William R Johannes

US Patent:

58194010, Oct 13, 1998

Filed:

Apr 24, 1997

Appl. No.:

8/847978

Inventors:

William R. Johannes - Albuquerque NM
Patrick H. O'Neill - Austin TX
David M. Mendez - Austin TX

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

H05K 336

US Classification:

29830

Abstract:

A method of constructing a printed circuit board module and the module which comprises providing a substrate core having a first aperture extending therethrough and a pair of printed circuit boards, each board having at least one electrically conductive layer, secured to the substrate core and having a second aperture therethrough aligned with the first aperture. An electrically conductive member having an electrically insulating member is disposed around the electrically conductive member. The electrically conductive member having an electrically insulating member disposed therearound is positioned so that the electrically insulating member is disposed in the first aperture and the electrically conductive member extends into the second aperture of each of the printed circuit boards. The printed circuit boards are secured to the substrate core to lock the electrically insulating member in the first aperture. Solder is disposed within each of the second apertures electrically connecting the electrically conductive member to at least one electrically conductive layer of each of the pair of printed circuit boards or solder is disposed over at least one electrically conductive layer of each printed circuit board electrically connecting the electrically conductive member to at least one electrically conductive member.