face plate used in the present invention hybrid mold. In a preferred embodiment, a silicon face plate is bonded to a borosilicate glass backing plate by adhesive means in a method that ensures coplanarity is achieved between the top surfaces of the silicon face plate and the glass backing plate. In an alternate embodiment, an additional glass frame is used for bonding a silicon face plate to a glass backing plate, again with ensured coplanarity between the top surfaces of the silicon face plate and the glass frame. In a second alternate embodiment, a silicon face plate is encased in an extender material which may be borosilicate glass or a polymer. The encasing is performed on a leveling fixture such that the top surface of the silicon face plate and the top surface of the extender material after solidification are perfectly leveled.

US Patent:

6394334, May 28, 2002

Filed:

Mar 28, 2000

Appl. No.:

09/536810

Inventors:

Guy Paul Brouillette - Quebec, CA
Peter Alfred Gruber - Mohegan Lake NY
Frederic Maurer - Valhalla NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B23K 100

US Classification:

228 33, 228215

Abstract:

The present invention discloses a method and apparatus for forming solder bumps by a molten solder screening technique in which a flexible die head constructed of a metal sheet is utilized for maintaining an intimate contact between the die head and a solder receiving mold surface, The flexible die head, when used in combination with a pressure means, is capable of conforming to any curved mold surface as long as the curvature is not more than 2. 5 m per inch of die length. The present invention further provides a method and apparatus for filling a multiplicity of cavities in a mold surface by providing a stream of molten solder and then intimately contacting the surface of the molten solder with a multiplicity of cavities such that the molten solder readily fills the cavities. The apparatus further provides means for removing excess molten solder from the surface of the mold without disturbing the molten solder already filled in the cavities. The present invention further discloses a flexible die for dispensing molten solder consisting of a die body that is constructed of a metal sheet capable of flexing of not less than 1.

US Patent:

6425518, Jul 30, 2002

Filed:

Jul 25, 2001

Appl. No.:

09/912845

Inventors:

Peter Alfred Gruber - Mohegan Lake NY
Chon Cheong Lei - Poughkeepsie NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B23K 3102

US Classification:

228256, 228223, 22818021

Abstract:

There is provided a method for applying solder to an element on a surface of a substrate. The method comprises the steps of (a) placing a mold over the surface, where the mold includes a conduit that contains the solder, and (b) heating the solder to a molten state so that the solder flows from the conduit onto the element. The conduit enjoys two degrees of horizontal freedom with respect to the surface such that the conduit becomes substantially aligned with the element when the solder is in the molten state. There is also provided a system for applying solder to an element on a surface of a substrate.

US Patent:

6426241, Jul 30, 2002

Filed:

Nov 12, 1999

Appl. No.:

09/439112

Inventors:

Steven A. Cordes - Cortlandt Manor NY
Peter A. Gruber - Mohegan Lake NY
James L. Speidell - Poughquag NY
Wayne J. Howell - Williston VT
Thomas G. Ference - Essex Junction VT

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 2144

US Classification:

438108, 438124, 438126, 438127, 438637

Abstract:

A method for forming three-dimensional circuitization in a substrate is provided for forming conductive traces and via contacts. In the method, a substrate formed of a substantially insulating material is first provided, grooves and apertures in a top surface of and through the substrate are then formed, followed by filling the grooves and apertures with an electrically conductive material such as a solder. The method can be carried out at a low cost to produce high quality circuit substrates by utilizing an injection molded solder technique or a molten solder screening technique to fill the grooves and the apertures. The grooves and the apertures in the substrate may be formed by a variety of techniques such as chemical etching, physical machining and hot stamping.

US Patent:

6461136, Oct 8, 2002

Filed:

Aug 26, 1999

Appl. No.:

09/383325

Inventors:

Peter A. Gruber - Mohegan Lake NY
Frederic Maurer - Valhalla NY
Lubomyr Taras Romankiw - Briarcliff Manor NY

Assignee:

International Business Machines Corp. - Armonk NY

International Classification:

H05K 310

US Classification:

425110, 118213, 118301

Abstract:

An apparatus and a method for filling high aspect ratio holes in electronic substrates that can be advantageously used for filling holes having aspect ratios larger than 5:1 are disclosed. In the apparatus, a filler plate and a vacuum plate are used in conjunction with a connection means such that a gap is formed between the two plates to accommodate an electronic substrate equipped with high aspect ratio via holes. The filler plate is equipped with an injection slot while the vacuum plate is equipped with a vacuum slot such that when a substrate is sandwiched therein, via holes can be evacuated of air and injected with a liquid simultaneously from a bottom side and a top side of the substrate. The present invention novel apparatus and method allows the filling of via holes that have small diameters, i. e. , as small as 10 m, and high aspect ratios, i. e.

US Patent:

6527158, Mar 4, 2003

Filed:

Mar 28, 2000

Appl. No.:

09/537228

Inventors:

Guy Paul Brouillette - Quebec, CA
Peter Alfred Gruber - Mohegan Lake NY
Frederic Maurer - Valhalla NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B23K 2002

US Classification:

228 33, 228246

Abstract:

The present invention discloses a method and apparatus for forming solder bumps by a molten solder screening technique in which a flexible die head constructed of a metal sheet is utilized for maintaining an intimate contact between the die head and a solder receiving mold surface. The flexible die head, when used in combination with a pressure means, is capable of conforming to any curved mold surface as long as the curvature is not more than 2. 5 m per inch of die length.