Thomas C Ngo

US Patent:

20110012240, Jan 20, 2011

Filed:

Jul 6, 2010

Appl. No.:

12/830802

Inventors:

Chenglin Liu - San Jose CA, US
Thomas Ngo - San Jose CA, US
Xiaoting Chang - Milpitas CA, US

International Classification:

H01L 23/495
H01L 21/60

US Classification:

257666, 438123, 257E23031, 257E21506

Abstract:

This disclosure describes a multi-connect lead providing multiple connections using one external pin. In one embodiment, a lead frame for a lead-frame-based chip package includes a multi-connect lead that uses one external pin and enables multiple electrical connections to an integrated circuit die.

US Patent:

20030182640, Sep 25, 2003

Filed:

Mar 20, 2002

Appl. No.:

10/103508

Inventors:

Alaa Alani - Hillingdon, GB
Thomas Ngo - San Jose CA, US
Patrick Morrin - Bournemouth, DE

International Classification:

G06F017/50

US Classification:

716/004000, 716/006000

Abstract:

A method of signal integrity analysis includes providing a pre-defined circuit layout in SPICE format; selecting from a menu at least one of a technology, a driver, a driver package, a transmission line, a termination, a receiver package, a stimulus, a measurement, options, and sweep parameters for the predefined circuit layout; generating a SPICE netlist from the pre-defined circuit layout; simulating the predefined circuit layout from the SPICE netlist; and generating as output at least one of a listing, a waveform, and a signal measurement from the simulation of the pre-defined circuit layout.