Ren Liu

US Patent:

20160276136, Sep 22, 2016

Filed:

May 31, 2016

Appl. No.:

15/168575

Inventors:

- Santa Clara CA, US
Joseph Yudovsky - Campbell CA, US
Garry K. Kwong - San Jose CA, US
Tai T. Ngo - Dublin CA, US
Kevin Griffin - Livermore CA, US
Kenneth S. Collins - San Jose CA, US
Ren Liu - Sunnyvale CA, US

International Classification:

H01J 37/32

Abstract:

A modular plasma source assembly for use with a processing chamber is described. The assembly includes an RF hot electrode with an end dielectric and a sliding ground connection positioned adjacent the sides of the electrode. A seal foil connects the sliding ground connection to the housing to provide a grounded sliding ground connection separated from the hot electrode by the end dielectric. A coaxial feed line passes through a conduit into the RF hot electrode isolated from the processing environment so that the coaxial RF feed line is at atmospheric pressure while the plasma processing region is at reduced pressure.

US Patent:

20150048739, Feb 19, 2015

Filed:

Aug 15, 2014

Appl. No.:

14/460683

Inventors:

John C. Forster - Mountain View CA, US
Joseph Yudovsky - Campbell CA, US
Garry K. Kwong - San Jose CA, US
Tai T. Ngo - Dublin CA, US
Kevin Griffin - Livermore CA, US
Kenneth S. Collins - San Jose CA, US
Ren Liu - Sunnyvale CA, US

International Classification:

H01J 37/32

US Classification:

31511121

Abstract:

A modular plasma source assembly for use with a processing chamber is described. The assembly includes an RF hot electrode with an end dielectric and a sliding ground connection positioned adjacent the sides of the electrode. A seal foil connects the sliding ground connection to the housing to provide a grounded sliding ground connection separated from the hot electrode by the end dielectric. A coaxial feed line passes through a conduit into the RF hot electrode isolated from the processing environment so that the coaxial RF feed line is at atmospheric pressure while the plasma processing region is at reduced pressure.