Yet Zen Liu

US Patent:

20030094688, May 22, 2003

Filed:

Oct 19, 2001

Appl. No.:

09/991290

Inventors:

Kirit Dharia - Thousand Oaks CA, US
Robert Franks I - Thousand Oaks CA, US
Ivair Gontijo - Los Angeles CA, US
Gary Gutierrez - Newbury Park CA, US
Dino Mensa - Ventura CA, US
Yet Liu - Westlake Village CA, US
Ruai Yu - Newbury Park CA, US

International Classification:

H01L023/053

US Classification:

257/701000

Abstract:

A method and system for photodetector packaging system is provided with a insulating substrate having a shoulder section and a wire bond is used for coupling the photodetector to the insulating substrate at the shoulder section. The system includes an optical fiber that directs incident light directly to the photodetector. Also provided is a method and system for packaging photodetectors with a insulating substrate using conducting vias and a wire bond to couple the photodetector to the insulating substrate. The system includes conducting tabs that are coupled to the conducting vias. The metal tabs are coupled with a transimpedance amplifier by wire bonds and the transimpedance amplifier is coupled to a limiting amplifier by wire bonds.