Xiao Y Lu

US Patent:

20190206821, Jul 4, 2019

Filed:

Dec 29, 2017

Appl. No.:

15/859313

Inventors:

- Santa Clara CA, US
Amram EITAN - Scottsdale AZ, US
Xiao LU - Chandler AZ, US

International Classification:

H01L 23/00

Abstract:

Apparatuses, systems, and methods associated with spacer elements for maintaining a distance between a substrate and component during reflow are disclosed herein. In embodiments, a substrate assembly may include a substrate and a component. The component may be coupled to the substrate via a solder joint, wherein the solder joint may include a spacer element and solder, the spacer element to maintain a distance between the substrate and the component. Other embodiments may be described and/or claimed.

US Patent:

20170290211, Oct 5, 2017

Filed:

Apr 1, 2016

Appl. No.:

15/089297

Inventors:

- SANTA CLARA CA, US
XIAO LU - Chandler AZ, US
JIMIN YAO - Chandler AZ, US

Assignee:

INTEL CORPORATION - SANTA CLARA CA

International Classification:

H05K 13/04
H05K 13/02

Abstract:

Templates to arrange and/or align components for batch placement on a substrate are described. A batch placement template can include a number of detents physically arranged relative to each other corresponding to a physical arrangement of components to be placed on a substrate. The detents can be sized to allow components to be manipulated into the detents and subsequently picked and placed on the substrate in a batch process.

US Patent:

20170181339, Jun 22, 2017

Filed:

Dec 18, 2015

Appl. No.:

14/974113

Inventors:

- Santa Clara CA, US
Pramod Malatkar - Chandler AZ, US
Xiao Lu - Chandler AZ, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H05K 13/04
H05K 3/30

Abstract:

A method of assembly comprising providing an assembly probe, the assembly probe having an end coupling face; providing a droplet of fluid on the end coupling face of the assembly probe; coupling an electronic component to the end coupling face of the assembly probe with the fluid droplet, the electronic component having a peripheral dimension equal to or less than 2 mm in each of length, width and height; placing the electronic component on a substrate with the assembly probe; decoupling the electronic component from the end coupling face of the assembly probe; and assembling the electronic component to the substrate.

Address:

2349 Stuart St, Brooklyn, NY 11229

VIN:

2HNYD28397H519856

Make:

ACURA

Model:

MDX

Year:

2007