- Santa Clara CA, US Amram EITAN - Scottsdale AZ, US Xiao LU - Chandler AZ, US
International Classification:
H01L 23/00
Abstract:
Apparatuses, systems, and methods associated with spacer elements for maintaining a distance between a substrate and component during reflow are disclosed herein. In embodiments, a substrate assembly may include a substrate and a component. The component may be coupled to the substrate via a solder joint, wherein the solder joint may include a spacer element and solder, the spacer element to maintain a distance between the substrate and the component. Other embodiments may be described and/or claimed.
- SANTA CLARA CA, US XIAO LU - Chandler AZ, US JIMIN YAO - Chandler AZ, US
Assignee:
INTEL CORPORATION - SANTA CLARA CA
International Classification:
H05K 13/04 H05K 13/02
Abstract:
Templates to arrange and/or align components for batch placement on a substrate are described. A batch placement template can include a number of detents physically arranged relative to each other corresponding to a physical arrangement of components to be placed on a substrate. The detents can be sized to allow components to be manipulated into the detents and subsequently picked and placed on the substrate in a batch process.
Assembly Probe Utlizing A Fluid To Assemble Components And Systems And Methods Of Use Thereof
- Santa Clara CA, US Pramod Malatkar - Chandler AZ, US Xiao Lu - Chandler AZ, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H05K 13/04 H05K 3/30
Abstract:
A method of assembly comprising providing an assembly probe, the assembly probe having an end coupling face; providing a droplet of fluid on the end coupling face of the assembly probe; coupling an electronic component to the end coupling face of the assembly probe with the fluid droplet, the electronic component having a peripheral dimension equal to or less than 2 mm in each of length, width and height; placing the electronic component on a substrate with the assembly probe; decoupling the electronic component from the end coupling face of the assembly probe; and assembling the electronic component to the substrate.
Aug 2013 to 2000 Market AssociateFOOD NETWORK FORECAST MODELING CONSULTING PROJECT New York, NY Jun 2013 to Aug 2013 Marketing InternFOOD NETWORK FORECAST MODELING CONSULTING PROJECT New York, NY May 2013 to Aug 2013 ConsultantPINGHU XINMIAO HARDWARE FACTORY
2008 to 2012 Marketing AssociateNINGBO BAOHENG BMW 4S SHOP Ningbo, CN Jun 2009 to Jun 2009 Summit intern
Education:
FORDHAM UNIVERSITY, GRADUATE SCHOOL OF BUSINESS New York, NY 2012 to 2013 MS in Marketing Intelligence
Mar 2014 to 2000 AssociateStructured FX Product Control Singapore Sep 2011 to Mar 2014 Associate
Education:
Tepper School of Business, Carnegie Mellon University May 2011 to Jun 2011 Certificate in Computational FinanceNanyang Business School, Nanyang Technological University Singapore Aug 2010 to Jun 2011 Master of Financial in engineeringSchool of Finance, Renmin University of China Sep 2006 to Jul 2010 Bachelor of Finance
Jun 2008 to 2000 ManagerHunterdon Home Health Agency Hunterdon, NJ, US Mar 2011 to May 2011Robert Wood Johnson University Hospital New Brunswick, NJ, CA Jan 2011 to Mar 2011 Senior Leadership Clinical/ PediatricsSummit Oaks Hospital Summit, NJ Oct 2010 to Dec 2010Regency Jewish Heritage Nursing Somerset, MB Sep 2010 to Oct 2010Saint Peters University Hospital New Brunswick, NJ, CA Mar 2010 to May 2010Saint Peters University Hospital New Brunswick, NJ, CA Jan 2010 to Mar 2010Overlook Hospital Summit, NJ Sep 2009 to Dec 2009China King Chinese Food Restaurant Haddonfield, NJ Jun 2004 to May 2008 Receptionist/Cashier
Education:
The State University of New Jersey, College of Nursing New Brunswick, NJ Jan 2011 Bachelor of Science