Robert R Brenan

US Patent:

39749541, Aug 17, 1976

Filed:

Jan 17, 1975

Appl. No.:

5/541853

Inventors:

Robert R. Brenan - Warren PA
Gordon L. Johnson - Jamestown NY

Assignee:

GTE Sylvania Incorporated - Stamford CT

International Classification:

B23K 3100

US Classification:

228 13

Abstract:

There is disclosed an electrical contact and a method and apparatus for making said electrical contact wherein the contact comprises at least one formed tine portion, a central retaining portion, and a tail portion. Secured to this tine portion is a precious metal contact material comprised of a first layer of a base material and a second layer of a precious metal.

US Patent:

39436250, Mar 16, 1976

Filed:

Jan 17, 1975

Appl. No.:

5/541892

Inventors:

Robert R. Brenan - Warren PA
Gordon L. Johnson - Jamestown NY

Assignee:

GTE Sylvania Incorporated - Stamford CT

International Classification:

H01R 900

US Classification:

29630C

Abstract:

There is disclosed a method for making tined electrical contacts from a continuous metal strip as the strip intermittently moves through a plurality of work stations. The method comprises the steps of advancing the metal strip; positioning a portion of contact material in alignment with an area on said strip, attaching said portion to said area, advancing the metal strip, and thereafter cutting and forming the strip to provide an electrical contact.

US Patent:

39501426, Apr 13, 1976

Filed:

Aug 5, 1974

Appl. No.:

5/494635

Inventors:

Robert R. Brenan - Warren PA
Robert W. Smith - Warren PA

Assignee:

GTE Sylvania Incorporated - Stamford CT

International Classification:

H01L 2302

US Classification:

29191

Abstract:

An improved lead assembly adapted for utilization in a semiconductor device having a glass envelope, an electrical device positioned within said envelope having at least one end surface, said lead assembly comprising a metallic seal member adapted for extending through and bonding to said glass envelope and affixing to said end surface of said electrical device along a first common interface, and a metallic lead member bonded along a second common interface to said metallic seal member, said second common interface located externally of said glass envelope. The improvement comprises providing a secondary path for heat transfer in the form of a substantially uniform copper coating along the entire first common interface between said electrical device and said seal member to thereby facilitate the removal of heat from within said semiconductive device.