Scott P Mitchell

US Patent:

6615034, Sep 2, 2003

Filed:

Apr 27, 2000

Appl. No.:

09/560423

Inventors:

Kathleen E. Alloune - Irving TX
Jeffrey L. Benoist - Flower Mound TX
Mark D. Carter - Frisco TX
Robert W. Ganter - Mesquite TX
Gretchen L. Knapp - Grapevine TX
Joseph G. Laura - Plano TX
Mark S. McKee - Coppell TX
Scott F. Mitchell - Dallas TX
Charles A. Paelinck - Coppell TX
Angela L. Seefeldt - Edmond OK
James D. Williams - Irving TX

Assignee:

Sprint Communications Company L.P. - Overland Park KS

International Classification:

H04Q 720

US Classification:

455406, 4554141, 455405, 37912101, 37914401

Abstract:

A communication billing system comprising a processing system coupled to an interface system. The processing system is configured to process a plurality of wireless service events from a wireless system together at the event level with a plurality of wireline service events from a wireline system to generate total charge records for a plurality of wireless services and a plurality of wireline services. The processing system is also configured to process the total charge records for the plurality of wireless services and the plurality of wireline services to generate a customer bill. The interface system is configured to receive the plurality of wireless service events from the wireless system, receive the plurality of wireline service events from the wireline system, and transmit the customer bill for the processing system.

US Patent:

6911834, Jun 28, 2005

Filed:

Jan 25, 2002

Appl. No.:

10/058544

Inventors:

Scott W. Mitchell - Plano TX, US
Reynaldo M. Rincon - Richardson TX, US
Jerry Broz - Longmont CO, US
Gerard Laugier - Villeneuve Loubet, FR

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

G01R031/02

US Classification:

324754, 324761

Abstract:

Apparatus and methods for testing conductive bumps or target test points on integrated circuits. A multiplicity of probes are extended through a support substrate. At least one of the multiplicity of probe locations include a second electrically isolated probe such that the test point is in contact with two probes. One of the two probes provides a voltage to the test point and the second probe sensing the voltage so as to provide a Kelvin connection.

US Patent:

7386295, Jun 10, 2008

Filed:

May 29, 2003

Appl. No.:

10/447549

Inventors:

Kathleen E. Alloune - Irving TX, US
Jeffrey L. Benoist - Flower Mound TX, US
Mark D. Carter - Frisco TX, US
Robert W. Ganter - Mesquite TX, US
Gretchen L. Knapp - Grapevine TX, US
Joseph G. Laura - Plano TX, US
Mark S. McKee - Coppell TX, US
Scott F. Mitchell - Dallas TX, US
Charles A. Paelinck - Coppell TX, US
Angela L. Seefeldt - Edmond OK, US
James D. Williams - Irving TX, US

Assignee:

Sprint Communications Company L.P. - Overland Park KS

International Classification:

H04Q 7/20
H04M 15/00
G07F 19/00
G06Q 40/00

US Classification:

455406, 455405, 4554141, 37912101, 37914401, 705 34, 705 40

Abstract:

A communication billing system comprising a processing system coupled to an interface system. The processing system is configured to process a plurality of wireless service events from a wireless system together at the event level with a plurality of wireline service events from a wireline system to generate total charge records for a plurality of wireless services and a plurality of wireline services. The processing system is also configured to process the total charge records for the plurality of wireless services and the plurality of wireline services to generate a customer bill. The interface system is configured to receive the plurality of wireless service events from the wireless system, receive the plurality of wireline service events from the wireline system, and transmit the customer bill for the processing system.

US Patent:

20030094962, May 22, 2003

Filed:

Nov 21, 2001

Appl. No.:

09/992065

Inventors:

Reynaldo Rincon - Richardson TX, US
Richard Arnold - McKinney TX, US
Lester Wilson - Sherman TX, US
Scott Mitchell - Plano TX, US

International Classification:

G01R031/02

US Classification:

324/754000

Abstract:

A probe card having multiple planes with continuous metal traces from a high density of small, robust probe contacts to peripheral vias which enable connection to a test head is fabricated using technology from the printed circuit card industry. The card includes a relatively small, centrally located recessed plane having a plurality of probe contacts precisely patterned to mate with chip contacts, an array of continuous conductive traces, the substrate is folded at specific crease locations, and formed upward to a second array of creases at which the substrate is bent to form a raised plane parallel to the first. Integrated single unit construction, coupled with adaptability for rapid pattern design or changes in conductors readily enables a low inductance probe card, and its low cost, automated method of manufacture is compatible with tight pitch and high performance requirements of integrated circuits both in current production, and those in plans for the future.

US Patent:

20030107137, Jun 12, 2003

Filed:

Sep 24, 2001

Appl. No.:

09/963066

Inventors:

Roger Stierman - Dallas TX, US
Seth Miller - Sachse TX, US
Howard Test - Plano TX, US
Christo Bojkov - Plano TX, US
John Harris - Whitewright TX, US
Reynaldo Rincon - Richardson TX, US
Scott Mitchell - Plano TX, US
Gonzalo Amador - Dallas TX, US

International Classification:

H01L023/48
H01L023/52
H01L029/40

US Classification:

257/763000

Abstract:

A microelectronic mechanical structure (MEMS) comprising a semiconductor chip having an integrated circuit including a plurality of micromechanical components, and a plurality of conductive routing lines integral with the chip; the routing lines having contact terminals of oxide-free metal; and the terminals having a layer of barrier metal on the oxide-free metal and an outermost layer of noble metal, whereby damage-free testing of the circuit is possible using test probe needles. The barrier metal is selected from a group consisting of nickel, cobalt, chromium, molybdenum, titanium, tungsten, tantalum, palladium, platinum, rhodium, rhenium, osmium, vanadium, iron, ruthenium, niobium, iridium, zirconium, hafnium, copper, and alloys thereof. Alloys of these metals may contain phosphorus or boron. The outermost layer is a noble metal which is bondable or solderable, and is selected from a group consisting of gold, platinum, palladium, silver, rhodium, and copper. Alloys of these metals may contain phosphorus or boron.