Richard D Hunt

US Patent:

6410637, Jun 25, 2002

Filed:

Nov 28, 2000

Appl. No.:

09/722347

Inventors:

Peter G. Odell - Mississauga, CA
Richard D. Hunt - Rochester NY
Thomas Thomson - Fairport NY
Yvonne J. M. Groot - Horst, NL
Jas Paul S. Dhillon - Pittsford NY
Michael F. Zona - Holley NY

Assignee:

Xerox Corporation - Stamford CT

International Classification:

C08K 304

US Classification:

524495, 524596, 524803, 524818, 252511, 430627, 428524

Abstract:

A waterborne coating composition for application to a donor member surface includes a resin binder, a conductive particle material, an additional particle material of either (1) graphite particles with a dispersant of polyacrylamide, polyethylene oxide, polyvinyl alcohol or mixtures thereof or (2) crosslinked polymer particles, and water. The waterborne coating composition exhibits superior stability and achieves suitable properties when coated upon a donor member surface, thereby permitting practical replacement of volatile organic components typically used in donor member coating compositions.

US Patent:

6456815, Sep 24, 2002

Filed:

Nov 28, 2000

Appl. No.:

09/724833

Inventors:

Peter G. Odell - Mississauga, CA
Thomas Thomson - Fairport NY
Jas Paul S. Dhillon - Pittsford NY
Yvonne J. M. Groot - Horst, NL
Michael F. Zona - Holley NY
Richard D. Hunt - Rochester NY

Assignee:

Xerox Corporation - Stamford CT

International Classification:

G03G 1508

US Classification:

399286, 428195, 492 53

Abstract:

The present invention relates to improved methods of coating donor members with waterbome coatings, wherein a resin, a pigment, and water are combined in proportions effective to provide a donor member precursor composition; the donor member precursor composition is subjected to high pressure communition to provide a donor member conductive coating composition; and the donor member coating composition is coated onto a substrate. The present method advantageously provides a donor member coating which is substantially free of air pockets or defects. In preferred embodiments the resin is a phenolic resin, preferably a waterborne phenolic resin, such as a phenol-formaldehyde resole, and in other preferred embodiments the pigment is selected from the group consisting of carbon black, graphite, magnetite, nigrosine, and combinations thereof.

US Patent:

8437818, May 7, 2013

Filed:

Oct 28, 2012

Appl. No.:

13/662490

Inventors:

Denis Amparo - White Plains NY, US
Richard Hunt - Park Ridge NJ, US
John Vivalda - Poughkeepsie NY, US
Daniel Yohannes - Stamford CT, US

Assignee:

Hypres, Inc. - Elmsford NY

International Classification:

H01L 23/48
H01L 27/00

US Classification:

505190, 505234

Abstract:

Superconducting integrated circuits require several wiring layers to distribute bias and signals across the circuit, which must cross each other both with and without contacts. All wiring lines and contacts must be fully superconducting, and in the prior art each wiring layer comprises a single metallic thin film. An alternative wiring layer is disclosed that comprises sequential layers of two or more different metals. Such a multi-metallic wiring layer may offer improved resistance to impurity diffusion, better surface passivation, and/or reduction of stress, beyond that which is attainable with a single-metallic wiring layer. The resulting process leads to improved margin and yield in an integrated circuit comprising a plurality of Josephson junctions. Several preferred embodiments are disclosed, for both planarized and non-planarized processes. These preferred and other methods may be applied to digital circuits based on Rapid Single Flux Quantum logic, and to quantum computing using Josephson junction qubits.

US Patent:

41716841, Oct 23, 1979

Filed:

Mar 18, 1977

Appl. No.:

5/779039

Inventors:

Warren E. Herr - Hasbrouck Heights NJ
Richard W. Hunt - Bethlehem CT

Assignee:

The De Laval Separator Company - Poughkeepsie NY

International Classification:

A01K 500

US Classification:

119 27

Abstract:

An animal feeding station having an improved design to facilitate feeding of the animal. In particular, a manger that has a bottom portion approximating a hemispherical shape, side wall portions extending upward from the bottom portion as a conical tangent of the hemisphere, a front wall portion which extends vertically upward and is tangential to the aforesaid hemispherical portion and a rearwardly, upwardly sloped flat surface portion which generally conforms to the position of the animal's lower jaw when ingesting its food. Further, a shroud is provided over the manger which has a top wall sloped and disposed in a manner which restricts the vertical movement of the animal's head until the animal moves rearwardly. Another feature of the stall is the provision of slidably removable side panels, which permit the animal to eat in relative isolation and without the eye distraction caused by being able to see animals outside the stall. Further, a bar shaped in the form of an arch extends over the rear portion of the animal so as to preclude mounting of the feeding animal by stable mates.

US Patent:

20170345990, Nov 30, 2017

Filed:

Aug 17, 2017

Appl. No.:

15/679935

Inventors:

- Elmsford NY, US
Alexander F. Kirichenko - Pleasantville NY, US
John Vivalda - Poughkeepsie NY, US
Richard Hunt - Park Ridge NJ, US

International Classification:

H01L 39/22
H01L 27/18
H01L 39/02
H01L 39/24

Abstract:

A method for increasing the integration level of superconducting electronic circuits, comprising fabricating a series of planarized electrically conductive layers patterned into wiring, separated by planarized insulating layers, with vias communicating between the conductive layers. Contrary to the standard sequence of patterning from the bottom up, the pattern of vias in at least one insulating layer is formed prior to the pattern of wiring in the underlying conductive layer. This enables a reduction in the number of planarization steps, leading to a fabrication process which is faster and more reliable. In a preferred embodiment, the superconductor is niobium and the insulator is silicon dioxide. This method can provide 10 or more wiring layers in a complex integrated circuit, and is compatible with non-planarized circuits placed above the planarized wiring layers.

US Patent:

20150119253, Apr 30, 2015

Filed:

Oct 7, 2014

Appl. No.:

14/508514

Inventors:

- Elmsford NY, US
Alexander F. Kirichenko - Pleasantville NY, US
John Vivalda - Poughkeepsie NY, US
Richard Hunt - Park Ridge NJ, US

International Classification:

H01L 39/22
H01L 39/02
H01L 27/18
H01L 39/24

US Classification:

505190, 257 31, 438 2, 505329

Abstract:

A method for increasing the integration level of superconducting electronic circuits, comprising fabricating a series of planarized electrically conductive layers patterned into wiring, separated by planarized insulating layers, with vias communicating between the conductive layers. Contrary to the standard sequence of patterning from the bottom up, the pattern of vias in at least one insulating layer is formed prior to the pattern of wiring in the underlying conductive layer. This enables a reduction in the number of planarization steps, leading to a fabrication process which is faster and more reliable. In a preferred embodiment, the superconductor is niobium and the insulator is silicon dioxide. This method can provide 10 or more wiring layers in a complex integrated circuit, and is compatible with non-planarized circuits placed above the planarized wiring layers.