Jul 2012 to 2000 Data and Policy Analyst II (Full Time)Molecular Cancer Epidemiology Lab at Department of Epidemiology, School of Public Health, UCLA Los Angeles, CA Jun 2011 to Mar 2012 Student InternEnvironmental Toxicology Lab at Institute of Environmental Health, School of Public Health, NTU
Nov 2009 to Jul 2010 Research Assistant (Full-time)
Education:
University of California, Los Angeles (UCLA) Los Angeles, CA 2010 to 2012 Master of Public Health (M.P.H) in Public Health - EpemiologyNational Taiwan University Sep 2005 to Jun 2009 Bachelor of Science in Life Science
Skills:
SAS BASICS, SAS MACRO, SAS SQL, Microsoft Excel, Microsoft Word, Microsoft Powerpoint, Mandarin Chinese
Jul 2012 to 2000 Quantitative Research AnalystMolecular Cancer Epidemiology Lab at Department of Epidemiology, School of Public Health, UCLA Los Angeles, CA Jun 2011 to Mar 2012 Student InternEnvironmental Toxicology Lab at Institute of Environmental Health, School of Public Health, NTU
Nov 2009 to Jul 2010 Research Assistant (full-time)
Education:
University of California Los Angeles, CA Sep 2010 to Mar 2012 Master in Public HealthNational Taiwan University 2005 to 2009 Bachelor of Science in Life Science
An electronic imaging chip containing an array of photodiodes includes a multiplexed column buffer. The multiplexed column buffer serves a plurality of columns in the photodiode array. By multiplexing active amplifier elements, such as the differential gain amplifiers and the bus driver amplifiers, a wider area than one column width is available on the semiconductor chip for layout of the column buffer. In the disclosed embodiment, 4 columns share a common multiplexed column buffer. The area available for layout of the multiplexed column buffer is 4 times as wide as compared to that for a non-multiplexed column buffer.
David E. Ludwig - Irvine CA, US John V. Kennedy - Irvine CA, US William Kleinhans - Westlake Village CA, US Tina Liu - Westlake Village CA, US Christian Krutzik - Costa Mesa CA, US
Assignee:
Irvine Sensors Corp. - Costa Mesa CA
International Classification:
G01C 3/08
US Classification:
356 401, 356 501, 356 502, 356 402
Abstract:
A 3-D LADAR imaging system incorporating stacked microelectronic layers is provided. A light source is imaged upon a target through beam shaping optics. Photons reflected from the target are collected and imaged upon a detector array though collection optics. The detector array signals are fed into a multilayer processing module wherein each layer includes detector signal processing circuitry. The detector array signals are amplified, compared to a user-defined threshold, digitized and fed into a high speed FIFO range bin. Dependant on the value of the digit contained in the bins in the register, and the digit's bin location, the time of a photon reflection from a target surface can be determined. A Ttrigger signal defines the reflection time represented by each bin location by resetting appropriate circuitry to begin processing. The bin data representing the photon reflections from the various target surfaces are read out of the FIFO and processed using appropriate circuitry to create a 3-D point cloud for creating a 3-D target image.
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