Richard Nihan

US Patent:

56556462, Aug 12, 1997

Filed:

May 10, 1995

Appl. No.:

8/438900

Inventors:

Martin Soderlund - Westboro MA
Richard Nihan - Dracut MA

Assignee:

BTU International - N. Billerica MA

International Classification:

B65G 1500

US Classification:

198841

Abstract:

A system provides support for the underside of a planar object, such as a printed circuit board. The system includes a flexible loop having an outer face from which support elements protrude. A guide positions the flexible loop to align the support elements with one or more selected locations on the underside of the object. The system can also include a device for moving the guide toward or away from the object as desired. A tensioning element can be provided that is responsive to displacement of the guide to maintain a substantially constant tension on the loop.

US Patent:

57852332, Jul 28, 1998

Filed:

Feb 1, 1996

Appl. No.:

8/595274

Inventors:

Francis C. Nutter - Methuen MA
Martin I. Soderland - Westboro MA
Richard J. Nihan - Dracut MA

Assignee:

BTU International, Inc. - North Billerica MA

International Classification:

H05K 334

US Classification:

228 46

Abstract:

An apparatus and method for cooling one side of a double sided product as the product is being reflow soldered is presented. A cooling assembly directs cold gas to a first side of the product which has previously had the first side reflow soldered, while at approximately the same time, a heating assembly directs hot gas to a second side of the product. The second side of the product is reflow soldered while the first side of the product is maintained at a temperature below the melting point of the solder.