Xiaojia J Lu

US Patent:

56375212, Jun 10, 1997

Filed:

Jun 14, 1996

Appl. No.:

8/665138

Inventors:

David L. Rhodes - Brick NJ
Xiaojia J. Lu - Nutley NJ
Dwight L. Woolard - Neptune NJ

Assignee:

The United States of America as represented by the Secretary of the Army - Washington DC

International Classification:

H01L 21283

US Classification:

438619

Abstract:

A method of using layers of gold metallization and a thick film coating of photo-sensitive material to form an air-filled microwave waveguide structure on the outer surface of a semiconductor body, such as a monolithic microwave integrated circuit commonly referred to as an MMIC, so that the waveguide can be coupled to the active and passive devices of the MMIC. First, a patterned metallization layer is formed on a substrate. A mold of a waveguide is fabricated by masking and then etching another metallization layer. The mold is turned over face down on the patterned metallization layer and bonded to the patterned metallization layer, Then, any unnecessary material is etched away.