Richard Wayne Case

US Patent:

49255223, May 15, 1990

Filed:

Aug 21, 1989

Appl. No.:

7/396257

Inventors:

Frank J. Avellino - Russell PA
Richard A. Case - Pittsfield PA
David T. Swanson - Warren PA

Assignee:

GTE Products Corporation - Stamford CT

International Classification:

H05K 306

US Classification:

156632

Abstract:

A method of making printed circuit boards having gold dot contacts formed on the terminal pads is disclosed. A first layer of copper is overlayed with a pattern of tin or solder which acts as a resist. The gold dot contacts are resistance welded to the terminal pads. The copper underlayment and its pattern of tin or solder carrying the gold dots is then bonded to an electrically insulating substrate, which can be flexible, to form a composite board which is then etched to form a printed circuit board having gold dot contacts thereon. Other materials than tin or solder can be employed so long as there is a difference in etchability between it and the copper foil.

US Patent:

51892758, Feb 23, 1993

Filed:

Aug 21, 1989

Appl. No.:

7/409850

Inventors:

Frank J. Avellino - Russell PA
Richard A. Case - Pittsfield PA
David T. Swanson - Warren PA

Assignee:

GTE Products Corporation - Danvers MA

International Classification:

B23K 1116
H01R 4302

US Classification:

219 5622

Abstract:

A method of applying discrete areas of a noble metal to individual pads on a flexible printed circuit board comprises the steps of forming a particular pattern of electrically conductive material on a flexible, electrically insulating substrate. The pattern includes individual pads. An aperture is formed through the electrically insulating substrate to expose a portion of the underside of at least one of the individual pads, and then contacting the underside with an electrode, contacting the upper surface of the individual pad with a wire comprised of the noble metal, applying a welding current between the electrode and the wire to weld the wire to the pad and severing the wire to leave a particular amount on the upper surface of the pad.