Jeffrey C. Sherry - Savage MN, US Patrick J. Alladio - Santa Rosa CA, US Russell F. Oberg - Beldenville WI, US Brian K. Warwick - Ben Lomond CA, US
Assignee:
Johnstech International - Minneapolis MN
International Classification:
G01R 1/073
US Classification:
32475403, 32475413, 32475414, 32475502, 32476202
Abstract:
A test fixture () is disclosed for electrically testing a device under test () by forming a plurality of temporary mechanical and electrical connections between terminals () on the device under test () and contact pads () on the load board (). The test fixture () has a replaceable membrane () that includes vias (), with each via () being associated with a terminal () on the device under test () and a contact pad () on the load board (). In some cases, each via () has an electrically conducting wall for conducting current between the terminal () and the contact pad (). In some cases, each via () includes a spring () that provides a mechanical resisting force to the terminal () when the device under test () is engaged with the test fixture ().
John E. Nelson - Brooklyn Park MN, US Jeffrey C. Sherry - Savage MN, US Patrick J. Alladio - Santa Rosa CA, US Russell F. Oberg - Beldenville WI, US Brian Warwick - Ben Lomond CA, US Gary W. Michalko - Ham Lake MN, US
Assignee:
Johnstech International Corporation - Minneapolis MN
International Classification:
G01R 31/20 G01R 31/00
US Classification:
32475401, 32475501, 32475601
Abstract:
The terminals of a device under test are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are held in place by an interposer membrane that includes a top contact plate facing the device under test, a bottom contact plate facing the load board, and a vertically resilient, non-conductive member between the top and bottom contact plates. Each pin pair includes a top and bottom pin, which extend beyond the top and bottom contact plates, respectively, toward the device under test and the load board, respectively. The top and bottom pins contact each other at an interface that is inclined with respect to the membrane surface normal. When compressed longitudinally, the pins translate toward each other by sliding along the interface. The sliding is largely longitudinal, with a small and desirable lateral component determined by the inclination of the interface.
Liquid Dispensing Method And System With Headspace Gas Removal
Kevin O' Dougherty - Arden Hills MN, US Russell Oberg - Burnsville MN, US Joseph Menning - Prior Lake MN, US Gregory Eiden - Chaska MN, US Donald Grant - Excelsior MN, US
Assignee:
Advanced Technology Materials, Inc. - Danbury CT
International Classification:
B65D083/00
US Classification:
222399000
Abstract:
A liquid dispensing method and system for dispensing from a container including an outer container and an inner container, a portion of the inner container occupied by the liquid, a remainder of the inner container occupied by a headspace gas. The system includes a probe having a flow passage therein and a gas passage communicating between the interior of the inner container and an exterior of the outer container. Fluid (such as air or nitrogen) is caused to flow under pressure into a space between inner walls of the outer container and the inner container to force the headspace gas out of the inner container via the gas passage and to force liquid out of the inner container through the flow passage in the probe to a manufacturing process.
Electrically Conductive Pins For Microcircuit Tester
John E. Nelson - Brooklyn Park MN, US Jeffrey C. Sherry - Savage MN, US Patrick J. Alladio - Santa Rosa CA, US Russell F. Oberg - Beldenville WI, US Brian Warwick - Ben Lomond CA, US Gary W. Michalko - Ham Lake MN, US
Assignee:
Johnstech International Corporation - Minneapolis MN
International Classification:
G01R 1/067 G01R 31/00
US Classification:
32475509, 32475601
Abstract:
The terminals of a device under test are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are held in place by an interposer membrane that includes a top contact plate facing the device under test, a bottom contact plate facing the load board, and a vertically resilient, non-conductive member between the top and bottom contact plates. Each pin pair includes a top and bottom pin, which extend beyond the top and bottom contact plates, respectively, toward the device under test and the load board, respectively. The top and bottom pins contact each other at an interface that is inclined with respect to the membrane surface normal. When compressed longitudinally, the pins translate toward each other by sliding along the interface.
Test Contact System For Testing Integrated Circuits With Packages Having An Array Of Signal And Power Contacts
Jeffrey C. Sherry - Savage MN, US Patrick J. Alladio - Santa Rosa CA, US Russell F. Oberg - Beldenville WI, US Brian K. Warwick - Ben Lomond CA, US
Assignee:
JohnsTech International Corporation - Minneapolis MN
International Classification:
G01R 31/00
US Classification:
32475605
Abstract:
A test fixture () is disclosed for electrically testing a device under test () by forming a plurality of temporary mechanical and electrical connections between terminals () on the device under test () and contact pads () on the load board (). The test fixture () has a replaceable membrane () that includes vias (), with each via () being associated with a terminal () on the device under test () and a contact pad () on the load board (). In some cases, each via () has an electrically conducting wall for conducting current between the terminal () and the contact pad (). In some cases, each via () includes a spring () that provides a mechanical resisting force to the terminal () when the device under test () is engaged with the test fixture ().
Electrically Conductive Pins For Microcircuit Tester
John E. Nelson - Brooklyn Park MN, US Jeffrey C. Sherry - Savage MN, US Patrick J. Alladio - Santa Rosa CA, US Russell F. Oberg - Beldenville WI, US Brian Warwick - Ben Lomond CA, US Gary W. Michalko - Ham Lake MN, US
Assignee:
Johnstech International Corporation - Minneapolis MN
International Classification:
G01R 1/04
US Classification:
32475024
Abstract:
The terminals of a device under test are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are held in place by an interposer membrane that includes a top contact plate facing the device under test, a bottom contact plate facing the load board including a rocker base protrusion, and a vertically resilient, non-conductive member between the top and bottom contact plates. Each pin pair includes a top and bottom pin, which extend beyond the top and bottom contact plates, respectively, toward the device under test and the load board, respectively. The top and bottom pins contact each other at an interface that is inclined with respect to the membrane surface normal. When compressed longitudinally, the pins translate toward each other by sliding along the interface. The sliding is largely longitudinal, with a small and desirable lateral component determined by the inclination of the interface.
Electrically Conductive Pins For Microcircuit Tester
John E. Nelson - Brooklyn Park MN, US Jeffrey C. Sherry - Savage MN, US Patrick J. Alladio - Santa Rosa CA, US Russell F. Oberg - Beldenville WI, US Brian Warwick - Ben Lomond CA, US Gary W. Michalko - Ham Lake MN, US
International Classification:
G01R 1/04
US Classification:
32475605
Abstract:
The terminals of a device under test are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are held in place by an interposer membrane that includes a top contact plate facing the device under test, a bottom contact plate facing the load board, and a vertically resilient, non-conductive member between the top and bottom contact plates. Each pin pair includes a top and bottom pin, which extend beyond the top and bottom contact plates, respectively, toward the device under test and the load board, respectively. The top and bottom pins contact each other at an interface that is inclined with respect to the membrane surface normal. When compressed longitudinally, the pins translate toward each other by sliding along the interface. The sliding is largely longitudinal, with a small and desirable lateral component determined by the inclination of the interface.
Johnstech International Minneapolis, MN Jan 2008 to Jun 2011 PRODUCT DESIGN ENGINEERWilbert Plastics Services, Inc Saint Paul, MN Nov 2005 to Nov 2007 PROJECT ENGINEERATMI Packaging, Inc Minneapolis, MN Feb 2003 to Nov 2005 DESIGN ENGINEER AND SUSTAINING ENGINEERIMI Cornelius, Inc Anoka, MN Dec 2001 to Feb 2003 DESIGN ENGINEERLockheed Martin Eagan, MN Aug 1998 to Dec 2001 DESIGN ENGINEERVentaire, Inc Burnsville, MN Sep 1994 to Aug 1998 DESIGN ENGINEER
Education:
University of Minnesota 1996 Bachelor of Mechanical Engineering
Bordeaux Elementary School Shelton WA 1945-1946, Hood Canal Elementary School Shelton WA 1946-1949, Jefferson Elementary School Port Angeles WA 1949-1950, Roosevelt Junior High School Port Angeles WA 1950-1953
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