Robert C Karlicek

US Patent:

D574338, Aug 5, 2008

Filed:

Mar 29, 2007

Appl. No.:

29/285470

Inventors:

Robert F. Karlicek - Chelmsford MA, US
Michael Brattain - Lexington MA, US
Georgia Chmielewski - Plaistow NH, US
Rashmi Kumar - Billerica MA, US

Assignee:

Luminus Devices, Inc. - Billerica MA

International Classification:

1303

US Classification:

D13180, D13179, D13182

US Patent:

D578968, Oct 21, 2008

Filed:

Mar 29, 2007

Appl. No.:

29/285469

Inventors:

Robert F. Karlicek - Chelmsford MA, US
Michael Brattain - Lexington MA, US
Georgia Chmielewski - Plaistow NH, US
Rashmi Kumar - Billerica MA, US

Assignee:

Luminus Devices, Inc. - Billerica MA

International Classification:

1303

US Classification:

D13180, D13179, D13182

US Patent:

D590784, Apr 21, 2009

Filed:

Mar 29, 2007

Appl. No.:

29/285431

Inventors:

Robert F. Karlicek - Chelmsford MA, US
Michael Brattain - Lexington MA, US
Georgia Chmielewski - Plaistow NH, US
Rashmi Kumar - Billerica MA, US

Assignee:

Luminus Devices, Inc. - Billerica MA

International Classification:

1303

US Classification:

D13180

US Patent:

8092064, Jan 10, 2012

Filed:

Jun 4, 2007

Appl. No.:

11/757734

Inventors:

Alexei A. Erchak - Cambridge MA, US
Robert F. Karlicek - Chelmsford MA, US
David Doyle - Somerville MA, US
Gianni Taraschi - Somerville MA, US
Michael A. Joffe - Harvard MA, US
Christian Hoepfner - North Andover MA, US

Assignee:

Rambus International Ltd. - Grand Cayman

International Classification:

F21V 7/04

US Classification:

362613, 362223, 362224, 362225, 362607, 362612, 362615, 362 971, 362 972, 349 65

Abstract:

Illumination assemblies, components, and related methods are described. An illumination assembly is provided that comprises a plurality of illumination tiles each having a light emission surface. The plurality of illumination tiles are arranged in a two-dimensional array. The illumination tiles are constructed and arranged so as to provide a substantially contiguous illumination surface comprising the light emission surfaces of the plurality of the illumination tiles. Each illumination tile is illuminated by at least one solid state light-emitting device. A method of local dimming an illumination assembly of a display (e. g. , LCD) backlight unit is also provided.

US Patent:

8110835, Feb 7, 2012

Filed:

Apr 19, 2007

Appl. No.:

11/788347

Inventors:

Rashmi Kumar - Billerica MA, US
Robert F. Karlicek - Chelmsford MA, US

Assignee:

Luminus Devices, Inc. - Billerica MA

International Classification:

H01L 27/15
G05F 3/16

US Classification:

257 79, 257 93, 257 99, 257E25019, 257E2502, 257E25028, 323223, 36224905, 362800

Abstract:

A light emitting component can include a substrate, a light emitting device supported by the substrate, wherein the light-emitting device has first and second terminals, and a switching element supported by the substrate and having first and second terminals electrically connected to the first and second terminals of the light-emitting device, respectively. The switching element is configured to, at least in part, divert at least some current away from the light emitting device when the switching element is in a closed state. An electrical connection between the first terminal of the switching element and the first terminal of the light emitting device can have a length of less than 5 cm (e. g. , less than 2 cm, less than 1 cm, less than 5 mm, less than 1 mm). A current regulator may be supported by a second substrate and can supply current to the light emitting device.

US Patent:

20020177288, Nov 28, 2002

Filed:

Apr 2, 2002

Appl. No.:

10/114099

Inventors:

Michael Brown - Clinton NJ, US
Ivan Eliashevich - Millburn NJ, US
Robert Karlicek - Flemington NJ, US
James Nering - Summit NJ, US
Mark Gottfried - Bridgewater New Jersey, US

International Classification:

H01L021/301
H01L021/46
H01L021/78

US Classification:

438/463000

Abstract:

A method for separating a semiconductor wafer into several thousand devices or die by laser ablation. Semiconductor wafers are initially pre-processed to create multiple devices, such as blue LEDs, on the wafers. The wafers are then mounted with tape coated with a generally high level adhesive. The mounted wafer is then placed on a vacuum chuck (which is itself positioned on a computer controlled positioning table) to hold it in place during the cutting process. The cutting surface is then covered with a protective layer to prevent contamination from the effluent resulting from the actual cutting process. A laser beam is generated and passed through optical elements and masks to create a pattern, such as a line or multiple lines. The patterned laser projection is directed at the wafer at a substantially normal angle and applied to the wafer until at least a partial cut is achieved through it. A mechanical separation process completes the separation when only a partial cut is achieved by the patterned laser projection. The die are then transferred to a grip ring for further processing.

US Patent:

20020182765, Dec 5, 2002

Filed:

Aug 23, 2001

Appl. No.:

09/935890

Inventors:

Chuong Tran - Bridgewater NJ, US
Robert Karlicek - Flemington NJ, US

International Classification:

H01L021/00

US Classification:

438/029000, 438/046000, 438/047000

Abstract:

In deposition of a quantum well structure for a light emitting diode, each well layer is formed by a two-phase process. In a first phase, relatively high flux rates of gallium and indium are employed. In the second phase, lower flux rates of gallium and indium are used. The well layer is formed with a composition which varies across the horizontal extent of the layer, and which typically includes clusters of indium-enriched material surrounded by regions of indium-poor material. The resulting structure exhibits enhanced brightness and a narrow, well-defined emission spectrum.

US Patent:

20050003634, Jan 6, 2005

Filed:

May 13, 2004

Appl. No.:

10/845790

Inventors:

Michael Brown - Clinton NJ, US
Ivan Eliashevich - Millburn NJ, US
Mark Gottfried - Bridgewater NJ, US
Robert Karlicek - Flemington NJ, US
James Nering - Summit NJ, US

International Classification:

H01L021/301
H01L021/46
H01L021/78

US Classification:

438463000

Abstract:

A method for separating a semiconductor wafer into several thousand devices or dies by laser ablation. Semiconductor wafers are initially pre-processed to create multiple devices, such as blue LEDs, on the wafers. The wafers are then mounted with tape coated with a generally high level adhesive. The mounted wafer is then placed on a vacuum chuck (which is itself positioned on a computer controlled positioning table) to hold it in place during the cutting process. The cutting surface is then covered with a protective layer to prevent contamination from the effluent resulting from the actual cutting process. A laser beam is generated and passed through optical elements and masks to create a pattern, such as a line or multiple lines. The patterned laser projection is directed at the wafer at a substantially normal angle and applied to the wafer until at least a partial cut is achieved through it. A mechanical separation process completes the separation when only a partial cut is achieved by the patterned laser projection. The dies are then transferred to a grip ring for further processing.