Xiao Gen Liu

US Patent:

6896729, May 24, 2005

Filed:

Jul 3, 2002

Appl. No.:

10/190001

Inventors:

Xiao Gordon Liu - Fremont CA, US
Wei Guo Liu - Sunnyvale CA, US

Assignee:

AXT, Inc. - Fremont CA

International Classification:

C30B011/06

US Classification:

117 81, 117 82, 117 83, 117223

Abstract:

Group III-V, II-VI and related monocrystalline compounds are grown with a rigid support of a sealed ampoule, carbon doping and resistivity control, and thermal gradient control in a crystal growth furnace. A support cylinder provides structural support for the combined sealed ampoule crucible assembly, while low-density insulating material inside the support cylinder deters convection and conduction heating. Radiation channels penetrating the low-density material provide pathways for radiation heating into and out of the seed well and transition regions of the crystal growth crucible. A hollow core in the insulation material directly beneath the seed well provides cooling in the center of the growing crystal, which enables uniform, level growth of the crystal ingot and a flat crystal-melt interface which results in crystal wafers with uniform electrical properties.

US Patent:

7276787, Oct 2, 2007

Filed:

Dec 5, 2003

Appl. No.:

10/729254

Inventors:

Daniel Charles Edelstein - White Plains NY, US
Paul Stephen Andry - Mohegan Lake NY, US
Leena Paivikki Buchwalter - Hopewell Junction NY, US
Jon Alfred Casey - Poughkeepsie NY, US
Sherif A. Goma - Hawthorne NY, US
Raymond R. Horton - Dover Plains NY, US
Gareth Geoffrey Hougham - Ossining NY, US
Michael Wayne Lane - Cortlandt Manor NY, US
Xiao Hu Liu - Croton on Hudson NY, US
Chirag Suryakant Patel - Peekskill NY, US
Edmund Juris Sprogis - Underhill VT, US
Michelle Leigh Steen - Danbury CT, US
Brian Richard Sundlof - Beacon NY, US
Cornelia K. Tsang - Mohegan Lake NY, US
George Frederick Walker - New York NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 23/48
H01L 23/498
H01L 21/4763
H01L 29/40
H01L 23/52

US Classification:

257698, 257E23067, 257E23075, 257E23011, 257E25013, 257E21597, 257E23006, 257E23172, 257E23174, 257774, 257773, 257702, 257680, 257700, 257758

Abstract:

A carrier structure and method for fabricating a carrier structure with through-vias each having a conductive structure with an effective coefficient of thermal expansion which is less than or closely matched to that of the substrate, and having an effective elastic modulus value which is less than or closely matches that of the substrate. The conductive structure may include concentric via fill areas having differing materials disposed concentrically therein, a core of the substrate material surrounded by an annular ring of conductive material, a core of CTE-matched non-conductive material surrounded by an annular ring of conductive material, a conductive via having an inner void with low CTE, or a full fill of a conductive composite material such as a metal-ceramic paste which has been sintered or fused.

US Patent:

7394089, Jul 1, 2008

Filed:

Aug 25, 2006

Appl. No.:

11/467294

Inventors:

James P. Doyle - Bronx NY, US
Bruce G. Elmegreen - Golden Bridge NY, US
Lia Krusin-Elbaum - Dobbs Ferry NY, US
Chung Hon Lam - Peekskill NY, US
Xiao Hu Liu - Briarcliff Manor NY, US
Dennis M. Newns - Yorktown Heights NY, US
Christy S. Tyberg - Mahopac NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 47/00

US Classification:

257 4, 257209, 257529, 257E2917

Abstract:

An electrically re-programmable fuse (eFUSE) device for use in integrated circuit devices includes an elongated heater element, an electrically insulating liner surrounding an outer surface of the elongated heater element, corresponding to a longitudinal axis thereof, leaving opposing ends of the elongated heater element in electrical contact with first and second heater electrodes. A phase change material (PCM) surrounds a portion of an outer surface of the electrically insulating liner, a thermally and electrically insulating layer surrounds an outer surface of the PCM, with first and second fuse electrodes in electrical contact with opposing ends of the PCM. The PCM is encapsulated within the electrically insulating liner, the thermally and electrically insulating layer, and the first and second fuse electrodes.

US Patent:

7417315, Aug 26, 2008

Filed:

Dec 5, 2002

Appl. No.:

10/310532

Inventors:

Gareth Geoffrey Hougham - Ossining NY, US
S. Jay Chey - Ossining NY, US
James Patrick Doyle - Bronx NY, US
Xiao Hu Liu - Croton On Hudson NY, US
Christopher V. Jahnes - Upper Saddle River NJ, US
Paul Alfred Lauro - Brewster NY, US
Nancy C. LaBianca - Yalesville CT, US
Michael J. Rooks - Briarcliff Manor NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 21/302
B32B 5/22
G02B 26/00

US Classification:

257747, 257758, 257E2308, 257E23128, 4283179, 359291

Abstract:

A Negative Thermal Expansion system (NTEs) device for TCE compensation or CTE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging. One aspect of the present invention provides a method for fabricating micromachine devices that have negative thermal expansion coefficients that can be made into a composite for manipulation of the TCE of the material. These devices and composites made with these devices are in the categories of materials called “smart materials” or “responsive materials. ” Another aspect of the present invention provides microdevices comprised of dual opposed bilayers of material where the two bilayers are attached to one another at the peripheral edges only, and where the bilayers themselves are at a minimum stress conditions at a reference temperature defined by the temperature at which the bilayers are formed. These devices have the technologically useful property of volumetrically expanding upon lowering of the device temperature below the reference or processing temperature.

US Patent:

7491965, Feb 17, 2009

Filed:

May 28, 2008

Appl. No.:

12/127994

Inventors:

James P. Doyle - Bronx NY, US
Bruce G. Elmegreen - Golden Bridge NY, US
Lia Krusin-Elbaum - Dobbs Ferry NY, US
Chung Hon Lam - Peekskill NY, US
Xiao Hu Liu - Briarcliff Manor NY, US
Dennis M. Newns - Yorktown Heights NY, US
Christy S. Tyberg - Mahopac NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 47/00

US Classification:

257 4, 257209, 257529, 257E2917

Abstract:

An electrically re-programmable fuse (eFUSE) device for use in integrated circuit devices includes an elongated heater element, an electrically insulating liner surrounding an outer surface of the elongated heater element, corresponding to a longitudinal axis thereof, leaving opposing ends of the elongated heater element in electrical contact with first and second heater electrodes. A phase change material (PCM) surrounds a portion of an outer surface of the electrically insulating liner, a thermally and electrically insulating layer surrounds an outer surface of the PCM, with first and second fuse electrodes in electrical contact with opposing ends of the PCM. The PCM is encapsulated within the electrically insulating liner, the thermally and electrically insulating layer, and the first and second fuse electrodes.

US Patent:

7556979, Jul 7, 2009

Filed:

Oct 31, 2007

Appl. No.:

11/932385

Inventors:

Gareth Geoffrey Hougham - Ossining NY, US
S. Jay Chey - Ossining NY, US
James Patrick Doyle - Bronx NY, US
Xiao Hu Liu - Croton On Hudson NY, US
Christopher V. Jahnes - Upper Saddle River NJ, US
Paul Alfred Lauro - Brewster NY, US
Nancy C. LaBianca - Yalesville CT, US
Michael J. Rooks - Briarcliff Manor NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 21/00

US Classification:

438 53, 257E21254, 257E27008

Abstract:

A Negative Thermal Expansion system (NTEs) device for TCE compensation or CTE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging. One aspect of the present invention provides a method for fabricating micromachine devices that have negative thermal expansion coefficients that can be made into a composite for manipulation of the TCE of the material. These devices and composites made with these devices are in the categories of materials called “smart materials” or “responsive materials. ” Another aspect of the present invention provides microdevices comprised of dual opposed bilayers of material where the two bilayers are attached to one another at the peripheral edges only, and where the bilayers themselves are at a minimum stress conditions at a reference temperature defined by the temperature at which the bilayers are formed. These devices have the technologically useful property of volumetrically expanding upon lowering of the device temperature below the reference or processing temperature.

US Patent:

7579069, Aug 25, 2009

Filed:

Nov 6, 2003

Appl. No.:

10/702280

Inventors:

Gareth Geoffrey Hougham - Ossining NY, US
Xiao Hu Liu - Croton On Hudson NY, US
S. Jay Chey - Ossining NY, US
James Patrick Doyle - Bronx NY, US
Joseph Zinter, Jr. - Brewster NY, US
Michael J. Rooks - Briarcliff Manor NY, US
Brian Richard Sundlof - Beacon NY, US
Jon Alfred Casey - Poughkeepsie NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B32B 15/02

US Classification:

4283133, 4283134, 4283139, 428570, 252512

Abstract:

A negative coefficient of thermal expansion particle includes a first bilayer having a first bilayer inner layer and a first bilayer outer layer, and a second bilayer having a second bilayer inner layer and a second bilayer outer layer. The first and second bilayers are joined together along perimeters of the first and second bilayer outer layers and first and second bilayer inner layers, respectively. The first bilayer inner layer and the second bilayer inner layer are made of a first material and the first bilayer outer layer and the second bilayer outer layer are made of a second material. The first material has a greater coefficient of thermal expansion than that of the second material.

US Patent:

7582670, Sep 1, 2009

Filed:

Apr 13, 2005

Appl. No.:

11/104422

Inventors:

Longgui Wang - Flushing NY, US
Xiao Mei Liu - Flushing NY, US
Lian Mo - Palo Alto CA, US
Simon K. Mencher - New York NY, US

Assignee:

Natrogen Therapeutics, Inc. - Milwaukee WI

International Classification:

A61K 31/40
A61K 31/404
A61K 31/56

US Classification:

514414, 514415, 514416, 514406, 514171, 51425409, 514570, 514159

Abstract:

The invention relates to pharmaceutical compositions and methods of treating inflammatory-related diseases associated with pro-inflammatory cytokine expression and/or reduced expression of anti-inflammatory cytokines. The method typically comprises administration of one or more compounds selected from isoindigo, indigo, indirubin, or derivatives thereof, such as, Meisoindigo and NATURA. Preferably the pharmaceutical composition comprises one or more compounds selected from isoindigo, indigo, indirubin, or derivatives thereof, an anti-inflammatory agent, and a pharmaceutically acceptable carrier.