Tri H Le

US Patent:

6910812, Jun 28, 2005

Filed:

May 15, 2002

Appl. No.:

10/146550

Inventors:

Richard Pommer - San Clemente CA, US
Charles B. Kuznia - Encinitas CA, US
Tri Q. Le - San Diego CA, US
Richard T. Hagen - Mission Viejo CA, US
Ronald E. Reedy - San Diego CA, US
James S. Cable - San Diego CA, US
Donald J. Albares - San Diego CA, US
Mark Miscione - Ramona CA, US

Assignee:

Peregrine Semiconductor Corporation - San Diego CA

International Classification:

G02B006/42

US Classification:

385 92, 257200, 257686, 257777, 385 14, 385 24, 385 52

Abstract:

An integrated circuit/optoelectronic packaging system () which comprises OE and IC components packaged to provide electrical input/output, thermal management, an optical window, and precise passive or mechanical alignment to external optical receivers or transmitters. A transparent insulating substrate having electrical circuitry in a thin silicon layer formed on its top side is positioned between the optical fiber and the optoelectronic device such that an optical path is described between the optoelectronic device and the optical fiber core through the transparent insulating substrate. The optoelectronic devices are mounted on the transparent insulating substrate in a precise positional relationship to guide holes in the substrate. The optical fibers are fixed in an optical fiber connector and are held in a precise positional relationship to guide holes in the connector. Alignment is accomplished with complementary guide pins that pass through guide holes in the fiber optic connector and in the transparent substrate.