Susan Louise Fitzgerald

US Patent:

49156071, Apr 10, 1990

Filed:

Oct 6, 1988

Appl. No.:

7/254333

Inventors:

Jerry B. Medders - Van Alstyne TX
Susan S. Fitzgerald - Sherman TX
Donald R. Kelley - Sherman TX
Jeffrey L. Popken - Cincinatti OH

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

B29C 4514

US Classification:

425116

Abstract:

A lead frame assembly is disclosed which interfaces with existing wire bonders using a single track design from the bonder through the molding process. During the molding operation, the bonded lead frame is transferred into the mold on a guide track system built into the mold chase. The mold closes and clamps the lead frame after which a compound charging system meters and injects a compound into the mold cavities. The mold is opened and the strip ejected and transferred out of the mold via internal guide tracks. A granular or pellet form of compound is used in the charging system. The lead frame assembly has side rails, between which a temporary and a permanent support structure is formed. The temporary support structure is removed from the bonded integrated circuits after the bonding process is completed, while the permanent structure is made a part of the bonded integrated circuit package. A portion of the temporary support structure has a hole through it, which allows the bonding compound to pass through the lead frame to enable encapsulation of the integrated circuit both above and below the lead frame in the bonding cavity.

US Patent:

48121142, Mar 14, 1989

Filed:

Sep 30, 1987

Appl. No.:

7/103555

Inventors:

James A. Kennon - Dennison TX
Jeffrey L. Popken - Cincinatti OH
Jerry B. Medders - Van Alstyne TX
Susan S. Fitzgerald - Fort Worth TX
Donald R. Kelley - Sherman TX
Philip A. Burr - Aguascalientes, MX

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

B29C 4518

US Classification:

425116

Abstract:

A molding system and process is disclosed to interface with existing wire bonders using a single track design from the bonder through the molding process. During the molding operation, the bonded lead frame is transferred into the mold on a guide track system built into the mold chase. The mold closes and clamps the lead frame after which a compound charging system meters and injects a compound into the mold cavities. The mold is opened and the strip ejected and transferred out of the mold via internal guide tracks. A granular or pellet form of compound is use in the charging system.