Alghanim International Corp W.l.l
Finance Manager
Ey Oct 2013 - Sep 2016
Senior Auditor
Pkf Bouresli Kuwait Dec 2011 - Sep 2013
Senior
Grant Thornton India Llp Nov 2006 - Feb 2010
Trainee
Education:
The Institute of Chartered Accountants of India 2003 - 2011
Loyola College 2003 - 2006
Bachelor of Commerce, Bachelors, Commerce
Indian Community School 1997 - 2003
Teaching Watching and Playing Sports Listening To Music Economic Empowerment Civil Rights and Social Action Education Environment Reading Science and Technology Human Rights Arts and Culture
Semiconductor Company
Engineering Manager
Electronics Company Mar 2019 - Jul 2019
Director of R and D
Aurora Semiconductor 2017 - 2019
Director of Fabrication
Ocean Thin Films 2014 - 2017
Director of New Product Introduction and Development
Virginia Tech 2009 - 2013
Research Scientist
Education:
Virginia Tech 2009 - 2013
Doctorates, Doctor of Philosophy, Materials Science, Engineering, Philosophy
Arizona State University 1993 - 1995
Master of Science, Masters
Birla Institute of Technology and Science, Pilani 1988 - 1992
Bachelors, Bachelor of Science
Arizona State University
Masters, Chemical Engineering
Birla Institute of Technology and Science, Pilani
Bachelors, Chemical Engineering
Skills:
Thin Films Mems Semiconductors Electronics Product Development Silicon Characterization Program Management Problem Solving Analysis Integration Design of Experiments Jmp Optics Materials Science Photonics Statistics Spc Data Analysis Patents Troubleshooting Process Control Fmea Product Management Minitab Cross Functional Team Leadership Sensors R&D Semiconductor Manufacturing Process Integration Nanotechnology Technology Development Cvd Pecvd Pvd Photolithography Etching Product Engineering Engineering Management Ic Optoelectronics Doe Metrology Microelectronics Surface Xrd Sputtering Dmaic Simulations Physics Process Engineering Project Management Strategic Planning Leadership Business Process Improvement Continuous Improvement Lean Six Sigma
Anguel N. Nikolov - Bridgewater NJ, US Jian Jim Wang - Orefield PA, US Xu Ouyang - Painted Post NY, US Feng Liu - Allentown PA, US Jiangdong Deng - Kendall Park NJ, US Xuegong Deng - Piscataway NJ, US Ronnie Paul Varghese - Annandale NJ, US
Assignee:
NanoOpto Corporation - Somerset NJ
International Classification:
G02B 1/10 G02B 9/34
US Classification:
359722, 359581
Abstract:
Films for optical use, articles containing such films, methods for making such films, and systems that utilize such films, are disclosed.
Anguel N. Nikolov - Bridgewater NJ, US Jian Jim Wang - Orefield PA, US Xu Ouyang - Painted Post NY, US Feng Liu - Allentown PA, US Jiangdong Deng - Kendall Park NJ, US Xuegong Deng - Piscataway NJ, US Greg E. Blonder - Summit NJ, US Ronnie Paul Varghese - Annandale NJ, US
Assignee:
API Nanofabrication and Research Corporation - Somerset NJ
International Classification:
F21V 9/04 G02B 5/28
US Classification:
359589, 359359
Abstract:
In one aspect, the invention features articles that include a substrate having a first surface and a second surface contiguous with the first surface. The first and second surfaces are non-coplanar. A first multilayer film is disposed on the first surface. A second multilayer film is disposed on the second surface. The second multilayer film is contiguous with the first multilayer film.
Films For Optical Use And Methods Of Making Such Films
Anguel Nikolov - Bridgewater NJ, US Jian Wang - Orefield PA, US Xu Ouyang - Painted Post NY, US Feng Liu - Allentown PA, US Jiangdong Deng - Kendall Park NJ, US Xuegong Deng - Piscataway NJ, US Greg Blonder - Summit NJ, US Ronnie Varghese - Annandale NJ, US
International Classification:
C23C016/00
US Classification:
427248100
Abstract:
Films for optical use, articles containing such films, methods for making such films, and systems that utilize such films, are disclosed
Lithography Process For The Encapsulation Of Patterned Thin Film Coatings
- Largo FL, US RONNIE VARGHESE - PALM HARBOR FL, US
International Classification:
H01L 21/033 G03F 7/16 H01L 21/32
Abstract:
A single lithography process for multi-layer metal/dielectric coatings using a series of developing, baking, and lifting steps to coat two or more thin films without re-patterning that results in the encapsulation and profile optimization of multi-spectral patterned thin film coatings is disclosed.