Travis C North

US Patent:

8200358, Jun 12, 2012

Filed:

Nov 25, 2008

Appl. No.:

12/277341

Inventors:

Eric Neil Sendelbach - Austin TX, US
Matt Tavasoli - Austin TX, US
Travis Christian North - Pflugerville TX, US

Assignee:

Dell Products L.P. - Round Rock TX

International Classification:

G06F 19/00

US Classification:

700153, 700205

Abstract:

A Hard Disk Drive (HDD) temperature control system includes an HDD including a temperature sensor. An Operating System (OS) driver is coupled to the temperature sensor and includes a temperature data retrieval engine that is operable to retrieve HDD temperature data from the temperature sensor and transmit the HDD temperature data. A shared data storage is coupled to the OS driver and operable to store the HDD temperature data transmitted from the temperature data retrieval engine. A fan speed controller is coupled to the shared data storage and operable to use the HDD temperature data stored in the shared data storage to adjust the speed of a fan.

US Patent:

8416572, Apr 9, 2013

Filed:

Jan 20, 2010

Appl. No.:

12/690626

Inventors:

John Olsen - Austin TX, US
Bradley Jackson - Pflugerville TX, US
Eric Sendelbach - Austin TX, US
Gabriel Higham - Pflugerville TX, US
James Bryan - Austin TX, US
Jason Franz - Austin TX, US
Travis North - Pflugerville TX, US
William Morris - Round Rock TX, US

Assignee:

Dell Products L.P. - Round Rock TX

International Classification:

H05K 7/20
F28F 7/00
H01L 23/34

US Classification:

361699, 36167953, 361701, 361702, 165 804, 165 805, 16510433, 257714, 174 151

Abstract:

Systems and methods for reducing problems and disadvantages associated with traditional approaches to cooling information handling resources are provided. A method for cooling information handling resources, may include conveying a flowing fluid proximate to one or more information handling resources such that the flowing fluid is thermally coupled to the one or more information handling resources and heat generated by the one or more information handling resources is transferred to the flowing fluid. The method may also include conveying the flowing fluid to a cooling unit such that heat is transferred from the flowing fluid.

US Patent:

20080186678, Aug 7, 2008

Filed:

Feb 6, 2007

Appl. No.:

11/671743

Inventors:

Travis North - Pflugerville TX, US
Michael Mincen Heatly - Round Rock TX, US

Assignee:

DELL PRODUCTS L.P. - Round Rock TX

International Classification:

H05K 7/20

US Classification:

361700, 361699

Abstract:

A heat conduction apparatus includes a sealed body having an inside surface and defining a cavity. A capillary structure is on the inside surface of the sealed body. A working fluid is in the cavity and includes nanoparticles. The heat conduction apparatus may be coupled to a heat producing component in order to provide greater heat dissipation capability than is provided by a heat conduction apparatus with a conventional working fluid.

US Patent:

20090154093, Jun 18, 2009

Filed:

Oct 11, 2006

Appl. No.:

11/548697

Inventors:

Travis North - Pflugerville TX, US
Michael Heatly - Round Rock TX, US

Assignee:

Dell Products L.P. - Round Rock TX

International Classification:

G06F 1/20
C09K 5/10

US Classification:

36167953, 252 75, 977932

Abstract:

An information handling system including a heat generating component positioned within the information handling system, a heat transfer surface in thermal communication with the heat generating component and a medium comprising water and gold thiolate nanoparticles, wherein the medium is in thermal communication with the heat transfer surface.

US Patent:

20100085712, Apr 8, 2010

Filed:

Oct 2, 2008

Appl. No.:

12/243990

Inventors:

Travis North - Pflugerville TX, US
Kevin M. Bailey - Austin TX, US

Assignee:

DELL PRODUCTS L.P. - Round Rock TX

International Classification:

H05K 7/20

US Classification:

361699

Abstract:

A liquid cooling system includes a board and a plurality of heat producing components (HPCs) coupled to the board. A mounting structure is located on the board adjacent to the plurality of HPCs. A liquid cooling device is coupled to the mounting structure such that the liquid cooling device engages each of the plurality of HPCs. The liquid cooling device may be decoupled from the mounting structure without detaching liquid conduits that supply it liquid in order to allow for the addition or removal of HPCs.

US Patent:

20100091447, Apr 15, 2010

Filed:

Oct 10, 2008

Appl. No.:

12/249075

Inventors:

Christopher Jaggers - Austin TX, US
Michael L. Krenek - Belton TX, US
Travis North - Pflugerville TX, US
James Bryan - Austin TX, US

Assignee:

Dell Products, LP - Round Rock TX

International Classification:

H05K 7/20

US Classification:

36167947

Abstract:

A device comprising a first thermal interface material, and a first micro-channel cold plate. The first thermal interface material is in physical communication with a first plurality of memory modules of a computer system. The first micro-channel cold plate is in physical communication with the first thermal interface material. The first micro-channel cold plate is adapted to allow a fluid flow through a first plurality of micro-channels, and configured to remove a first amount of heat produced by the first memory modules of the computer system through the first thermal interface material.

US Patent:

20110277475, Nov 17, 2011

Filed:

May 11, 2010

Appl. No.:

12/777836

Inventors:

Travis Christian North - Pflugerville TX, US
Andrew Olen Ingalls - Round Rock TX, US
Eric Neil Sendelbach - Austin TX, US
Manasi Tamhankar - Austin TX, US
Srinivasan R. Kadathur - Pflugerville TX, US

Assignee:

DELL PRODUCTS L.P. - Round Rock TX

International Classification:

F01K 27/00
G06F 1/20

US Classification:

60645, 36167952

Abstract:

A power regeneration system for use with an information handling system is disclosed. The power regeneration system may include a thermosiphon in thermal communication with a heated component of the information handling system, a turbine, a condenser, and a fluid flow loop. The thermosiphon may be configured to convert a cooling fluid from a liquid to a gaseous state as the cooling fluid absorbs heat from the heated component of the information handling system. The turbine may be configured to extract energy from the cooling fluid in the gaseous state after it leaves the thermosiphon. The condenser may be configured to remove thermal energy from the cooling fluid after it leaves the turbine, the condenser fluid converting the cooling fluid from a gaseous state to a liquid state as thermal energy is removed. The fluid flow loop may connect the thermosiphon, the turbine, and the condenser in order so that the cooling fluid flows in a closed loop through the power regeneration system.

US Patent:

20220350378, Nov 3, 2022

Filed:

Apr 28, 2021

Appl. No.:

17/243443

Inventors:

- Round Rock TX, US
Michael James Pescetto - Round Rock TX, US
Jacob Vick - Leander TX, US
Travis C. North - Cedar Park TX, US

International Classification:

G06F 1/20
H05K 7/20

Abstract:

A computing cooling system includes a chassis having chassis air inlet(s) and outlet(s). Heat dissipation device(s) thermally coupled to heat producing component(s) are located in the chassis adjacent the chassis air outlet(s). A first fan device located in the chassis adjacent the chassis air inlet(s) pulls first air from outside the chassis into the first fan device via the chassis air inlet(s), and pushes the first air though the heat dissipation device(s) and out of the chassis via the chassis air outlet(s). A second fan device located in the chassis adjacent the chassis air inlet(s) pulls second air from outside the chassis into the second fan device via the chassis air inlet(s), pushes a first portion of the second air past the heat dissipation device(s) and out of the chassis via the chassis air outlet(s), and pushes a second portion of the second air into the chassis.