William E Fitzgerald

US Patent:

20190132951, May 2, 2019

Filed:

Sep 15, 2015

Appl. No.:

15/759577

Inventors:

- Houston TX, US
William K FITZGERALD - Plano TX, US
Michael DAY - Plano TX, US

International Classification:

H05K 1/11
H05K 1/02

Abstract:

Various examples provide a printed circuit board (PCB) comprising a first route from a first through-hole via to a second through-hole via, and a second route from the second through-hole via to a first micro via (e.g., coupled to a second memory module socket). Additional microvias may have a route from the first microvia that effectively daisy chains the microvias from the second through-hold via. Various examples also provide a PCB comprising a first route from a first through-hole via to a second through-hole via, and a second route from the second through-hole via to a first sequential lamination via. Additional sequential lamination vias may have a route from the first microvia that effectively daisy chains the sequential lamination vias from the second through-hold via.

Address:

6236 Genoa Rd, Fort Worth, TX 76116

Phone:

8177359662

VIN:

WVGBE77L08D048231

Make:

VOLKSWAGEN

Model:

TOUAREG 2

Year:

2008