Wei Xia from Chandler, AZ

Resumes

Smith College

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Location:

Northampton, Massachusetts

Industry:

Financial Services

Work:

Deutsche Bank Securities - New York, NY Jun 2012 - Aug 2012
Investment Banking Summer Analyst
Smith College Investment Club - Northampton, MA Sep 2010 - May 2012
Sector Head (Consumer & Retail)
PwC Consulting - Shanghai May 2011 - Aug 2011
Summer Intern
John Leggott Student Orchestra - United Kingdom Sep 2008 - May 2009
Second Violinist

Education:

Smith College 2010 - 2013
BA, Mathematics, Economics

Skills:

Microsoft Office
Pitch Books
Violin
Mathematical Analysis
Programming (Java, VB, SQL)
Financial Modeling

Languages:

English
Chinese
Japanese

Wei Xia

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Wei Xia

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Wei Xia

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Us Patents

Aluminum Bond Pad With Trench Thinning For Fine Pitch Ultra-Thick Aluminum Products
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US Patent:

20120299187, Nov 29, 2012
Filed:

Jun 22, 2011
Appl. No.:

13/166562
Inventors:

Kent Charles OERTLE - Phoenix AZ, US
Wei Xia - Irvine CA, US
Edward Law - Ladera Ranch CA, US
Assignee:

Broadcom Corporation - Irvine CA
International Classification:

H01L 23/485
H01L 21/50
US Classification:

257762, 438612, 257E2302, 257E21499
Abstract:

Embodiments of an aluminum pad thinning in bond pad for fine pitch ultra-thick aluminum pad structures are provided herein. Embodiments include a conductive structure formed on a substrate. A first passivation layer is formed over the substrate and the conductive structure, the first passivation layer having an opening formed over the conductive structure. An ultra-thick conductive structure having a thinned trench region formed over the opening of the first passivation layer. The ultra-thick conductive structure is in contact with the conductive structure. A second passivation layer formed over the first passivation region and the ultra-thick conductive structure. The second passivation layer having an opening formed over the thinned trench region of the ultra-thick conductive structure.