Peter Duy Ngo

US Patent:

20170018597, Jan 19, 2017

Filed:

Sep 22, 2016

Appl. No.:

15/272913

Inventors:

- Falls Church VA, US
Peter Ngo - Cypress CA, US
Gershon Akerling - Culver City CA, US
Kevin M. Leong - Los Angeles CA, US
Patty Chang-Chien - Redondo Beach CA, US
Kelly J. Hennig - Torrance CA, US
William R. Deal - Redondo Beach CA, US

International Classification:

H01L 27/146
H01P 11/00
H01Q 13/02
H01L 31/18

Abstract:

A method and apparatus for integrating individual III-V MMICs into a micromachined waveguide package is disclosed. MMICs are screened prior to integration, allowing only known-good die to be integrated, leading to increased yield. The method and apparatus are used to implement a micro-integrated Focal Plane Array (mFPA) technology used for sub millimeter wave (SMMW) cameras, although many other applications are possible. MMICs of different technologies may be integrated into the same micromachined package thus achieving the same level of technology integration as in multi-wafer WLP integration.